JPS62190755A - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPS62190755A JPS62190755A JP61032356A JP3235686A JPS62190755A JP S62190755 A JPS62190755 A JP S62190755A JP 61032356 A JP61032356 A JP 61032356A JP 3235686 A JP3235686 A JP 3235686A JP S62190755 A JPS62190755 A JP S62190755A
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- substrate
- insulating film
- black
- wiring conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000004020 conductor Substances 0.000 claims abstract description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011521 glass Substances 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000005388 borosilicate glass Substances 0.000 abstract description 4
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 abstract description 2
- 239000003513 alkali Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 238000000206 photolithography Methods 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910000424 chromium(II) oxide Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920000515 polycarbonate Polymers 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 abstract 1
- 230000003449 preventive effect Effects 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 239000007767 bonding agent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Facsimile Heads (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、複写機やファクシミリ、画像ファイルシステ
ム等において、原稿面上に画像読取りに用いられるイメ
ージセンサに関し、特にイメージセンサの実装構造に関
するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an image sensor used for reading an image on a document surface in a copying machine, facsimile machine, image file system, etc., and particularly relates to the mounting structure of the image sensor. It is.
（発明の概要）
本発明は、イメージセンサチップとその配ｅｉｓ体層と
が形成される透明部材基板上に、基板表面と、イメージ
センサチップと配線導体層との接続部及び外部との接続
部を除く表面上に、黒色絶縁膜を形成する事により、構
造が簡単でかつ安価であり、しかもイメージセンサチツ
プへの雑音光を防ぐ事を特徴とするイメージセンサを得
る事である。(Summary of the Invention) The present invention provides a transparent member substrate on which an image sensor chip and an EIS layer thereof are formed, a substrate surface, a connecting portion between the image sensor chip and a wiring conductor layer, and a connecting portion with the outside. An object of the present invention is to obtain an image sensor which has a simple structure, is inexpensive, and is characterized in that it prevents noise light from entering the image sensor chip by forming a black insulating film on the surface other than the image sensor chip.
（従来の技術）
従来、複写機やファクシミリ等における原稿面上の画像
読取りにおいて、縮小レンズ系と組合わせたＣＯＤイメ
ージセンサやＭＯＳイメージセンサが多用されてきた。(Prior Art) Conventionally, a COD image sensor or a MOS image sensor combined with a reduction lens system has been frequently used in reading an image on a document surface in a copying machine, a facsimile machine, or the like.
これらのイメージセンサでは、読取る原稿面からの画像
に基づく光信号以外の雑音光がイメージセンサ上の光重
変換部に入射しないようセンサチップの実装基板に、黒
色アルミナ等を用いて光の反射を防いでいた。These image sensors use black alumina, etc., on the mounting board of the sensor chip to prevent light reflection, so that noise light other than the optical signal based on the image from the surface of the document to be read does not enter the light weight conversion section on the image sensor. I was preventing it.
第３図に上記のような従来のイメージセンサの実装構造
を示す。ＣＯＤやＭＯＳのイメージセンサチップ３１は
ダイボンディング剤３２を介して黒色アルミナ基板又は
黒色被膜を表面上に形成した白色アルミナ基板３３の凹
部内に設けられ、配線導体層３４とボンディングワイヤ
ー３５により電気的に接続されている。さらに端子３６
により外部とも電気的に接続されている。基板３３上に
は支持体３７を介して保護ガラス３８がイメージセンサ
チップ３１を封１トするとともに、光信号３９を透過さ
せイメージセンサチップ３１上の光 、電変換部に入射
される。FIG. 3 shows the mounting structure of the conventional image sensor as described above. A COD or MOS image sensor chip 31 is installed in a recessed part of a black alumina substrate or a white alumina substrate 33 with a black film formed on the surface via a die bonding agent 32, and is electrically connected by a wiring conductor layer 34 and a bonding wire 35. It is connected to the. Furthermore, terminal 36
It is electrically connected to the outside. A protective glass 38 is placed on the substrate 33 via a support 37 to seal the image sensor chip 31, and allows an optical signal 39 to pass therethrough and enter the light/electrical converter on the image sensor chip 31.
