JPS62190736A - Wire bonding apparatus - Google Patents

Abstract

PURPOSE:To automatically execute wire bonding even if hybrid substrates having different pellet mounting numbers are conveyed by providing common wire bonding information to information forming means in response to the number of pellets to be mounted on a substrate, and wire bonding information to be increased or deleted. CONSTITUTION:An image signal output from an ITV camera 21 is A/D- converted, fed as image data to a recognition controller 22, and the positions of hybrid substrates 12a, 12b, 12c are recognized. Positions on the substrate of each pellet A or positions of pad electrode lead terminal at pellet A are stored as wire bonding information R1. Wire bonding information R2 of each pellet A of the center 12-2 and wire bonding information R3 of each pellet A of right side center 12-3 are stored as pellet wire bonding information. A central controller 25 form wire bonding information corresponding to hybrid substrates 12a-12c conveyed to a line from the information R1-R3 and executes the bonding according to the information.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor assembly apparatus, and particularly to a wire bonding apparatus for hybrid substrates having different numbers of pellets mounted thereon.

[Technical background of the invention]

Conventionally, semiconductor assembly equipment involves mounting multiple pellets on a ceramic substrate (hybrid substrate), and connecting each pad electrode of these pellets to each lead electrode on the substrate using extremely thin gold wire, or wire bonding. be. FIG. 5 shows a hybrid substrate produced by such an apparatus, in which a plurality of pellets 2-1 to 2-n are mounted on the hybrid substrate 1. And wire bonding is like this, pellet 2-1~
Each of the pad electrodes 2-n and the lead electrodes 4 on the hybrid substrate 1 are connected using gold wires. By the way, when wire bonding is actually performed, the hybrid substrates 1 are sequentially transported to a line and wire bonded one by one, so teaching is performed before wire bonding is performed. This teaching can be done, for example, by first performing wire bonding from pellet 2-1 to pellets 2-2, 2-3, to 2-n, then moving the bonding tool etc. to each pellet 2-1 in the order of wire bonding. This is to obtain wire bonding information such as the position on the hybrid substrate 1 of ~2-n, the position of each pad electrode 3, and each lead electrode 4. After this teaching, wire bonding is performed on each hybrid substrate conveyed to the line according to this wire bonding information.

By the way, in such a hybrid substrate 1, even if the shape of the substrate itself is the same and the pellets 2-1 to 2-n of the same type are mounted, each pellet has a different function depending on the number of pellets mounted. Become. For example, pellet 2
-1.2-2 is deleted and manufactured as a hybrid board with a different function. In such a case,
Teaching is performed again on the hybrid board from which pellets 2-1 and 2-2 have been removed to obtain its wire bonding information. Each wire bonding information for each of these hybrid boards 1 having different functions is stored in a storage medium such as one floppy disk for each hybrid board 1, and the corresponding floppy disk is used each time the hybrid board is manufactured. bonding.

[Problems with background technology]

However, the above wire bonding apparatus has the following problems. That is, ■ wire bonding information is created for each functional hybrid board 1 and stored on each floppy disk, so it takes time to create the wire bonding information, and the type of hybrid board 1 As a result, the number of floppy disks increases, making it difficult to manage them.

(2) Furthermore, when the type of hybrid board 1 changes, wire bonding cannot be performed immediately depending on the hybrid board 1.

[Purpose of the invention]

The present invention has been made based on the above-mentioned circumstances, and its purpose is to provide a wire bonding device that can automatically perform wire bonding according to the hybrid substrates even when hybrid substrates with different numbers of pellets are transported. Our goal is to provide the following.

[Summary of the invention]

The present invention provides a first storage means for storing common wire bonding information for a hybrid board with a predetermined number of pellets mounted, and wire bonding information for each pellet added and deleted from the hybrid board of the common wire bonding information. and a second storage means for storing the information, and the information creation means reads out the common wire bonding information and the wire bonding information to be increased or deleted according to the number of pellets mounted on the hybrid substrate to be conveyed to the line. This is a wire bonding apparatus that creates wire bonding information for a hybrid board being transported and performs wire bonding.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram of a wire bonding apparatus. In the figure, 10 is a wire bonding mechanism, and 11 is a transport positioning section for each hybrid board 12. The wire bonding head mechanism 10 is mounted on an XY table 13 and is configured to be able to move the bonding execution position on each hybrid substrate 12, and is configured to move the bonding execution position on each hybrid board 12 according to the control of the wire bonding control driver section 14. The wound gold wire 16 is sent to a bonding tool 18 through a clamper 17. Note that during wire bonding, the tip of the gold wire 16 is melted with an electric torch (not shown) to form a ball shape, and the pad electrode of the pellet 28 and the lead electrode on the substrate 12 are bonded. By the way, the hybrid substrates 12 conveyed on the line of the conveyance positioning section 11 are, for example, three types of hybrid substrates 12a, 12b, 12G as shown in FIG.
It becomes. That is, these vibe IJy board 12a, 12b, 12c4; L, pellets A of the same type are configured to have different numbers of mounted pellets, each having a different function.

