JPS62193729U - - Google Patents
Info
- Publication number
- JPS62193729U JPS62193729U JP8329586U JP8329586U JPS62193729U JP S62193729 U JPS62193729 U JP S62193729U JP 8329586 U JP8329586 U JP 8329586U JP 8329586 U JP8329586 U JP 8329586U JP S62193729 U JPS62193729 U JP S62193729U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- large area
- semiconductor pellet
- view
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8329586U JPS62193729U (US20020095090A1-20020718-M00002.png) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8329586U JPS62193729U (US20020095090A1-20020718-M00002.png) | 1986-05-30 | 1986-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193729U true JPS62193729U (US20020095090A1-20020718-M00002.png) | 1987-12-09 |
Family
ID=30936750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8329586U Pending JPS62193729U (US20020095090A1-20020718-M00002.png) | 1986-05-30 | 1986-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193729U (US20020095090A1-20020718-M00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (ja) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
| JPS5972757A (ja) * | 1982-10-20 | 1984-04-24 | Fujitsu Ltd | 半導体装置 |
-
1986
- 1986-05-30 JP JP8329586U patent/JPS62193729U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
| JPS5972757A (ja) * | 1982-10-20 | 1984-04-24 | Fujitsu Ltd | 半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037239A (ja) * | 2001-07-24 | 2003-02-07 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| JP4618941B2 (ja) * | 2001-07-24 | 2011-01-26 | 三洋電機株式会社 | 半導体装置 |
