JPS6219311B2 - - Google Patents
Info
- Publication number
- JPS6219311B2 JPS6219311B2 JP57149583A JP14958382A JPS6219311B2 JP S6219311 B2 JPS6219311 B2 JP S6219311B2 JP 57149583 A JP57149583 A JP 57149583A JP 14958382 A JP14958382 A JP 14958382A JP S6219311 B2 JPS6219311 B2 JP S6219311B2
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- protective layer
- surface protective
- film
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011241 protective layer Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229920005601 base polymer Polymers 0.000 claims description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 4
- 239000003504 photosensitizing agent Substances 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical class C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- -1 dimethylaminoethyl Chemical group 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- OMWSZDODENFLSV-UHFFFAOYSA-N (5-chloro-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=C(Cl)C=C1C(=O)C1=CC=CC=C1 OMWSZDODENFLSV-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920002633 Kraton (polymer) Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- ZLFVRXUOSPRRKQ-UHFFFAOYSA-N chembl2138372 Chemical compound [O-][N+](=O)C1=CC(C)=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 ZLFVRXUOSPRRKQ-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
本発明は被着体面に表面保護層を形成する方法
に関するものであつて、更に詳しく金属板、ガラ
ス板、木板、化粧板、プラスチツク板の如き板状
物品などからなる被着体の表面が損傷するのを半
永久的に防止するための表面保護層を形成する方
法を提供するものである。
従来、板状物品などからなる被着体の表面保護
は、加工前に段階においては表面保護粘着フイル
ムを仮着しておき、加工後においては塗料などを
塗設することによつて行われているのが一般的で
ある。
これらの一連の工程は、板状物品への前記フイ
ルムの貼り付けから始まり、次いで曲げ、絞り、
打抜きなどの加工を行なつて、さらにフイルムの
剥離、表面洗浄、塗装、乾燥という順序からなつ
ており、煩雑であるばかりか、洗浄液や塗料には
多量の有機溶剤を含んでいるために、安全又は衛
生上の種々の問題があつた。
従つて本発明の第1の目的は、加工前の板状物
品の表面保護から加工後の表面保護までを簡単に
行える表面保護層の形成方法を提供することにあ
る。
本発明の第2の目的は、施工時に有機溶剤を使
用することなく、簡単な操作で表面保護層を形成
する方法を提供することにある。
かかる本発明の目的は、自己支持性シート(又
はフイルム)面に、分子中に少なくとも1個の
(メタ)アクリロイル基を有する光重合性化合物
と、光増感剤と、基剤ポリマーとを含む光硬化性
粘着層を形成してなる複合シート(又はフイル
ム)を、被着体面上に該粘着層を介して貼り合せ
て後光照射して該貼着層を硬化し、次いで前記自
己支持性シート(又はフイルム)のみを剥離し
て、前記被着体面に重合硬化物からなる表面保護
層を形成することによつて達成される。
本発明の方法によれば、加工前及び加工中の板
状物品などからなる被着体の表面の損傷は、複合
シートを貼り付けておくことによつて防止され、
加工後は光照射して光硬化性粘着層を重合硬化し
て形成してなる表面保護層にて保護されるので、
被着体表面が損傷されることがないものである。
本発明の実施に当つて用いられる分子中に少な
くとも1個の(メタ)アクリロイル基を有する光
重合性化合物とは、分子中に重合しうる二重結合
としてのメタアクリロイル基又はアクリロイル基
を少なくとも1個、好ましくは2個以上有する多
官能性のものであり、例えば、1・4−ブチレン
グリコールジ(メタ)アクリレート、1・6−ヘ
キサングリコールジ(メタ)アクリレート、ネオ
ペンチルグリコールジ(メタ)アクリレート、ポ
リエチレングリコールジ(メタ)アクリレート、
トリメチロールプロパントリ(メタ)アクリレー
ト、テトラメチロールメタンテトラ(メタ)アク
リレートなどの単量体及びエポキシアクリレー
ト、ウレタン変性アクリレート、オリゴエステル
アクリレートなどのオリゴマーなどが挙げられ、
これらは必要に応じて2種以上を併用してもよ
い。
また基剤ポリマーとしては、それ自体が粘着性
を有するものと、前記光重合性化合物を配合する
ことにより必要な粘着性を発揮するものとに別け
られ、前者の例としては、アルキル基のC数が1
〜12個の(メタ)アクリル酸アルキルエステル重
合体、(メタ)アクリル酸アルキルエステルと
(メタ)アクリル酸、2−ヒドロキエチル(メ
タ)アクリレート、ジメチルアミノエチル(メ
タ)アクリレート、スチレン、酢酸ビニル、(メ
タ)アクリロニトリルなどの不飽和化合物とを共
重合してなる二元又は三元共重合物(架橋剤を用
いて架橋してなる重合物を含む)、或いはスチレ
ン−イソプレン−スチレンブロツク共重合体ゴ
ム、スチレンブタジエンゴム、ニトリルブタジエ
ンゴムなどのゴム類を主体とするゴム系粘着物質
