JPS62196396U - - Google Patents
Info
- Publication number
- JPS62196396U JPS62196396U JP8514086U JP8514086U JPS62196396U JP S62196396 U JPS62196396 U JP S62196396U JP 8514086 U JP8514086 U JP 8514086U JP 8514086 U JP8514086 U JP 8514086U JP S62196396 U JPS62196396 U JP S62196396U
- Authority
- JP
- Japan
- Prior art keywords
- bottom member
- control section
- shielding layer
- lid member
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Patch Boards (AREA)
Description
第1図イ,ロは本考案の第1の実施例を示す説
明図であり、ロはイの要部拡大図。第2図および
第3図は本考案の第2および第3の実施例を示す
説明図。
符号の説明、1…底部材、2…蓋部材、3,4
…遮蔽層、5…ボルト、6…パツキング、7…ア
ース用部材、8…アース用リード線。
FIGS. 1A and 1B are explanatory diagrams showing a first embodiment of the present invention, and FIG. 1B is an enlarged view of the main part of FIG. FIGS. 2 and 3 are explanatory diagrams showing second and third embodiments of the present invention. Explanation of symbols, 1... Bottom member, 2... Lid member, 3, 4
...shielding layer, 5... bolt, 6... packing, 7... grounding member, 8... grounding lead wire.
Claims (1)
んだ制御部を収容する樹脂構造体の制御ケースに
おいて、 前記樹脂構造体は前記制御部を支持する底部材
と、該底部材と一体になつて前記制御部を水密的
に保護する蓋部材より構成され、前記底部材およ
び前記蓋部材は積層一体化された静電遮蔽層を有
し、かつ、該静電遮蔽層は前記底部材と前記蓋部
材の間で電気的に接続されているとともにアース
用端子に接続されていることを特徴とする遮蔽層
を有する制御ケース。[Claims for Utility Model Registration] In a control case of a resin structure that is attached to a utility pole or the like and houses a control section including a semiconductor device therein, the resin structure includes a bottom member that supports the control section, and a bottom member that supports the control section; It is composed of a lid member that is integrated with a bottom member and protects the control section in a watertight manner, and the bottom member and the lid member have an electrostatic shielding layer that is laminated and integrated, and the electrostatic shielding layer A control case having a shielding layer, which is electrically connected between the bottom member and the lid member and is also connected to a ground terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986085140U JPH0314071Y2 (en) | 1986-06-04 | 1986-06-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986085140U JPH0314071Y2 (en) | 1986-06-04 | 1986-06-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62196396U true JPS62196396U (en) | 1987-12-14 |
JPH0314071Y2 JPH0314071Y2 (en) | 1991-03-28 |
Family
ID=30940274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986085140U Expired JPH0314071Y2 (en) | 1986-06-04 | 1986-06-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0314071Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58178300U (en) * | 1982-05-21 | 1983-11-29 | シャープ株式会社 | Antistatic device |
JPS60996U (en) * | 1983-06-17 | 1985-01-07 | 富士通株式会社 | Conductive plastic housing construction |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4053363A (en) * | 1976-06-28 | 1977-10-11 | J. K. And Susie L. Wadley Research Institute And Blood Bank | Sputum analysis method |
-
1986
- 1986-06-04 JP JP1986085140U patent/JPH0314071Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58178300U (en) * | 1982-05-21 | 1983-11-29 | シャープ株式会社 | Antistatic device |
JPS60996U (en) * | 1983-06-17 | 1985-01-07 | 富士通株式会社 | Conductive plastic housing construction |
Also Published As
Publication number | Publication date |
---|---|
JPH0314071Y2 (en) | 1991-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62196396U (en) | ||
JPS62145313U (en) | ||
JPH0392084U (en) | ||
JPS6320421U (en) | ||
JPS6251441U (en) | ||
JPS62166653U (en) | ||
JPH02125521U (en) | ||
JPS61278U (en) | Fixed structure for lead wires from the vessel body | |
JPS6321425U (en) | ||
JPH01154698U (en) | ||
JPS61138324U (en) | ||
JPH0211341U (en) | ||
JPH0265355U (en) | ||
JPS6346831U (en) | ||
JPH0250603U (en) | ||
JPH01165698U (en) | ||
JPH0428436U (en) | ||
JPS6441196U (en) | ||
JPH02138848U (en) | ||
JPS6233150U (en) | ||
JPH0339852U (en) | ||
JPH01145018U (en) | ||
JPS63165854U (en) | ||
JPH01130548U (en) | ||
JPH0317643U (en) |