JPS62204877A - Apparatus for applying high viscosity resin solution - Google Patents
Apparatus for applying high viscosity resin solutionInfo
- Publication number
- JPS62204877A JPS62204877A JP4529986A JP4529986A JPS62204877A JP S62204877 A JPS62204877 A JP S62204877A JP 4529986 A JP4529986 A JP 4529986A JP 4529986 A JP4529986 A JP 4529986A JP S62204877 A JPS62204877 A JP S62204877A
- Authority
- JP
- Japan
- Prior art keywords
- resin solution
- tank
- supply pipe
- cooling tank
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 75
- 239000011347 resin Substances 0.000 title claims abstract description 75
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 239000002826 coolant Substances 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- -1 resist Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は高粘度樹脂溶液の塗布装置に係シ、特にＩＣ、
ＬＳ Ｉ等の半導体装置の製造工程において、レジスト
、ポリイミド、シリコン樹脂等の樹脂の高粘度溶液をＳ
ｉウェハ上に塗布する装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a coating device for high viscosity resin solution, particularly for IC,
In the manufacturing process of semiconductor devices such as LSI, high viscosity solutions of resins such as resist, polyimide, silicone resin, etc.
The present invention relates to an apparatus for coating onto i-wafers.
半導体装置製造の多層配線工程において、ブロッキング
＠あるいはパッシベーション膜等の絶縁膜を積層、パタ
ーニングして形成する為に、ポリイミド、シリコン樹脂
あるいはレジスト等の高粘度樹脂溶液（以後、樹脂溶液
と略称する）をＳｉウェハ上に塗布する必要がある。こ
こにおいて量産性及び高密度化の追求から、樹脂溶液を
無駄なく、しかも均一に塗布することが要求される。In the multilayer wiring process of semiconductor device manufacturing, high viscosity resin solutions such as polyimide, silicone resin, or resist (hereinafter abbreviated as resin solutions) are used to stack and pattern insulating films such as blocking@ or passivation films. It is necessary to apply this on a Si wafer. In pursuit of mass productivity and high density, it is required to uniformly apply the resin solution without waste.
以下、第２図に基き従来の高粘度樹脂溶液の塗布装置に
ついて説明する。同図（ａ）は第１の従来例を示すもの
であり、ラインに樹脂溶液を送り出す為に加圧窒素を用
いた例である。同図において、矢印Ａの方向から加圧ガ
ス供給パイプ４を通して２〜３気圧程度の加圧窒素が加
圧容器ｚ内に送給される為、この加圧容器２内に置かれ
た樹脂溶液Ｉトル３から樹脂溶液８が押し出され、樹脂
溶液供給パイプ４ａを通って高粘度用のノズル７からウ
ェハ（図示せず）上に滴下される。なお、１は加圧窒素
の圧力調整用のバルブ、また５、６は上記樹脂溶液供給
、ｅイブ４ａに挿設されているストップバルブ及びサッ
クバックダイヤプラムで１）、夫々樹脂溶液塗布のＯＮ
、ＯＦＦ制御、及びＯＦＦ時のゼタ落ち防止の為の樹
脂溶液８の引き戻しに用いる。Hereinafter, a conventional coating apparatus for a high viscosity resin solution will be explained based on FIG. FIG. 5A shows a first conventional example, in which pressurized nitrogen is used to send the resin solution to the line. In the figure, pressurized nitrogen of about 2 to 3 atmospheres is fed into the pressurized container z from the direction of arrow A through the pressurized gas supply pipe 4, so that the resin solution placed in the pressurized container 2 A resin solution 8 is extruded from the I-torque 3, passes through a resin solution supply pipe 4a, and is dripped onto a wafer (not shown) from a nozzle 7 for high viscosity. Note that 1 is a valve for adjusting the pressure of pressurized nitrogen, and 5 and 6 are a stop valve and a suck back diaphragm inserted in the resin solution supply, e-build 4a, respectively.
, for OFF control, and for pulling back the resin solution 8 to prevent zeta from falling when OFF.