又、最近では、装置の小型化を主目的とした密着イメー
ジセンサの開発が進められている（参考文献 特開昭５
７−４９２６３．５８−８４４５７．５９−８０９６４
号公報）。この密着イメージセンサは、集束性ロッドレ
ンズアレー等を用いて原稿面上に画像を１：１の大きさ
で読取る原稿面幅と等しいイメージセンサ−１−に結像
するようにしたものである。このイメージセンサによれ
ば結像距離が例えば１５Ｍ程度と非常に短かくなり、装
置の小型化が容易になる。Recently, the development of close-contact image sensors has been progressing with the main purpose of downsizing the device (Reference: Japanese Patent Application Laid-Open No. 1989-5
7-49263.58-84457.59-80964
Publication No.). This contact image sensor uses a convergent rod lens array or the like to form an image on an image sensor -1- whose width is equal to the width of the document surface for reading an image on the document surface at a ratio of 1:1. According to this image sensor, the imaging distance is very short, for example, about 15M, making it easy to miniaturize the device.
（発明が解決しようとする問題点）
原稿面積と等しい密着イメージセンサを作成するには、
複数個のＣＯＤやＭＯＳイメージセンサチップを、千鳥
状又は一直線上に配列実装覆る事になり、第３図で示し
た四部を有する長尺状の例えば２１０ｍｙｎ以上のアル
ミナ基板を成形しなければならない。このため基板の価
格が非常に高価になってしまう。(Problem to be solved by the invention) To create a close-contact image sensor that is equal to the area of the original,
A plurality of COD or MOS image sensor chips are arranged and mounted in a staggered manner or in a straight line, and it is necessary to mold a long alumina substrate having a length of, for example, 210 myyn or more and having four parts as shown in FIG. Therefore, the cost of the substrate becomes extremely high.
又、四部を有する基板形状のため、イメージセンサチッ
プを千鳥状又は一直線上に配列実装する事は非常に難し
い。Furthermore, because of the substrate shape having four parts, it is very difficult to arrange and mount the image sensor chips in a staggered manner or in a straight line.
又、平坦な基板を用いて、イメージセンサチップを千鳥
状又は一直線上に配列実装しても、基板表面上で反射が
起り雑音光が入射してしまう、特に透明基板の場合、裏
面からもＮ音光が入射してしまう。Furthermore, even if image sensor chips are arranged and mounted in a staggered or straight line using a flat substrate, reflection occurs on the surface of the substrate and noise light enters.Especially in the case of a transparent substrate, noise light also enters from the back side. Sound and light are incident.
以上のように、従来の密着型イメージセンサでは高価で
しかも読取り原稿の鮮鋭度（」ントラスト）が低下して
しまうという欠点がある。As described above, conventional contact type image sensors have the drawbacks of being expensive and reducing the sharpness of the read document.
（問題点を解決するだめの手段）
本発明は前記問題点を解決するため、平坦な透明部材か
らなる基板を用い、前記基板上の基板表面上に第１の黒
色絶縁膜を形成し、イメージセンサと配線導体層の接続
部及び外部との接続部を除く表面上に第２の黒色絶縁膜
を形成してなるイメージセンサを提供するものである。(Means for solving the problem) In order to solve the problem, the present invention uses a substrate made of a flat transparent member, forms a first black insulating film on the surface of the substrate, and The present invention provides an image sensor in which a second black insulating film is formed on the surface of the sensor except for the connection portion between the sensor and the wiring conductor layer and the connection portion with the outside.
（作用）
上記の様に構成されたイメージセンサを用いると、基板
形状が平坦であるため、四部を有する基板形状に成形す
る必要がないという作用がある。(Function) When the image sensor configured as described above is used, since the substrate shape is flat, there is an effect that there is no need to form the substrate into a four-part shape.
又、イメージセンサチップを千鳥状又は−ａ’ｉ Ｉｔ
ｌ上に配列実装する事が非常に容易になるという作用が
ある。Alternatively, the image sensor chips may be arranged in a staggered or -a'i It
This has the effect of making it very easy to implement an array on l.
又、基板に透明部材、例えばガラス等を用いるため、ア
ルミナ等の凹部を有する基板や平坦な基板に比べて基板
価格が低減するという作用がある。Furthermore, since a transparent material such as glass is used for the substrate, the cost of the substrate is lower than that of a substrate having recesses such as alumina or a flat substrate.
又、黒色絶縁膜により基板表面のみならず配線導体層に
おける反射を防ぐ作用がある。Furthermore, the black insulating film has the effect of preventing reflection not only on the substrate surface but also on the wiring conductor layer.
（実施例） 以下、本発明の実施例を図面にもとづいて説明する。(Example) Embodiments of the present invention will be described below based on the drawings.