などが挙げられ、後者の例としては、飽和又は不
飽和ポリエステル樹脂、ポリブチラール樹脂など
が挙げられる。
前記光重合性化合物と基剤ポリマーとの配合割
合は、80:20〜10:90好ましくは70:30〜30:70
(各れも重量比)であり、前記化合物が80%を越
えると光硬化性粘着層の光照射前の凝集性が劣
り、側面への糊食み出しなどが起生するために好
ましくなく、また10%以下では充分な硬化が得ら
れないために好ましくないものである。
光増感剤としては、前記化合物の光重合反応を
促進させるものであれば殊に制限されないが、例
えば、ベンゾイル、ベンゾイルメチルエーテル、
ベンゾインエチルエーテル、ベンゾインイソプロ
ピルエーテル、α−メチルベンゾインなどのベン
ゾイン類、1−クロロアントラキノン、2−クロ
ロアントラキノンなどのアントラキノン類、ベン
ゾフエノン、p−クロロベンゾフエノン、p−ジ
メチルアミノベンゾフエノンなどのベンズフエノ
ン類、ジフエニルジスルフイド、テトラメチルチ
ウラムジスルフイドなどの含イオウ化合物類など
を挙げることができ、該光増感剤は前記化合物と
ポリマーとの合計量に対して0.05〜20重量%、好
ましくは0.5〜10重量%の範囲で添加される。
このように光重合性化合物と光増感剤と基剤ポ
リマーとから構成される光硬化粘着性組成物は、
光が透過する有色又は無色透明性の自己支持性シ
ート(又はフイルム)、例えばポリ塩化ビニルシ
ート又はフイルム、ポリオレフイン系シート又は
フイルム(エチレン−酢酸ビニル共重合体及びそ
のケン化物からなるシート又はフイルムを含む)
ポリエステルシート又はフイルム(厚さは10〜
300μmが好ましい)などの片面に、厚さ約1〜
100μmの範囲で塗設又は転着され、光硬化性粘
着層とされるものであるが、前記組成物には目的
に応じて他の配合剤を適量添加することができ
る。
配合剤の例としては、製造中の熱重合や保存中
の反応を防止する重合禁止剤例えばハイドロキノ
ン、ハイドロキノンモノメチルエーテル、tert−
ブチルカテコール、p−ベンゾキノン、2.5−
tert−ブチルハイドロキノン、フエノチアジンな
ど、着色又は装飾などを目的とする例えば亜鉛
華、黄鉛、ベンガラなどの顔料、トルイジンレツ
ド、フタロシアニンブル−、フタロシアニングリ
ーンなどの染料、その他金属粉、ガラスビーズ、
ガラス粉末、ガラスフレークなど、また被着体面
への接着力の向上を目的とする例えばキシレン樹
脂、クマロン樹脂などの接着性付与樹脂などが挙
げられる。
このように構成してなる自己支持性シート(又
はフイルム)と光硬化性粘着層とからなる複合シ
ート(又はフイルム)は、金属板、ガラス板、木
板、化粧板、プラスチツク板などからなる板状物
品などの被着体面に、粘着層を介して貼り付けら
れる。そして、一般的には自己支持性シート(又
はフイルム)から、高圧水銀灯、超高圧水銀灯、
メタルハライドランプ、カーボンアーク灯、キセ
ノン灯などの光源を用いて0.3秒以上、好ましく
は3秒以上光照射し、前記粘着層を光重合硬化さ
せる。次いで前記支持体シート(又はフイルム)
のみを剥離することにより、被着体面には重合硬
化物からなる表面保護層が形成されるものであ
る。硬化後の支持体シート(又はフイルム)の剥
離は、該シート(又はフイルム)の接着力の大小
は剥離時の粘着層の塑性流動に起因するところ大
であるから、硬化によつて塑性流動性が喪失され
た粘着層から簡単に行えるものである。
なお光照射の時期は、板状物品などからなる被
着体に複合シートの貼り付けた後、被着体の加工
前でも後でもよいことは理解されるであろう。
以上の如く、本発明の方法によれば、被着体面
の表面保護に用いた複合シートに光照射し、自己
支持性シートを剥がすことによつて、半永久的に
表面を保護しうる表面保護層を形成することがで
きるという特徴を有する。もとより、本発明の方
法は、被着体の加工などに関係なく、単に物品面
に表面保護層を形成するだけのために使用できる
ものである。
次に本発明の実施例を示す。文中部とあるのは
重量部を意味する。
実施例 1
2−エチルヘキシルアクリレート 50部
メチルメタクリレート 50〃
メタクリル酸 2〃
ベンゾイルパーキオサイド 0.2〃
酢酸エチル 100〃
上記配合組成物を常法により重合し、アクリル
系共重合物を得た。
次に該共重合物50部(固型分)に対して、テト
ラエチレングリコールジメタアクリレート50部、
ベンゾフエノン7部、トリレンジイソシアネート
3モルと1・1・1−トリメチロール1モルとの
反応物2部及びハイドロキノン0.01部を配合して
均一に混合し、厚さ60μmのポリエチレンシート
の片面に乾燥後の厚みが5μmとなるように塗布
し、100℃で5分間乾燥して複合シートを得た。
実施例 2
酢酸ビニル 60部
メチルメタクリレート 20〃
エチルアクリレート 20〃
アゾビスイソブチロニトリル 0.05〃
酢酸エチル 100〃
上記配合組成物を常法により重合し、アクリル
系共重合物を得た。
次に該共重合物70部(固型分)に対して、テトラ
メチロールメタンテトラアクリレート30部、ベン
ゾインメチルエーテル3部及びハイドロキノン
0.01部を配合して均一に混合し、厚さ60μmのポ
リ塩化ビニルシートの片面に乾燥後の厚さが5μ
mとなるように塗布し、100℃で5分間乾燥して
複合シートを得た。
実施例 3
スチレン−イソプレン−スチレンブロツク共重合
体ゴム(シエル化学社製、商品名クレイトン
1107) 60部
両末端アクリル化ブタジエンオリゴマー(出光石
油化学社製、商品名ポリBD−R45ACR−LC)
40〃
ベンゾフエノン 7〃
ハイドロキノン 0.01〃
上記配合組成物をトルエンに溶解して30%トエ
ン溶液を作成し、これを厚さ60μmのポリエチレ
ンシート面に乾燥後の厚みが5μmとなるように
塗布し、100℃で5分間乾燥して複合シートを得
た。
実施例 4
飽和ポリエステル樹脂(東洋紡績社製、商品名バ
イロン) 40部
エポキシアクリレート(昭和高分子社製、商品名
リポキシSP−1507) 60〃
ベンゾフエノン 7〃
ハイドロキノン 0.01〃
上記配合組成物をトルエンに溶解して30%トル
エン溶液を作成し、これを厚さ60μmのポリ塩化
ビニルシートに乾燥後の厚みが5μmとなるよう
に塗布し、100℃で5分間乾燥して複合シートを
得た。
第1表に実施例1〜4で得た複合シートを用い
て、表面保護層を形成して特性試験を行なつた結
果を示す。