同図（ｂ）は第２の従来例を示すものであり、樹脂溶液
８の送給にポンプ手段を用いた例である。図中、同図（
ａ）との相当個所には同一符号を付しである。同図にお
いて、第１の供給パイプ４ｂに挿設された第１のポンプ
手段１１の駆動の基に、ケミカルゼッグス１２中に配置
された樹脂溶液セトル３から吸い上げられた樹脂溶液８
は、フィルタ１０を通って一旦サブタンク９内に導かれ
る。そして樹脂溶液吐出時には、第２の供給パイプ４Ｃ
に挿設された第２のポンプ手［１１ａの駆動によシ、樹
脂溶液８はストップバルブ５及びサックバックダイヤフ
ラム６を通してノズル７から吐出される。FIG. 2B shows a second conventional example, in which a pump means is used to feed the resin solution 8. In the figure, the same figure (
Parts corresponding to those in a) are given the same reference numerals. In the figure, a resin solution 8 is drawn up from a resin solution settler 3 placed in a chemical zeggs 12 under the drive of a first pump means 11 inserted into a first supply pipe 4b.
is once introduced into the sub-tank 9 through the filter 10. When discharging the resin solution, the second supply pipe 4C
The resin solution 8 is discharged from the nozzle 7 through the stop valve 5 and the suck-back diaphragm 6 by driving the second pump hand [11a inserted therein.
この第２の従来例によればサブタンク９を備えている為
、フィルタ１０を通して得られるクリーンな樹脂溶液８
を塗布前に予めこのサブタンク９に貯めておき、希望量
（通常は２〜７ ｃｃ ）を希望時間内（通常は１〜３
秒）にウエノ・（図示せず）上に供給することができる
。According to this second conventional example, since the sub-tank 9 is provided, a clean resin solution 8 obtained through the filter 10 can be obtained.
is stored in this sub-tank 9 in advance before application, and the desired amount (usually 2 to 7 cc) is dispensed within the desired time (usually 1 to 3 cc).
(seconds) can be fed onto Ueno (not shown).
しかしながら、上述した第１の従来例においては、
（１）高粘度の樹脂溶液（５００〜１０００ ｃｐ以上
）８をラインに押し出す為には、２〜３気圧のかなシの
圧力を要し、またフィルタを入れると吐出速度が遅くな
シ希望量を希望時間内にてウエノ・上に供給することが
困難となる。However, in the first conventional example described above, (1) a pressure of 2 to 3 atmospheres is required to push the high viscosity resin solution (500 to 1000 cp or more) 8 into the line; If a filter is included, the ejection speed will be slow and it will be difficult to supply the desired amount onto the wafer within the desired time.
（２）加圧窒素を用いているので１．加圧容器２中で窒
素が樹脂溶液に溶は込み、この為ノズル７付近で圧力が
下がった時に気泡となって出てきてしまう。(2) Pressurized nitrogen is used, so 1. Nitrogen dissolves into the resin solution in the pressurized container 2, and therefore comes out as bubbles when the pressure decreases near the nozzle 7.
（３）半導体装置の製造に用いられる樹脂溶液は、室温
では粘度が変化し硬化や劣化が生ずるので長時間放置す
ることは出来ない。この為、一旦ラインに入れられたも
のは次回（例えば、３〜４日から１週間程匪）に塗布す
る時には使用できず、塗布の度にラインの容量分の樹脂
溶液（通常は５００ｍｊ！程度）が無駄となり極めて不
経済である。(3) Resin solutions used in the manufacture of semiconductor devices cannot be left standing for long periods of time because their viscosity changes at room temperature, resulting in hardening and deterioration. For this reason, once it is placed in the line, it cannot be used the next time (for example, from 3 to 4 days to a week), and each time the resin solution is applied, the volume of the line is filled with resin solution (usually about 500mJ!) ) is wasted and is extremely uneconomical.
等の問題がある、
第２の従来例は、上記（１）及び（２）の問題を解消す
るものであるが、（３）の問題を解消することは構成上
困難である。The second conventional example solves the problems (1) and (2) above, but it is difficult to solve the problem (3) due to the structure.
従って、本発明は上記（３）の問題をも解消し塗布工程
でのコスト低減化を実現した高粘度樹脂溶液の塗布装置
を提供することを目的とする。Therefore, it is an object of the present invention to provide a high viscosity resin solution coating apparatus which solves the problem (3) above and realizes cost reduction in the coating process.
本発明に係る高粘度樹脂溶液の塗布装置は、樹脂溶液ｙ
Ｎ）ル、供給パイプ、ポンプ手段、フィルタ及び樹脂溶
液を一旦貯える為のサブタンク等の樹脂溶液供給ライン
の主要部を冷却槽中に納めると共に、この冷却槽外のラ
インを、冷却されて送給される樹脂溶液を所定温度に戻
す為の恒温槽に通すよう構成するものである。The high viscosity resin solution coating device according to the present invention includes a resin solution y
N) The main parts of the resin solution supply line, such as the tube, supply pipe, pump means, filter, and sub-tank for temporarily storing the resin solution, are housed in the cooling tank, and the lines outside the cooling tank are cooled and fed. The resin solution is passed through a constant temperature bath to return it to a predetermined temperature.
