JPS62199285U - - Google Patents
Info
- Publication number
- JPS62199285U JPS62199285U JP1986084712U JP8471286U JPS62199285U JP S62199285 U JPS62199285 U JP S62199285U JP 1986084712 U JP1986084712 U JP 1986084712U JP 8471286 U JP8471286 U JP 8471286U JP S62199285 U JPS62199285 U JP S62199285U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser processing
- processing machine
- view
- carries
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986084712U JPS62199285U (de) | 1986-06-05 | 1986-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986084712U JPS62199285U (de) | 1986-06-05 | 1986-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199285U true JPS62199285U (de) | 1987-12-18 |
Family
ID=30939457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986084712U Pending JPS62199285U (de) | 1986-06-05 | 1986-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199285U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014125993A1 (ja) * | 2013-02-14 | 2014-08-21 | 住友化学株式会社 | 切断装置、切断方法、および光学部材貼合体の製造装置 |
| EP2633941A4 (de) * | 2010-10-25 | 2017-12-06 | Amada Company, Limited | Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren |
-
1986
- 1986-06-05 JP JP1986084712U patent/JPS62199285U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2633941A4 (de) * | 2010-10-25 | 2017-12-06 | Amada Company, Limited | Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren |
| WO2014125993A1 (ja) * | 2013-02-14 | 2014-08-21 | 住友化学株式会社 | 切断装置、切断方法、および光学部材貼合体の製造装置 |