第１図は本発明によるイメージセンサの一実施例の斜視
図を示している。透明基板１上に配線導体層２及び黒色
絶縁１１１３が順次厚膜印刷、フォトリソグラフィー等
により形成されている。ここで透明基板１としては、石
英ガラスや硼珪酸ガラス、 Ｎａ等のアルカリ元素の拡
散防止処理（例えば３１０２被膜）を施したソーダガラ
スやポリカーボネート、アクリル樹脂等の透明部材が可
能である。FIG. 1 shows a perspective view of an embodiment of an image sensor according to the present invention. A wiring conductor layer 2 and a black insulator 1113 are sequentially formed on a transparent substrate 1 by thick film printing, photolithography, or the like. Here, the transparent substrate 1 may be a transparent member such as quartz glass, borosilicate glass, soda glass treated to prevent diffusion of an alkali element such as Na (for example, 3102 coating), polycarbonate, or acrylic resin.
又、黒色絶縁膜３としては、硼珪酸ガラスやＰｂ〇’
Ｂ２０ｓ ・８１０２に黒色着色剤としてｃｒｏ 、
ｃｒ２０３゜ＨｎＯ２，Ａｉ！ ２０ｓ等を混合した
ものや、黒色のエポキシ樹脂や光硬化樹脂等が可能であ
り、以下に述べるイメージセンサチップ４と配線導体層
２との接続部２ａワイヤボンデイングパツト）及び外部
との接続部２ｂ（コネクタ部）が露出するように形成さ
れている。Further, as the black insulating film 3, borosilicate glass or Pb〇'
B20s ・8102 with cro as a black colorant,
cr203゜HnO2, Ai! A mixture of 20s, black epoxy resin, photocuring resin, etc. can be used as the connection part 2a (wire bonding pad) between the image sensor chip 4 and the wiring conductor layer 2, and the connection part 2b with the outside, which will be described below. (connector part) is exposed.
第２図は、第１図のｘ−ｘ’−にお（Ｊる断面図を示し
ている。黒色絶縁膜３上にダイボンディング剤５を介し
てイメージセンサチップ４が配列固定されている。ここ
でイメージ１′！ンサチツプ４は読取り原稿幅と同一寸
法の読取り幅を得るため、第１図のように複数個のイメ
ージセンサチップ４を一直線上に配列されているが、千
鳥状に配列されていてもかまわない。各イメージセンサ
チップ４は、ＡＵ、 Ａｊ！、 ＣＬＩ等のボンディン
グワイヤー６により配線導体層２にワイＡ７ボンデイン
グパツト２ａに電気的に接続されている。さらに、イメ
ージセンサデツプ４を封止するとともに、読取り原稿面
からの画像光信号７を透過させる透明樹脂８が密着して
いる。ここで透明樹脂８はガラス板やガラスキャップで
もかまわない。FIG. 2 shows a cross-sectional view taken along line xx'- (J) in FIG. 1. Image sensor chips 4 are arrayed and fixed on black insulating film 3 via die bonding agent 5. Here, the image sensor chip 4 has a plurality of image sensor chips 4 arranged in a straight line as shown in FIG. Each image sensor chip 4 is electrically connected to the wire A7 bonding pad 2a on the wiring conductor layer 2 by bonding wires 6 such as AU, Aj!, CLI, etc. A transparent resin 8 is closely attached to the transparent resin 8, which seals the 4 and transmits an image light signal 7 from the surface of the read document.Here, the transparent resin 8 may be a glass plate or a glass cap.
（発明の効果）
このような構成であれば、基板１及び配線導体層２の表
面の大部分が、黒色絶縁膜３で覆われているため、イメ
ージセンサチップ４に雑音光が入射して読取り画像の鮮
鋭度が低下する事を防ぐ事ができた。又、基板１は平坦
な透明部拐、例えばガラス基板でよい事から、凹状及び
平坦上アルミナ基板に比べて、基板価格が約１７５から
１７２０以下と大きく低減した１又、平坦であるためイ
メージセンサチップ４を千鳥状又は一直線上に配列実装
するに際し、実装方法及び実装位置精疾向上が簡単にで
きた。(Effects of the Invention) With this configuration, since most of the surfaces of the substrate 1 and the wiring conductor layer 2 are covered with the black insulating film 3, noise light is incident on the image sensor chip 4 and cannot be read. It was possible to prevent the sharpness of the image from decreasing. In addition, since the substrate 1 can be a flat transparent substrate, for example, a glass substrate, the substrate price is greatly reduced from about 175 to 1720 yen, compared to concave and flat alumina substrates. When the chips 4 are arranged and mounted in a staggered manner or in a straight line, the mounting method and the precision of the mounting position can be easily improved.