以上のように、本発明によれば、樹脂溶液供給ラインの
主要部を冷却槽内に納めるようにしたので、槽内におい
て樹脂溶液の粘度変化が抑制され、この為長時間に渡る
保管が可能となる。As described above, according to the present invention, the main part of the resin solution supply line is housed in the cooling tank, so changes in the viscosity of the resin solution in the tank are suppressed, and therefore, it can be stored for a long time. becomes.
また、冷却槽外のラインを恒温槽に通すようにしている
ので、樹脂溶液吐出時ラインに送給されてくる樹脂溶液
は所定温度に戻され且つ温匿制御される為、吐出される
樹脂溶液の粘度は略一定に保たれる。In addition, since the line outside the cooling tank is passed through the constant temperature bath, the resin solution that is fed into the line when discharging the resin solution is returned to a predetermined temperature and temperature controlled, so the resin solution that is discharged is The viscosity of is kept approximately constant.
以下第１図に基き、本発明の一実施例を詳細に説明する
。同図において、１３は樹脂溶液１８の入っている樹脂
溶液ボトル、２１は第１のポンプ手段であり、第１の供
給パイプ１４ｔ−通して樹脂溶液ゼトル１３から樹脂溶
液１８をサブタンク１９に送給する。２０は第１の供給
パイプ１４に挿設されているフィルタである。まｆｃ２
１ａは第２のポンプ手段であシ、サブタンク１９内に貯
えられているクリーンな樹脂溶液１８を第２の供給パイ
プ１４ａへと送給する。An embodiment of the present invention will be described in detail below with reference to FIG. In the figure, 13 is a resin solution bottle containing the resin solution 18, and 21 is a first pump means, which supplies the resin solution 18 from the resin solution trough 13 to the sub-tank 19 through the first supply pipe 14t. do. 20 is a filter inserted into the first supply pipe 14. Mafc2
1a is a second pump means, which feeds the clean resin solution 18 stored in the sub-tank 19 to the second supply pipe 14a.
そして、樹脂溶液供給ライン３０の一部を構成する上記
樹脂溶液ｙＮ）ル１３、第１の供給パイプ１４、第１の
ポンプ手［２１、フィルタ２０、サブタンク１９、第２
のポンプ手段２１ａ及び一部の第２の供給パイプ１４ａ
は冷却槽２３中に納められている。２６はこの冷却槽２
３中に配設された冷却用フィンコイルで、圧縮されたフ
ロンガス（商品名）１−供給する外部の冷媒用コンプレ
ッサ２８とはガス供給／’？イブ２９を介してつながれ
ている。これら冷却用フィンコイル２６、冷媒用コンプ
レッサ２８及びガス供給パイプ２９によシ冷却手［３１
が構成される。また２７は攪拌用ファンから成る攪拌手
攻で、冷却槽２３の側壁部に付設されている。上記構成
の基に冷却槽２３内は、樹脂溶液１８の粘度変化が起こ
らない０〜１０℃程度の温度に維持されている。The resin solution supply line 13, the first supply pipe 14, the first pump hand [21], the filter 20, the sub-tank 19, the second
pump means 21a and a portion of the second supply pipe 14a
is housed in a cooling tank 23. 26 is this cooling tank 2
The external refrigerant compressor 28 that supplies compressed Freon gas (product name) 1 with a cooling fin coil disposed in the cooling fin coil is a gas supply/'? They are connected via Eve 29. The cooling fin coil 26, the refrigerant compressor 28, and the gas supply pipe 29 are connected to the cooling hand [31
is configured. Further, numeral 27 is a stirring hand made of a stirring fan, and is attached to the side wall of the cooling tank 23. Based on the above configuration, the inside of the cooling tank 23 is maintained at a temperature of about 0 to 10° C. at which the viscosity of the resin solution 18 does not change.
セして１４ｂは、冷却槽２３外へと配設される第２の供
給パイプ１４ａの一部を成すコイル状パイプ、１５．１
６は夫々第２の供給パイプ１４ａに挿設されるストップ
バルブ及びサックバックダイヤフラムであシ、１７は樹
脂溶液吐出用のノズルである。樹脂溶液供給ライン３０
は、これら各構成要素と上述した冷却槽２３内の構成要
素とにより構成されている。14b is a coiled pipe forming a part of the second supply pipe 14a disposed outside the cooling tank 23, and 15.1
6 is a stop valve and a suck-back diaphragm which are respectively inserted into the second supply pipe 14a, and 17 is a nozzle for discharging the resin solution. Resin solution supply line 30
is constituted by each of these components and the components in the cooling tank 23 described above.
