JPS62196376U - - Google Patents
Info
- Publication number
- JPS62196376U JPS62196376U JP8490586U JP8490586U JPS62196376U JP S62196376 U JPS62196376 U JP S62196376U JP 8490586 U JP8490586 U JP 8490586U JP 8490586 U JP8490586 U JP 8490586U JP S62196376 U JPS62196376 U JP S62196376U
- Authority
- JP
- Japan
- Prior art keywords
- land group
- land
- attached
- terminal row
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8490586U JPS62196376U (nl) | 1986-06-04 | 1986-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8490586U JPS62196376U (nl) | 1986-06-04 | 1986-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62196376U true JPS62196376U (nl) | 1987-12-14 |
Family
ID=30939820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8490586U Pending JPS62196376U (nl) | 1986-06-04 | 1986-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62196376U (nl) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224574U (nl) * | 1988-07-30 | 1990-02-19 | ||
| JPH0224570U (nl) * | 1988-07-30 | 1990-02-19 | ||
| JP2013153252A (ja) * | 2012-01-24 | 2013-08-08 | Kyocera Crystal Device Corp | 圧電デバイス |
| JP2014517532A (ja) * | 2011-06-06 | 2014-07-17 | インテル コーポレイション | 選択的パッケージ機能のためのマイクロエレクトロニクス基板 |
-
1986
- 1986-06-04 JP JP8490586U patent/JPS62196376U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224574U (nl) * | 1988-07-30 | 1990-02-19 | ||
| JPH0224570U (nl) * | 1988-07-30 | 1990-02-19 | ||
| JP2014517532A (ja) * | 2011-06-06 | 2014-07-17 | インテル コーポレイション | 選択的パッケージ機能のためのマイクロエレクトロニクス基板 |
| US9961769B2 (en) | 2011-06-06 | 2018-05-01 | Intel Corporation | Microelectronic substrate for alternate package functionality |
| JP2013153252A (ja) * | 2012-01-24 | 2013-08-08 | Kyocera Crystal Device Corp | 圧電デバイス |