JPS6220395A - Manufacture of printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Required] This is an improvement in the manufacturing method of a printed circuit board, in which a removing liquid is sprayed on both the upper and lower surfaces of a printed circuit board forming board, and when etching both surfaces into a predetermined pattern, this The temperature of the removal liquid sprayed onto the upper surface of the printed circuit board forming board is higher than the temperature of the removing liquid sprayed onto the lower surface of the printed circuit board forming board, and the resist film provided on both the upper and lower surfaces of the printed circuit board forming board; Alternatively, the etching rate of a film such as copper foil may be made uniform.

(Field of application in industry) The present invention relates to a method of manufacturing a printed circuit board, and in particular, when a printed circuit board forming board is formed by etching, resist films or copper The present invention relates to a method for manufacturing a printed circuit board in which a film such as a foil is etched at a uniform etching speed.

Print-based processing, which mounts electronic components such as IC1L and SI to form electronic circuits, is used in the manufacture of many electronic devices.

Among these printed circuit boards, multilayer structure printed circuit board I.
When forming a board for forming a printed circuit board, such as an inner layer material used when forming a board, by etching, it is necessary to ensure that the coating such as copper foil or resist film provided on both the upper and lower surfaces of the forming board is uniform. There is a need for a method that can perform etching at high etching speeds.

[Conventional technology]

When manufacturing a printed circuit board with a multilayer structure, the upper and lower surfaces of the inner layer material, which is made of a resin plate with circuit patterns formed on both sides, are
Copper foil is placed across a resin adhesive sheet [.], and the adhesive sheet [. An inner layer +4 is provided inside the copper foil F through an adhesive sheet to form a printed circuit board with a multilayer structure.

Conventionally, in order to form such an inner layer material, as shown in FIG. After applying the resist 1 film 4A, 4B on both sides of the upper F of the resist 1 film 4A, 4B, the resist 1 film 4A, 4B of the resist 1- is exposed in a predetermined pattern.

1. The board 3 for forming a printed circuit board 3 is conveyed in the direction of arrow A using a rubber roller 5. A pressurizing pump 7 is used to transport this removal liquid from a tank 6 containing the C4 Lugist lint removal liquid, and a nozzle 8 transfers the removal liquid to Regis l-1.
*4A, 4B, ): The resist cavity in the unexposed area is removed by spraying.

Furthermore, as shown in Fig. 3, Regis l-1194A, 4B
After forming the printed circuit board 3 into a predetermined pattern, the printed circuit board forming board 3 is transported, and the etching solution for copper In2A and 2B contained in the tank 9 is pumped through the pressure pump 10 from the upper and lower surfaces of the printed circuit board forming board 3. The copper foils 2A and 2B are etched into a predetermined pattern using the patterned resist films 4A and 4B as masks.

[Problem that the invention seeks to solve]

By the way, the resist film removal solution sprayed onto the top surface of the printed circuit board forming board 3 or the removal solution such as a copper foil etching solution tends to stagnate on the top surface, whereas the removal solution sprayed onto the bottom surface of the printed circuit board forming board 3 tends to stagnate on the top surface. The liquid will always be supplied with new removal liquid and sprayed.

As a result, the etching speed of the resist film 4A and the copper foil 2A on the upper surface of the printed circuit board forming board 3 is slower than the etching speed of the resist film 4B and the copper foil 2R on the lower surface of the printed circuit board forming board 3. Foil 2A.

A problem arises in that the etching rates of 2B and the resist films 4^ and 4B are not uniform.

Therefore, conventionally, the pressure of the removing liquid injected onto the upper surface of the printed circuit board forming board 3 is made higher than the pressure of the removing liquid injected onto the lower surface of the printed circuit board forming board 3. Except for the phenomenon that the removal liquid stagnates on the two sides of the printed circuit board forming board 3 described above and the etching speed of that surface slows down, the copper foil 2A provided on the negative side of the printed circuit board forming board 3 can be removed. , and the etching speed of the resist film 4A were made to be uniform with the etching speed of the copper foil 2B placed on the lower surface of the printed circuit board forming board 3 and the resist film 4B.

However, this method of changing the pressure of the resist film removal solution, corrosive solution, and other removal liquids involves adjusting the opening and closing angle of the valve of the pressure pump for conveying the removal liquid, and the operation is not reliable. , Copper foil 2A using this method.

There is a problem of poor reproducibility in adjusting the etching speed of the resist film 2B and the etching speed of the resist films 4A and 4B.