また上記コイル状パイプ１４ｂはＳＵＳ製、内径０．４
ｍ以下、長さ２ｍ以上として構成され、図示する如く
恒温水槽から成る恒温槽２４中に配置されている。そし
て恒温水槽２４は、カールニクス（商品名）から成る熱
交換器２５の作用で、２２〜２３℃程直の設定温度に保
たれた温水が矢印のように循環する為、槽内温直は設定
温度の±１℃以内に制御されている。The coiled pipe 14b is made of SUS and has an inner diameter of 0.4
2 m or more in length, and is arranged in a constant temperature bath 24 consisting of a constant temperature water bath as shown in the figure. In the constant temperature water tank 24, hot water kept at a set temperature of 22 to 23 degrees Celsius is circulated as shown by the arrow by the action of a heat exchanger 25 made of Carlnix (trade name), so the temperature inside the tank is constant. The temperature is controlled within ±1℃ of the set temperature.
以上の装置構成によシ、ノズル１７付近の樹脂溶液１８
は設定温度の±１℃以内に制御され、略一定の粘度を以
って吐出される。また塗布作業後、廃棄を要する樹脂溶
液量は、樹脂溶液供給ライン３０のうち冷却槽２３外の
ラインの容量分の３０−程度となシ、従来の”／１０以
下に抑えられる。Due to the above device configuration, the resin solution 18 near the nozzle 17
is controlled within ±1° C. of the set temperature, and is discharged with a substantially constant viscosity. Further, the amount of resin solution that needs to be discarded after the coating operation is about 30 - the capacity of the line outside the cooling tank 23 in the resin solution supply line 30, and can be suppressed to less than 1/10 of the conventional amount.
次に、上記構成の装置を用いた樹脂溶液の塗布方法につ
いて説明する。まず冷却ガス供給部３１において冷媒用
コンプレッサ２８で圧縮されたフロンガスは、ガス供給
パイゾ２９ｔ−通シ冷却用コイル２６で断熱膨張して冷
却する為、冷却槽２３内にて熱が奪れ、攪拌用ファン２
７０作用によシ槽内の温度は０〜１０℃程度に保たれる
。また樹脂溶液供給ライン３０においては、冷却槽２３
内にて第１のポンプ手段２１の駆動（圧力２〜１０Ｖ−
程度）によシ、樹脂溶液ボトル１３から冷却された樹脂
溶液１８が第１の供給パイプへ送給され、フィルタ２０
を通してサブタンク１９内に一旦貯えられる。Next, a method of applying a resin solution using the apparatus configured as described above will be explained. First, in the cooling gas supply unit 31, the fluorocarbon gas compressed by the refrigerant compressor 28 is adiabatically expanded and cooled by the gas supply pizo 29t-through-cooling coil 26, so heat is removed in the cooling tank 23 and stirred. fan 2
The temperature inside the tank is maintained at about 0 to 10°C by the action of 70°C. In addition, in the resin solution supply line 30, the cooling tank 23
Drive of the first pump means 21 (pressure 2 to 10 V-
degree), the cooled resin solution 18 is fed from the resin solution bottle 13 to the first supply pipe, and the filter 20
The water is temporarily stored in the sub-tank 19 through the water.
そして樹脂溶液吐出時には、第２のポンプ手段の駆動（
圧力２〜１０ Ｋｇ／ｃｄ程度）にニジクリーンな冷却
樹脂溶液１８がサブタンク１９から第２の供給パイプ１
４ａへと送給される。この後、冷却槽２３外の恒温水槽
２４中に配置されるコイル状パイプ１４ｂを通ることに
よシ、樹脂溶液１８は２２〜２３℃程度の室温に戻され
る。そしてストップバルブ１５のＯＮ、ＯＦＦ制御によ
シ、略一定粘度の樹脂溶液１８はサックバックダイヤプ
ラム１６を通して１〜３秒程度の所定時間内に２〜７
ｃｃ程度の所定量を以ってノズル１７先端からウェハ（
図示せず）上へと吐出される。When discharging the resin solution, the second pump means is driven (
The cooled resin solution 18 is supplied from the sub-tank 19 to the second supply pipe 1 at a pressure of about 2 to 10 Kg/cd).
4a. Thereafter, the resin solution 18 is returned to room temperature of about 22 to 23° C. by passing through the coiled pipe 14b arranged in the constant temperature water tank 24 outside the cooling tank 23. Then, by ON/OFF control of the stop valve 15, the resin solution 18 having a substantially constant viscosity is passed through the suckback diaphragm 16 within a predetermined time of about 1 to 3 seconds.