又、黒色絶縁膜により基板表面のみならず配線導体層に
おける反射およびイメージセンサチップの実装されてい
る基板表面と反対側の表面から入射する雑音光を防止す
る事により、読取り原稿の光信号が鮮明になり原稿鮮鋭
度が２０％以上向上した。In addition, the black insulating film prevents reflections not only on the board surface but also on the wiring conductor layer and noise light entering from the surface opposite to the board surface where the image sensor chip is mounted, making the optical signal of the read document clear. The sharpness of the original was improved by more than 20%.
尚、本発明は上記実施例に限定されるものではなく、例
えば密着型イメージセンサに限らず、レンズ縮小系に用
いるイメージセンサにも使用可能である。It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be used, for example, not only for contact type image sensors but also for image sensors used in lens reduction systems.
第１図は本発明の一実施例を示す斜視図、第２図は第１
図のｘ−ｘ’における断面図、第３図は従来のイメージ
センサを示す断面図である。
１・・・透明基板
２．３４・・・配線導体層
３・・・黒色絶縁層
４．３１・・・イメージセンサチップ
５．３２・・・ダイボンディング剤
６．３５・・・ボンディングワイヤー
出願人 セイコー電子工業株式会社
−〇 −FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
A cross-sectional view taken along line xx' in the figure, and FIG. 3 is a cross-sectional view showing a conventional image sensor. 1... Transparent substrate 2.34... Wiring conductor layer 3... Black insulating layer 4.31... Image sensor chip 5.32... Die bonding agent 6.35... Bonding wire applicant Seiko Electronics Industries Co., Ltd. −〇 −
Claims (2)
層を形成してなるイメージセンサにおいて、前記基板は
平坦な透明部材からなり、前記基板上の基板表面上に第
１の黒色絶縁膜を形成し、前記イメージセンサと前記配
線導体層の接続部及び外部との接続部を除く表面上に第
２の黒色絶縁膜を形成してなる事を特徴とするイメージ
センサ。(1) In an image sensor comprising an image sensor chip and its wiring conductor layer formed on a substrate, the substrate is made of a flat transparent member, and a first black insulating film is formed on the surface of the substrate. . An image sensor, characterized in that a second black insulating film is formed on the surface of the image sensor and the wiring conductor layer except for the connection part and the connection part with the outside.
個又は複数個を千鳥状又は一直線線上に配列されてダイ
ボンディングにより固定されている特許請求の範囲第１
項記載のイメージセンサ。(2) The image sensor chips are arranged one or more in a staggered manner or in a straight line on a black insulating film and fixed by die bonding.
Image sensor described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61032356A JPS62190755A (en) | 1986-02-17 | 1986-02-17 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61032356A JPS62190755A (en) | 1986-02-17 | 1986-02-17 | Image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190755A true JPS62190755A (en) | 1987-08-20 |
Family
ID=12356675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61032356A Pending JPS62190755A (en) | 1986-02-17 | 1986-02-17 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190755A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04159775A (en) * | 1990-10-23 | 1992-06-02 | Nec Corp | Resin-sealed solid-state image sensing device |
| JP2008078668A (en) * | 2007-09-28 | 2008-04-03 | Kyocera Corp | Package for housing solid-state imaging sensor and imaging device |
| JP2014055211A (en) * | 2012-09-11 | 2014-03-27 | Denso Corp | Epoxy resin and method of producing the same, and curable epoxy resin composition |
-
1986
- 1986-02-17 JP JP61032356A patent/JPS62190755A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04159775A (en) * | 1990-10-23 | 1992-06-02 | Nec Corp | Resin-sealed solid-state image sensing device |
| JP2008078668A (en) * | 2007-09-28 | 2008-04-03 | Kyocera Corp | Package for housing solid-state imaging sensor and imaging device |
| JP4646960B2 (en) * | 2007-09-28 | 2011-03-09 | 京セラ株式会社 | Package for storing solid-state imaging device and imaging apparatus |
| JP2014055211A (en) * | 2012-09-11 | 2014-03-27 | Denso Corp | Epoxy resin and method of producing the same, and curable epoxy resin composition |
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