[Means for solving problems]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a printed circuit board in which the removal speed of resist films and coatings such as copper foil provided on both sides of a printed circuit board forming board is uniform. .

FIG. 1 is a schematic diagram of an apparatus for carrying out the method of the present invention.
From the temperature of the removal liquid 22 sprayed onto the bottom surface of
7/Sl, 1 formed on the printed circuit board forming board 30! Etching is performed so that the etching speed of m4A, 4++ and copper foils 2A, 2H are uniform.

[Effect]

The method of the present invention includes 1. In J-culm C, the copper foil and resist film of the board for forming printed circuit boards are removed by co-soching with a different removal solution such as copper foil etching solution protection 2 and cyst film removal solution.
The temperature of the removal liquid sprayed onto one side of the printed circuit board forming board where the removal liquid tends to stagnate is made higher than the temperature of the removal liquid sprayed onto the F side of the printed circuit board forming board. This speeds up the etching speed of the copper foil and resist film on one side of the board and maintains a uniform etching speed of the copper foil and resist film on both sides of the board for forming printed circuit boards. It is.

[Actual example]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below using the drawings.

111th! ! I is a schematic diagram of the apparatus used in method 6 of the present invention, and as described above, 114 fat handling 1 -L do both sides copper foil 2
Δ, 2B are provided, and resist films 4A, 4B exposed in a predetermined pattern are provided on the -1, and the printed circuit board forming board 3 is formed. , 5: The print I/substrate forming plate 3 is conveyed along the direction indicated by the arrow using the C rubber roller 5. Furthermore, it is introduced from tank 6,
A resist film removing solution whose temperature has been raised by 1 in the heating tank 23 is sprayed onto the upper surface of the printed circuit board forming board 3 through the pressure pump 7A and the nozzle 21 and 1-2.

In this case, the removal liquid 22 is sprayed from the lower surface of the printed circuit board forming board 3 via the pressure pump 7B and the nozzle 8B.
is not heated, the temperature of the removal liquid 21 is lower than that of the removal liquid 22.
The temperature increases by [-]. Therefore, the etching speed of the resist film 4A on the two sides of the printed circuit board forming plate 3 becomes faster than the etching speed of the resist film 4B on the lower surface of the printed circuit board forming plate 3. liquid 2
Even if 1 is stagnated on the 4th surface of the substrate forming plate 3 to the print 1, the etching rate of 1/the cyst film 4A and the resist 1 e4B becomes uniform.

Here, the I'v removal liquid 21.22 marked L was described using the resist film removal liquid as an example, but the unsupplied removal liquid 21.22 is an etching liquid for etching the copper foils 2A and 2R. Also good.

〔Effect of the invention〕

As described in Section F below, according to the method of the present invention, a removal solution having a higher temperature is supplied to the soil surface side of the printed circuit board forming board where the etching rate is slower than the lower surface side. Since the etching speed of the film such as copper foil formed on the F side of the board and the film such as copper foil formed on the bottom surface of the board for forming printed circuit boards is uniform, pattern formation of the board for forming printed circuit boards is possible. This has the effect of making it easy to use and of high quality.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram for explaining the present invention in detail, and FIGS. 2 and 3 are schematic diagrams for explaining the conventional method. In the figure, 1 is a resin board, 2A and 2B are copper foils, 3 is a printed circuit board forming board, 4A and 4B are resist films, 5 is a roller, 6 is a tank, 7^ and 7B are pressure pumps, and 8A , 8B is a nozzle, 2
1.22 is a removal liquid, and 23 is a heating tank.

Claims (3)

[Claims] (1) Spray the removal liquid (21, 22) on both the upper and lower surfaces of the moving printed circuit board forming board (3) to remove the coating formed on both the upper and lower surfaces of the printed circuit board forming board (3) in a predetermined pattern. In the method of etching away the printed circuit board forming plate (3), the temperature of the removing liquid (21) sprayed onto the upper surface of the printed circuit board forming plate (3) is adjusted to 22) A method for manufacturing a printed circuit board, characterized in that the temperature is raised above the temperature described in 22). (2) The method for manufacturing a printed circuit board according to claim (1), wherein the film is a resist film (4A, 4B) or a conductive film (2A, 2B). (3) The removal liquid (21, 22) is a resist film removal liquid;
Alternatively, the method for manufacturing a printed circuit board according to claim (1), wherein the etching solution is an etching solution for a conductive film.