JPS62201783U - - Google Patents
Info
- Publication number
- JPS62201783U JPS62201783U JP1986090862U JP9086286U JPS62201783U JP S62201783 U JPS62201783 U JP S62201783U JP 1986090862 U JP1986090862 U JP 1986090862U JP 9086286 U JP9086286 U JP 9086286U JP S62201783 U JPS62201783 U JP S62201783U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- mask plate
- display
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090862U JPH0339819Y2 (US08197722-20120612-C00093.png) | 1986-06-13 | 1986-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090862U JPH0339819Y2 (US08197722-20120612-C00093.png) | 1986-06-13 | 1986-06-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62201783U true JPS62201783U (US08197722-20120612-C00093.png) | 1987-12-23 |
| JPH0339819Y2 JPH0339819Y2 (US08197722-20120612-C00093.png) | 1991-08-21 |
Family
ID=30951120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986090862U Expired JPH0339819Y2 (US08197722-20120612-C00093.png) | 1986-06-13 | 1986-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339819Y2 (US08197722-20120612-C00093.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005013246A1 (ja) * | 2003-08-04 | 2006-09-28 | 株式会社光波 | 表示装置 |
| EP1877696A1 (en) * | 2005-03-12 | 2008-01-16 | 3M Innovative Properties Company | Illumination device and methods for making the same |
| US8525402B2 (en) | 2006-09-11 | 2013-09-03 | 3M Innovative Properties Company | Illumination devices and methods for making the same |
-
1986
- 1986-06-13 JP JP1986090862U patent/JPH0339819Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339819Y2 (US08197722-20120612-C00093.png) | 1991-08-21 |