The present invention relates to a method for forming a surface protective layer on the surface of an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on an adherend, and more specifically, the present invention relates to a method for forming a surface protective layer on an adherend, and more specifically, it relates to a method for forming a surface protective layer on an adherend, and more particularly, it relates to a method for forming a surface protective layer on an adherend, and more particularly, it relates to a method for forming a surface protection layer on an adherend, and more particularly, it relates to a method for forming a surface protective layer on an adherend, and more particularly, it relates to a method for forming a surface protective layer on an adherend, and more particularly, it relates to a method for forming a surface protective layer on an adherend. The present invention provides a method for forming a surface protective layer to semi-permanently prevent such occurrence. Conventionally, the surface of adherends such as plate-shaped articles has been protected by temporarily applying a surface protection adhesive film before processing, and then applying paint after processing. It is common for there to be. These series of steps begin with pasting the film onto a plate-shaped article, followed by bending, drawing, and
The process involves processing such as punching, followed by film peeling, surface cleaning, painting, and drying, which is not only complicated, but also requires safety because the cleaning fluid and paint contain large amounts of organic solvents. Or there were various hygiene problems. Accordingly, a first object of the present invention is to provide a method for forming a surface protective layer that can easily protect the surface of a plate-shaped article before processing and protect the surface after processing. A second object of the present invention is to provide a method for forming a surface protective layer by a simple operation without using an organic solvent during construction. The object of the present invention is to provide a self-supporting sheet (or film) containing a photopolymerizable compound having at least one (meth)acryloyl group in the molecule, a photosensitizer, and a base polymer. A composite sheet (or film) formed with a photocurable adhesive layer is laminated onto the surface of an adherend via the adhesive layer, the adhesive layer is cured by backlight irradiation, and then the self-supporting adhesive layer is cured. This is achieved by peeling off only the sheet (or film) and forming a surface protective layer made of a cured polymer on the surface of the adherend. According to the method of the present invention, damage to the surface of an adherend such as a plate-shaped article before and during processing is prevented by pasting the composite sheet,
After processing, it is protected by a surface protection layer formed by polymerizing and curing the photocurable adhesive layer by irradiating it with light.
