JPS62189883A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To prevent deterioration in the characteristic of a picture by coating the side surface of an optical-fiber bundle adhered to the image pickup plane of a solid-state image pickup element with a transparent resin, with a light- absorbing material or light-shielding material. CONSTITUTION:An image formed on the photoelectric plane 2a of an image intensifier 2a lens 1, optically amplified and outputted to a fluorescent plane 2b, and further, transmitted through the optical fiber bundle 5 and made incident to the image pickup plane 4a of the solid-state image pickup element 4. Then the element 4 executes photoelectric conversion and outputs the result as an electric signal. On the surface of the bundle 5, a light-shielding chromium is vapor-deposited. An external light is shielded by the said chromium 7 and c an not enter the bundle 7 from its side surface. Therefore, the occurrence of noise is prevented, hence the characteristic of a picture does not deteriorate.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a solid-state imaging device that can be used in an ultra-high sensitivity camera.

(Prior Art) In recent years, solid-state imaging devices with long lifespan and high reliability have been widely used in various fields. For example, optical fiber bundles and image intensifiers are installed on the imaging surface of solid-state imaging devices. There is a solid-state imaging device that is installed and used as the imaging unit of an ultra-high-sensitivity camera. Such a solid-state imaging device will be explained with reference to FIGS. 2 and 3.

Figure 2 is a configuration diagram of the imaging section of an ultra-high sensitivity camera, with lens 1
The image focused on the photocathode 28 of the image intensifier 2 is amplified in light intensity and output to the phosphor screen 2b. The solid-state imaging device has an optical fiber bundle 5 attached to an imaging surface 4a of a solid-state imaging device 4 fixed to the bottom of a frame-shaped package 3.
One of the light-transmitting surfaces 5a is adhered with a light-transmitting resin, and further,
The opening of the package 3 is covered with a sealing plate 6 so as to surround the optical fiber bundle 5 mentioned above. Further, the image intensifier 2 has its phosphor screen 2b adhered to the other light transmitting surface 5b of the optical fiber 5, thereby forming an imaging section of an ultra-high sensitivity camera.

The operation of the imaging section configured in this way will be explained.

The image connected to the photocathode 2a of the image intensifier 2 by the lens 1 is optically amplified and outputted to the phosphor screen 2b, and transmitted through the optical fiber east 5 to the imaging surface 4 of the solid-state image sensor 4.
When incident on a, the solid-state image sensor 4 performs photoelectric conversion, and 1
Outputs 1 as a low signal.

(Problems to be Solved by the Invention) However, in the above configuration, as shown in the partially enlarged view of FIG. Both have different refractive indexes, but are both transparent, and light incident on the side surface of the optical fiber bundle 5 enters the inside while being repeatedly refracted, as shown by the optical path A shown by the solid line in Figure 1. As shown in FIG. 3, in this way, the light incident from the side surface of the optical fiber east 5 directly enters the imaging surface 4a of the solid-state imaging cable 4 as shown by the optical path A. Furthermore, as shown in the optical path B, the light that enters from the side of the optical fiber bundle 5 at a low inclination angle is transmitted through the optical fiber bundle 5, hits the frame surface of the package 3, and is diffusely reflected, and a part of the light is reflected again. The light enters from the side of the fiber bundle 5, is refracted, and enters the imaging surface 4a. Since such light is also photoelectrically converted, there is a problem in that it becomes noise in the image signal and deteriorates the characteristics of one image.

The present invention solves the above problems and provides a solid-state imaging device that can prevent external light from entering from the side of the optical fiber east 5.

(Means for solving the problem) In order to solve the problem mentioned above, the side surface of the optical fiber bundle bonded to the imaging surface of the solid-state image sensor with a translucent resin is covered with a light-absorbing material or a light-blocking material. It is something to cover.

(Function) The configuration described above prevents external light from entering from the side of the optical fiber bundle, thereby preventing deterioration of image characteristics.

(Example) An example of the present invention will be described with reference to FIG. The configuration of the solid-state imaging device according to the present invention is the same as the conventional example shown in FIG. 2, so the same components are given the same symbols and their explanations will be omitted.

In the figure, an optical fiber bundle 5 according to the present invention has light-shielding chromium 7 deposited on its side surface. This blackout chrome 7
As a result, external light does not enter from the side of the optical fiber bundle 5, thereby preventing noise generation and deterioration of image characteristics.

Furthermore, it is even more effective if the entire shoulder surface of the package 3 is coated with a light-absorbing material or a light-shielding material.

(Effects of the Invention) As described above, according to the present invention, it is possible to obtain a noise-free solid-state imaging device by blocking external light entering the optical fiber using extremely simple means.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a solid-state imaging device according to the present invention. FIG. 2 is a configuration diagram of an imaging section of an ultra-high sensitivity camera, and FIG. 3 is a sectional view of a conventional solid-state imaging device and a partially enlarged model diagram thereof. 1... Lens, 2... Image intensifier, 28... Photocathode, 2b... Fluorescent screen, 3...
- Package, 4... Solid-state image sensor, 4a... Imaging surface, 5... Optical fiber bundle, 5a. 5b... Light transmitting surface, 6... Sealing plate, 7... Shading chrome, A, B... Optical path. Patent applicant: Matsushita Electronics Co., Ltd. Figure 1 Figure 2 Figure 3

Claims (2)

[Claims] (1) In a solid-state imaging device in which a light-transmitting surface of an optical fiber bundle is adhered to an imaging surface of a solid-state imaging device with a transparent resin,
A solid-state imaging device characterized in that a side surface of an optical fiber bundle is coated with a light-absorbing material or a light-blocking material. (2) In a solid-state imaging device in which a light-transmitting surface of an optical fiber bundle is adhered to an imaging surface of a solid-state imaging device with a transparent resin,
A solid-state imaging device characterized in that a side surface of an optical fiber bundle is coated with a light-absorbing material or a light-shielding material, and an outer surface of the shoulder surface of the package is coated with a light-absorbing material or a light-shielding material.