Pellet A of hybrid substrates 12a, 12b, 12c
If the maximum number of pellets mounted is 3 in the horizontal direction and 4 in the vertical direction, making the total number 12, then in the hybrid board 12a, the two pellets in the central part 12-2 are deleted, and the result is shown in FIG. 2(a).
It is assumed that the array is arranged as shown in the figure and has a predetermined function. Further, the hybrid board 12b is loaded with all the pellets A as shown in FIG. It is assumed that the configuration is such that two of each pellet of No. 12-3 are deleted.

Reference numeral 19 denotes a substrate position recognition means, which images each hybrid substrate 12 and identifies each hybrid substrate 12a, 12b, 1.
It has a function to recognize the position of 2c. Specifically, each hybrid substrate 12a, 1 is
An ITV camera (industrial television camera) 21 is provided to image the images 2b and 12c, and the image signal output from the ITV camera 21 is A/D converted (analog/digital conversion) and recognized as image data by the control unit 22. It is now sent to This recognition control unit 22 includes each hybrid board 12a, 12b.

This is to recognize the position of 12C.

On the other hand, 23 is a disk device constituting first and second storage means, and this disk device 23 includes a floppy disk 24 storing wire bonding information for bonding each hybrid board 12a, 12b, 12C. It is intended to be inserted. by the way,
The wire bonding information stored in this floppy disk 24 is as shown in FIG. Here, the hybrid substrate most manufactured on the line is 12a
If so, for this hybrid board 1.28. Wire bonding information R1 is stored as common wire bonding information. This wire bonding information R1 is stored as the position of each pellet A on the substrate, the position of each pad electrode lead terminal on each pellet A, etc. by teaching. Further, wire bonding information R of each pellet A in the central portion 12-2
The wire bonding information R3 of each pellet A of 2 and the right center portion 12-3 is stored as pellet wire bonding information.

Reference numeral 25 denotes a central control section, which has the function of issuing commands to execute bonding according to the wire bonding control flowchart shown in FIG. 4, and particularly has the following information creation function 25a. . In other words,
When the hybrid boards 12a, 12b, 12C are conveyed by inputting an instruction from an external device, that is, an operator, the recognition control unit 22 recognizes the positions of the boards 12a, 12b, 12c, and after receiving this position recognition information, the instructions are issued. The wire bonding information R1 and R2 or R3 necessary for the hybrid board 12a112b, 12C is read from the floppy disk 24 inserted into the disk device 23, and from this wire bonding information R1 and R2 or R3, the hybrid board being conveyed to the line is Board 1
This function creates wire bonding information corresponding to 2a112b and 12c and executes bonding according to this information. , 26 is an XY double control driver section, 2
7 is a substrate positioning control section.

Next, the operation of the apparatus configured as described above will be explained according to the bonding control flowchart shown in FIG. First, as shown in FIG. 2(a), a hybrid substrate 1 is
2a is conveyed onto the line, this hybrid substrate 12a is imaged by an ITV camera 21 through an optical system 20, and the image signal is A/D converted, and then sent to the recognition control unit 22 as image data to be sent to the hybrid board 12a. Substrate 12a
The central control unit 25 makes a recognition determination as to whether or not this is the case. As a result of this recognition determination, if it is determined that the hybrid board 12a is the hybrid board 12a, the process moves from step S1 to step S2, and the central control unit 25 receives the recognition determination result and removes the hybrid board 12a from the floppy disk 24 inserted into the disk device 23. The wire bonding information R1 is read out and bonding is performed in step s3 according to this wire bonding information R1. Then, when it is determined in step S4 that bonding for one of the hybrid substrates 12a is completed, the process moves to step S1 again to determine the hybrid substrate 12a, and if the same hybrid substrate 12a is transferred, the same process as above is performed. Bonding is performed by the operations from step S2 to step S4.

Here, when the wire bonding of the hybrid board 12a is completed and the wire bonding of the hybrid board 12b is to be performed next, when the hybrid board 12b is conveyed to the line, the central control unit 25 uses the ITV camera 21 to take an image of the hybrid board 12b. Based on the board recognition result in the recognition control unit 22, it is determined whether the hybrid board that has been detected is the hybrid board 12b, and the hybrid board 12b is
If it is recognized as b, step S5 to step S6
Then, the process moves to S7, and wire bonding information R1 and wire bonding information R2 for the hybrid board 12a are read from the floppy disk 24 inserted into the disk device 23.