The surface of the adherend will not be damaged. A photopolymerizable compound having at least one (meth)acryloyl group in the molecule used in carrying out the present invention refers to a photopolymerizable compound having at least one (meth)acryloyl group in the molecule as a polymerizable double bond. , preferably two or more, such as 1,4-butylene glycol di(meth)acrylate, 1,6-hexane glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate. , polyethylene glycol di(meth)acrylate,
Examples include monomers such as trimethylolpropane tri(meth)acrylate and tetramethylolmethanetetra(meth)acrylate, and oligomers such as epoxy acrylate, urethane-modified acrylate, and oligoester acrylate.
These may be used in combination of two or more types as necessary. In addition, base polymers can be divided into those that have adhesive properties themselves and those that exhibit the necessary adhesive properties by blending the photopolymerizable compound. number is 1
~12 (meth)acrylic acid alkyl ester polymers, (meth)acrylic acid alkyl esters and (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, styrene, vinyl acetate, A binary or tertiary copolymer formed by copolymerizing with an unsaturated compound such as (meth)acrylonitrile (including a polymer formed by crosslinking using a crosslinking agent), or a styrene-isoprene-styrene block copolymer Examples include rubber-based adhesive substances mainly composed of rubbers such as rubber, styrene-butadiene rubber, and nitrile-butadiene rubber. Examples of the latter include saturated or unsaturated polyester resins, polybutyral resins, and the like. The blending ratio of the photopolymerizable compound and the base polymer is 80:20 to 10:90, preferably 70:30 to 30:70.
(Each is a weight ratio), and if the content of the compound exceeds 80%, the cohesiveness of the photocurable adhesive layer before light irradiation will be poor, and the adhesive will ooze out to the side surfaces, which is undesirable. Moreover, if it is less than 10%, sufficient curing cannot be obtained, which is not preferable. The photosensitizer is not particularly limited as long as it promotes the photopolymerization reaction of the compound, but examples include benzoyl, benzoyl methyl ether,
Benzoins such as benzoin ethyl ether, benzoin isopropyl ether, and α-methylbenzoin; anthraquinones such as 1-chloroanthraquinone and 2-chloroanthraquinone; benzphenones such as benzophenone, p-chlorobenzophenone, and p-dimethylaminobenzophenone; and sulfur-containing compounds such as diphenyl disulfide and tetramethylthiuram disulfide. It is preferably added in an amount of 0.5 to 10% by weight. In this way, a photocurable adhesive composition composed of a photopolymerizable compound, a photosensitizer, and a base polymer,
Colored or colorless transparent self-supporting sheets (or films) that transmit light, such as polyvinyl chloride sheets or films, polyolefin sheets or films (sheets or films made of ethylene-vinyl acetate copolymer and its saponified product) include)
Polyester sheet or film (thickness is 10~
(preferably 300 μm) on one side with a thickness of about 1~
It is coated or transferred in a range of 100 μm to form a photocurable adhesive layer, but appropriate amounts of other compounding agents can be added to the composition depending on the purpose. Examples of compounding agents include polymerization inhibitors that prevent thermal polymerization during production and reactions during storage, such as hydroquinone, hydroquinone monomethyl ether, and tert-
Butylcatechol, p-benzoquinone, 2.5-
tert-butylhydroquinone, phenothiazine, pigments for coloring or decoration such as zinc white, yellow lead, red red iron, dyes such as toluidine red, phthalocyanine blue, phthalocyanine green, other metal powders, glass beads,
Examples include glass powder, glass flakes, etc., and adhesion-imparting resins such as xylene resin and coumaron resin for the purpose of improving adhesion to the surface of the adherend. A composite sheet (or film) consisting of a self-supporting sheet (or film) and a photocurable adhesive layer constructed in this way can be used in the form of a plate made of a metal plate, glass plate, wood board, decorative board, plastic board, etc. It is attached to the surface of an adherend such as an article via an adhesive layer. Generally, self-supporting sheets (or films) are used to produce high-pressure mercury lamps, ultra-high pressure mercury lamps,
