JPS62195450U - - Google Patents

Info

Publication number
JPS62195450U
JPS62195450U JP1986083620U JP8362086U JPS62195450U JP S62195450 U JPS62195450 U JP S62195450U JP 1986083620 U JP1986083620 U JP 1986083620U JP 8362086 U JP8362086 U JP 8362086U JP S62195450 U JPS62195450 U JP S62195450U
Authority
JP
Japan
Prior art keywords
lead frame
support plate
tool support
spacing
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986083620U
Other languages
English (en)
Other versions
JPH039979Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986083620U priority Critical patent/JPH039979Y2/ja
Priority to US07/047,839 priority patent/US4760673A/en
Publication of JPS62195450U publication Critical patent/JPS62195450U/ja
Application granted granted Critical
Publication of JPH039979Y2 publication Critical patent/JPH039979Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/08—Abrasive blasting machines or devices; Plants essentially adapted for abrasive blasting of travelling stock or travelling workpieces
    • B24C3/10—Abrasive blasting machines or devices; Plants essentially adapted for abrasive blasting of travelling stock or travelling workpieces for treating external surfaces
    • B24C3/12—Apparatus using nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の１実施例を示すリードフレー
ム加工装置の側面図で、第２図及び第３図は、第
１図における矢視Ａ―Ａ線及び矢視Ｂ―Ｂ線より
見た平面図、第４図及び第５図は、第１図におけ
る矢視Ｃ―Ｃ線及び矢視Ｄ―Ｄ線に沿つて切断し
た断面図である。 １……リードフレーム、２……搬送手段、３…
…フレーム、４……工具支持板、５……加工具、
６……台板、７……ピン、８……窓、９……リン
ク腕、１０……ターンバツクル、１１……ボルト
、１２……支持腕、１３……ベアリング、１４…
…ボルト、１５……キヤツプ、１６……Ｏリング
、Ｌ……リンク機構、Ｗ……加工域。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームを加工する加工具を複数個配置
    した工具支持板を、搬送されるリードフレームに
    対向する面内で回動自在に枢支すると共に、リー
    ドフレームの両端縁を挾持して搬送する搬送手段
    を具え、かつ互いに平行に配置されて間隔を調整
    自在なフレームと上記支持板とを、フレームの間
    隔変化に応じて工具支持板を回動させるリンク機
    構を介して連結せしめたことを特徴とするリード
    フレーム加工装置。
JP1986083620U 1986-06-03 1986-06-03 Expired JPH039979Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986083620U JPH039979Y2 (ja) 1986-06-03 1986-06-03
US07/047,839 US4760673A (en) 1986-06-03 1987-05-06 Lead frame finishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986083620U JPH039979Y2 (ja) 1986-06-03 1986-06-03

Publications (2)

Publication Number Publication Date
JPS62195450U true JPS62195450U (ja) 1987-12-12
JPH039979Y2 JPH039979Y2 (ja) 1991-03-12

Family

ID=13807528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986083620U Expired JPH039979Y2 (ja) 1986-06-03 1986-06-03

Country Status (2)

Country Link
US (1) US4760673A (ja)
JP (1) JPH039979Y2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4917708A (en) * 1987-01-19 1990-04-17 Fuji Seiki Machine Works, Ltd. Deburring and cleaning apparatus with multi-station rotary drum and reciprocating blasting guns
JPH0728002B2 (ja) * 1991-06-20 1995-03-29 株式会社石井表記 Ｉｃフレームのブラスイング方法及びその装置
DE69318355T2 (de) * 1992-08-27 1999-03-25 Young Kil Choi Schleuderstrahlvorrichtung und Vorrichtung zum Entfernen von Graten mit dieser Vorrichtung
US20060256506A1 (en) * 2005-04-27 2006-11-16 Showa Denko K.K. Solid electrolyte capacitor and process for producing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2037047A (en) * 1932-06-28 1936-04-14 Pangborn Corp Blast cleaning machine
FR1279551A (fr) * 1960-12-05 1961-12-22 Fischer Ag Georg Machine de nettoyage à jets de projection, notamment pour nettoyer une matière en bande
FR2315359A1 (fr) * 1975-06-25 1977-01-21 Berthiez C N M P Perfectionnements apportes aux machines d'usinage a table circulaire porte-piece et broche porte-outils
US4015661A (en) * 1976-03-15 1977-04-05 Christensen John L Apparatus for coupling and uncoupling pipe sections
CH613651A5 (en) * 1976-12-16 1979-10-15 Fischer Ag Georg Centrifugal abrasive-blasting machine for strip-shaped plastering material
JPS59115532A (ja) * 1982-12-23 1984-07-04 Fuji Seiki Seizosho:Kk リ−ドフレ−ム連続加工装置

Also Published As

Publication number Publication date
JPH039979Y2 (ja) 1991-03-12
US4760673A (en) 1988-08-02

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