The wafer (
(not shown).
なお装置のメインテナンスの都合上、使用後は冷却槽２
３外の樹脂溶液供給ライン３０に溶剤として、例えばア
セトンを流し込んで洗浄処理を施すようにすることが好
ましい。For equipment maintenance reasons, the cooling tank 2 should be removed after use.
It is preferable to perform the cleaning treatment by pouring acetone, for example, as a solvent into the resin solution supply line 30 outside of the resin solution supply line 30.
以上詳細に説明したように、本発明によれば、樹脂溶液
供給ラインの主要部を冷却槽中に納め、樹脂溶液を低温
保管するようにしたので、塗布処理後、廃棄の対象とな
る樹脂溶液は冷却槽外のラインの容量公文となシ、この
為塗布工程での経済化が図れるという効果がある。As explained in detail above, according to the present invention, the main part of the resin solution supply line is housed in a cooling tank and the resin solution is stored at low temperature. The capacity of the line outside the cooling tank is small, which has the effect of making the coating process more economical.
また樹脂溶液の低温保管から樹脂溶液の硬化や劣化が抑
制され、少量となった蒔に補充すれば済むので取シ換え
の手間が省は省力化できるという効果がある。In addition, hardening and deterioration of the resin solution is suppressed by storing the resin solution at a low temperature, and since only a small amount of seedlings needs to be replenished, there is an effect that labor and effort for replacement can be saved.
Claims (1)
して樹脂溶液を吐出させる高粘度樹脂溶液の塗布装置に
おいて、上記樹脂溶液供給ラインのうち、第１のポンプ
手段の挿設された第１の供給パイプでつながれる樹脂溶
液ボトルからサブタンクまでの部分と、このサブタンク
から樹脂溶液を外部へ送給する第２のポンプ手段の挿設
された第２の供給パイプの部分とを冷却槽内に収めると
共に、この冷却槽外へと延長せる上記第２の供給パイプ
を恒温槽を通すように構成したことを特徴とする高粘度
樹脂溶液の塗布装置。(1) In a high viscosity resin solution coating device that discharges a resin solution through a resin solution supply line by driving a pump means, a first supply pipe in which a first pump means is inserted in the resin solution supply line; The part from the resin solution bottle connected to the sub-tank and the part of the second supply pipe into which the second pump means for feeding the resin solution from the sub-tank to the outside are inserted in the cooling tank, and A high viscosity resin solution coating apparatus characterized in that the second supply pipe extending outside the cooling tank is configured to pass through a constant temperature tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4529986A JPS62204877A (en) | 1986-03-04 | 1986-03-04 | Apparatus for applying high viscosity resin solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4529986A JPS62204877A (en) | 1986-03-04 | 1986-03-04 | Apparatus for applying high viscosity resin solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204877A true JPS62204877A (en) | 1987-09-09 |
Family
ID=12715435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4529986A Pending JPS62204877A (en) | 1986-03-04 | 1986-03-04 | Apparatus for applying high viscosity resin solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204877A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299335A (en) * | 1987-05-29 | 1988-12-06 | Tokyo Electron Ltd | Resist coater |
| JPH0194620A (en) * | 1987-10-06 | 1989-04-13 | Mitsubishi Electric Corp | Spin applicator |
| JPH0273356A (en) * | 1988-09-09 | 1990-03-13 | Fujitsu Ltd | Method and device for applying resist |
| JPH03154670A (en) * | 1989-11-07 | 1991-07-02 | Technadyne Eng Corp | Heat sealing system for thermosetting material |
| US9086190B2 (en) | 2010-05-06 | 2015-07-21 | Tokyo Electron Limited | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus |
-
1986
- 1986-03-04 JP JP4529986A patent/JPS62204877A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63299335A (en) * | 1987-05-29 | 1988-12-06 | Tokyo Electron Ltd | Resist coater |
| JPH0194620A (en) * | 1987-10-06 | 1989-04-13 | Mitsubishi Electric Corp | Spin applicator |
| JPH0273356A (en) * | 1988-09-09 | 1990-03-13 | Fujitsu Ltd | Method and device for applying resist |
| JPH03154670A (en) * | 1989-11-07 | 1991-07-02 | Technadyne Eng Corp | Heat sealing system for thermosetting material |
| US9086190B2 (en) | 2010-05-06 | 2015-07-21 | Tokyo Electron Limited | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus |
| US10035173B2 (en) | 2010-05-06 | 2018-07-31 | Tokyo Electron Limited | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus |
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