The adhesive layer is photopolymerized and cured by irradiating it with light for 0.3 seconds or more, preferably 3 seconds or more using a light source such as a metal halide lamp, carbon arc lamp, or xenon lamp. Then the support sheet (or film)
By peeling only the adhesive, a surface protective layer made of a cured polymer is formed on the surface of the adherend. Peeling of the support sheet (or film) after curing is due to the plastic flow of the adhesive layer at the time of peeling. This can be easily done from the adhesive layer that has been lost. It will be understood that the light irradiation may be performed after the composite sheet is attached to an adherend such as a plate-shaped article, before or after the adherend is processed. As described above, according to the method of the present invention, by irradiating the composite sheet used for surface protection of the adherend surface with light and peeling off the self-supporting sheet, the surface protective layer can semi-permanently protect the surface. It has the characteristic of being able to form. Of course, the method of the present invention can be used simply to form a surface protective layer on the surface of an article, regardless of the processing of the adherend. Next, examples of the present invention will be shown. The text middle part means the weight part. Example 1 2-Ethylhexyl acrylate 50 parts Methyl methacrylate 50 Methacrylic acid 2 Benzoyl perkiside 0.2 Ethyl acetate 100 The above blended composition was polymerized in a conventional manner to obtain an acrylic copolymer. Next, to 50 parts of the copolymer (solid content), 50 parts of tetraethylene glycol dimethacrylate,
7 parts of benzophenone, 2 parts of a reaction product of 3 moles of tolylene diisocyanate and 1 mole of 1,1,1-trimethylol, and 0.01 part of hydroquinone were mixed uniformly and coated on one side of a 60 μm thick polyethylene sheet after drying. The composite sheet was coated to a thickness of 5 μm and dried at 100° C. for 5 minutes to obtain a composite sheet. Example 2 Vinyl acetate 60 parts Methyl methacrylate 20 Ethyl acrylate 20 Azobisisobutyronitrile 0.05 Ethyl acetate 100 The above blended composition was polymerized by a conventional method to obtain an acrylic copolymer. Next, to 70 parts (solid content) of the copolymer, 30 parts of tetramethylolmethanetetraacrylate, 3 parts of benzoin methyl ether, and hydroquinone
Blend 0.01 part and mix uniformly, and apply it to one side of a 60 μm thick polyvinyl chloride sheet to a dry thickness of 5 μm.
m and dried at 100°C for 5 minutes to obtain a composite sheet. Example 3 Styrene-isoprene-styrene block copolymer rubber (manufactured by Ciel Chemical Co., Ltd., trade name: Kraton)
1107) 60 parts acrylated butadiene oligomer at both ends (manufactured by Idemitsu Petrochemical Co., Ltd., trade name PolyBD-R45ACR-LC)
40〃 Benzophenone 7〃 Hydroquinone 0.01〃 The above blended composition was dissolved in toluene to create a 30% toene solution, and this was applied to the surface of a polyethylene sheet with a thickness of 60 μm so that the thickness after drying was 5 μm. A composite sheet was obtained by drying at ℃ for 5 minutes. Example 4 Saturated polyester resin (manufactured by Toyobo Co., Ltd., trade name: Vylon) 40 parts Epoxy acrylate (manufactured by Showa Kobunshi Co., Ltd., trade name: Lipoxy SP-1507) 60〃 Benzophenone 7〃 Hydroquinone 0.01〃 Dissolve the above blended composition in toluene A 30% toluene solution was prepared, and this was applied to a polyvinyl chloride sheet with a thickness of 60 μm so that the thickness after drying would be 5 μm, and dried at 100° C. for 5 minutes to obtain a composite sheet. Table 1 shows the results of characteristic tests performed using the composite sheets obtained in Examples 1 to 4 and forming a surface protective layer.
