JPS62189136U - - Google Patents

Info

Publication number
JPS62189136U
JPS62189136U JP7808786U JP7808786U JPS62189136U JP S62189136 U JPS62189136 U JP S62189136U JP 7808786 U JP7808786 U JP 7808786U JP 7808786 U JP7808786 U JP 7808786U JP S62189136 U JPS62189136 U JP S62189136U
Authority
JP
Japan
Prior art keywords
led array
drive circuit
power supply
array chip
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7808786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7808786U priority Critical patent/JPS62189136U/ja
Publication of JPS62189136U publication Critical patent/JPS62189136U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Laser Beam Printer (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の要部斜視図、第２
図は電源給電ラインに供給する駆動パルスの波形
図、第３図は従来のＬＥＤアレイプリントヘツド
の要部斜視図、第４図は駆動回路ＩＣのブロツク
図。 １１……ＬＥＤアレイチツプ、１２……駆動回
路ＩＣ、１３……セラミツクベース、１４ａ，１
４ｂ，１４ｃ，１４ｄ……電源給電ライン、１５
……ボンデイングワイヤ。 Figure 1 is a perspective view of essential parts of an embodiment of the present invention;
The figure is a waveform diagram of drive pulses supplied to the power supply line, FIG. 3 is a perspective view of the main parts of a conventional LED array print head, and FIG. 4 is a block diagram of the drive circuit IC. 11... LED array chip, 12... Drive circuit IC, 13... Ceramic base, 14a, 1
4b, 14c, 14d...Power supply line, 15
...Bonding wire.

Claims (1)

【実用新案登録請求の範囲】 基板上に直線状に整列された複数のＬＥＤアレ
イチツプ及び当該各ＬＥＤアレイチツプを駆動す
る複数の駆動回路ＩＣを塔載したＬＥＤアレイプ
リントヘツドにおいて、 前記基板上に少なくとも一系統は異なる電力を
供給する複数系統の電源給電ラインを設け、前記
各ＬＥＤアレイチツプの発光出力特性に応じ当該
各ＬＥＤアレイチツプに対応した各駆動回路ＩＣ
を前記各電源給電ラインのいずれかに選択的に接
続してなることを特徴とするＬＥＤアレイプリン
トヘツド。[Claims for Utility Model Registration] In an LED array print head, in which a plurality of LED array chips linearly arranged on a substrate and a plurality of drive circuit ICs for driving each of the LED array chips are mounted, at least one LED array chip is mounted on the substrate. The system includes a plurality of power supply lines that supply different power, and each drive circuit IC corresponding to each LED array chip is connected according to the light emission output characteristics of each LED array chip.
selectively connected to any one of the power supply lines.
JP7808786U 1986-05-26 1986-05-26 Pending JPS62189136U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7808786U JPS62189136U (en) 1986-05-26 1986-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7808786U JPS62189136U (en) 1986-05-26 1986-05-26

Publications (1)

Publication Number Publication Date
JPS62189136U true JPS62189136U (en) 1987-12-02

Family

ID=30926705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7808786U Pending JPS62189136U (en) 1986-05-26 1986-05-26

Country Status (1)

Country Link
JP (1) JPS62189136U (en)

Similar Documents

Publication Publication Date Title
JPS62189136U (en)
JPH0390956U (en)
JPH0390958U (en)
JPS60146365U (en) light emitting diode array head
JPH0183552U (en)
JPH01106241U (en)
JPS60146364U (en) light emitting diode array head
JPS62187746U (en)
JPS63119042U (en)
JPH0224561U (en)
JPS62167645U (en)
JPS62178155U (en)
JPS63198546U (en)
JPS61124151U (en)
JPS62162858U (en)
JPH0170548U (en)
JPS6157540U (en)
JPS61201352U (en)
JPS6283640U (en)
JPS6125151U (en) optical printer head
JPS6238154U (en)
JPH0234251U (en)
JPS63153561U (en)
JPS6349945U (en)
JPS6347142U (en)