Then, the central control unit 25 adds wire bonding information R2 corresponding to the central portion 12-2 to the wire bonding information R1 to create wire bonding information for the hybrid board 12b, and then in step S9 according to this wire bonding information, Wire bonding to the substrate 12b is performed. Note that when the hybrid board 12a is changed to 12b, the wire bonding information is created by reading the wire bonding information R1 and the wire bonding information R2, but the operator directly changes the central part 12-
The wire bonding information No. 2 is inputted and stored in the memory in the central control unit 25, and then the wire bonding information for the hybrid board 12b is created from this wire bonding information and the wire bonding information of the hybrid board 12a. It's okay.

Further, when the wire bonding of the hybrid board 12b is completed and the wire bonding of the hybrid board 12c is to be performed next, when the hybrid board 12c is conveyed to the line, the central control unit 25
It is determined whether the hybrid board imaged by the ITV camera 21 is the hybrid board 12c based on the board recognition result by the recognition control unit 22, and the hybrid board 12 is
If it is recognized as G, step s11 to step s
12, proceeding to S13, the wire bonding information R1 and the wire bonding information R3 for the hybrid board 12a are read from the floppy disk 24 inserted into the disk device 23. Then, the central control unit 2
5 is the center right side from wire bonding information R1 8I11
Wire bonding information R3 corresponding to numbers 2 and 3 is deleted to create wire bonding information for the hybrid board 12c, and then wire bonding is performed for the hybrid board 12G in step s15 according to this wire bonding information.

In the above-mentioned embodiment, the first storage means stores the common wire bonding information R1 for the hybrid board 12a, and each pellet added and deleted for the hybrid board 12a of the common wire bonding information R1. Hybrid substrates 12a, 12b, 12C that have second storage means for storing wire bonding information R2 and R3 for A and are transported on the line.
According to the number of pellets loaded above, the information creation function reads the common wire bonding information R1 and the wire bonding information R2, R3, creates wire bonding information for the hybrid board being conveyed to the line, and executes wire bonding. , hybrid substrates 12a, 12b, 12c with different numbers of pellets A loaded.
Even if the hybrid substrates 12a, 12
b.

12C, wire bonding information can be automatically created and bonding can be performed.

When a floppy disk is used as a means for storing wire bonding information, only one floppy disk is required, which facilitates management of the floppy disk.

Note that the present invention is not limited to the above-mentioned embodiment, and can be modified without departing from the spirit thereof.

For example, in the above embodiment, the wire bonding information of the hybrid board 12a is used for common use, but the invention is not limited to this, and the wire bonding information of the hybrid board 12b or 12G may be used for common use. Further, as the first and second storage means for storing wire bonding information, a magnetic tape or the like may be used instead of a floppy disk. Further, the substrate position recognition means 19 does not discriminate between the hybrid substrates 12a, 12b, and 12c, but rather determines whether the pellets A, B, or
, C may be directly determined.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a wire bonding apparatus that can automatically perform wire bonding in accordance with hybrid substrates even when hybrid substrates with different numbers of pellets loaded are conveyed.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing one embodiment of a wire bonding device according to the present invention, Fig. 2 is a diagram showing each hybrid board with a different number of pellets mounted, and Fig. 3 is a schematic diagram showing wire bonding information in the device of the present invention. 4 is a wire bonding control flowchart of the device of the present invention, and FIG.
The figure is a diagram for explaining the operation of a conventional wire bonding device. DESCRIPTION OF SYMBOLS 10... Bonding mechanism, 11... Transport positioning part, 12a, 12b, 12cm... Hybrid board,
13... XY table, 14... Bonding control driver section, 16... Gold wire, 17... Clamper, 1
8... Bonding tool, 19... Substrate position recognition means, 20... Optical system, 21... ITV camera, 2
2... Recognition control unit, 23... Disk device, 24...
... Floppy disk, 25 ... Central control section, 25
a... Information creation function.

Claims (1)

[Claims] In a wire bonding apparatus for hybrid substrates having different functions depending on the number of pellets loaded and sequentially conveyed to a line, a first storage means for storing common wire bonding information for hybrid substrates having a predetermined number of pellets loaded; a second storage means for storing wire bonding information for each pellet that is added to and deleted from the hybrid substrate of the common wire bonding information in order to have a function; and a second storage means for storing the wire bonding information for each pellet that is added to and deleted from the hybrid substrate in order to have the common wire bonding information, and the pellet mounting on the hybrid substrate that is conveyed to the line. and information creation means for reading out the common wire bonding information and the wire bonding information for each of the increased and deleted pellets according to the number of pellets, and creating wire bonding information for the hybrid substrates to be conveyed to the line. Characteristic wire bonding equipment.