【表】
第1表中の試験方法
初期接着力:複合シートを幅25mmに切断し、BA
仕上げステンレス板SUS304に貼り付けて30分
間放置後、180度引き剥し接着力を測定した。
条件(引き剥し速度300mm/min、20℃×65%
R.H)
自己支持性シート剥離力:複合シートをBA仕上
げステンレス板SUS304に貼り付けた後、高圧水
銀灯(80W/cm/1灯)で10cmの距離から約5秒
間紫外線照射後、自己支持性シートの剥離力を測
定した。条件(引き剥し速度300mm/min、20℃
×65%R.H.)
鉛筆硬度:JIS K5400に準じ、重合硬化物(表面
保護層)の硬度を測定した。
密着力:重合硬化物(表面保護層)に、1mm間隔
の切れ目を碁盤目状に100個入れ、これに市販
のセロハン粘着テープを貼り付け、次いでテー
プを剥して基盤目片の残留%で表示した。
上記実施例からも明らかな如く、本発明の方法
によれば、被着体上に良好な表面保護層を簡単に
形成できる事実が顕著である。[Table] Test method in Table 1 Initial adhesion strength: Cut the composite sheet into 25 mm width, BA
After pasting it on a finished stainless steel plate SUS304 and leaving it for 30 minutes, it was peeled off 180 degrees and the adhesive strength was measured.
Conditions (peeling speed 300mm/min, 20℃ x 65%
RH) Self-supporting sheet peeling force: After pasting the composite sheet on a BA-finished stainless steel plate SUS304, the self-supporting sheet was irradiated with ultraviolet light for about 5 seconds from a distance of 10cm using a high-pressure mercury lamp (80W/cm/1 lamp). Peel force was measured. Conditions (peeling speed 300mm/min, 20℃
×65%RH) Pencil hardness: The hardness of the polymerized cured product (surface protective layer) was measured according to JIS K5400. Adhesion: Make 100 cuts at 1 mm intervals in a grid pattern on the polymerized cured product (surface protective layer), paste commercially available cellophane adhesive tape on this, then peel off the tape and indicate the percentage of remaining base pieces. did. As is clear from the above examples, the method of the present invention is notable for the fact that a good surface protective layer can be easily formed on an adherend.
Claims (1)
子中に少なくとも1個の(メタ)アクリロイル基
を有する光重合性化合物と、光増感剤と、基剤ポ
リマーとを含む光硬化性粘着層を形成してなる複
合シート(又はフイルム)を、被着体面上に該粘
着層を介して貼り合せて後光照射して該粘着層を
硬化し、次いで前記自己支持性シート(又はフイ
ルム)のみを剥離して、前記被着体面に重合硬化
物からなる表面保護層を形成することを特徴とす
る表面保護層形成方法。1. A photocurable adhesive layer containing a photopolymerizable compound having at least one (meth)acryloyl group in the molecule, a photosensitizer, and a base polymer on the self-supporting sheet (or film) surface. The formed composite sheet (or film) is laminated onto the surface of an adherend via the adhesive layer, the adhesive layer is cured by backlight irradiation, and then only the self-supporting sheet (or film) is bonded. A method for forming a surface protective layer, which comprises peeling off to form a surface protective layer made of a polymerized cured product on the surface of the adherend.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149583A JPS5938061A (en) | 1982-08-27 | 1982-08-27 | Method of forming surface protective layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57149583A JPS5938061A (en) | 1982-08-27 | 1982-08-27 | Method of forming surface protective layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5938061A JPS5938061A (en) | 1984-03-01 |
JPS6219311B2 true JPS6219311B2 (en) | 1987-04-27 |
Family
ID=15478367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57149583A Granted JPS5938061A (en) | 1982-08-27 | 1982-08-27 | Method of forming surface protective layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5938061A (en) |
-
1982
- 1982-08-27 JP JP57149583A patent/JPS5938061A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5938061A (en) | 1984-03-01 |
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