JPS62188665A - Device for polishing rotary body - Google Patents

Abstract

PURPOSE:To polish a face precisely and uniformly by rotating a rotary body of a cylindrical shape, etc. centering around a symmetrical shaft, moving a polishing tape in the same direction as, and at a different speed from, its outer peripheral face, and bringing it into pressure contact with the face in a state of sliding contact, while enabling said tape to be also moved in a mother line direction. CONSTITUTION:A workpiece 1 is rotated in the C direction, a polishing tape 2 is moved in the D direction and brought into pressure contact with a rotating face 10a adjustably in the A direction by a pressure-contact means 3 and, due to difference in the speed of both, the rotating face 10a and the polishing face of the tape 2 are slidingly rubbed with each other, to carry out polishing. Since the pressure-contact means 3 brings the polishing tape 2 into pressure contact with the machining face 10a in a state of sliding contact along its mother line Y, a pressure contact at a uniform pressure can be carried out to effect a uniform and precise polishing. Also, since both are moving in the same direction, a foreign matter such as polish dust, etc. can be rapidly removed. On the other hand, the positions of the polishing tape 2 and the pressure-contact means 3 can be changed in the arrow B direction, a defined position of the machining face 10a can be efficiently polished.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an apparatus for polishing the surface of a workpiece having a rotating body shape such as a cylinder while rotating it. The present invention relates to a polishing apparatus suitable for polishing workpieces that require uniform surface polishing.

[Conventional technology]

Electrophotographic photoreceptors used in electrophotographic processes are known to have various configurations depending on the type of electrophotographic process to which they are applied. A typical example is one that consists of:

The most common electrophotographic process consists of charging an electrophotographic photoreceptor, forming a latent image by exposing the charged photoreceptor to light, developing the latent image to make it visible, and converting the developed image to the desired state. It includes a transfer process, and these processes are mainly performed by utilizing the function of the photoconductive layer.

In addition, on the outermost surface of the electrophotographic photoreceptor, for example, protection of the photoconductive layer, improvement of the mechanical strength of the photoreceptor, improvement of dark decay characteristics,
Alternatively, a protective layer is provided as necessary for application to a specific electrophotographic process.

Such an electrophotographic photoreceptor is required to have predetermined sensitivity, electrical properties, or optical properties depending on the electrophotographic process to which it is applied.

The photoconductive layer of an electrophotographic photoreceptor has traditionally been composed of materials exhibiting photoconductivity such as amorphous selenium and OPC, but in recent years, materials that have excellent properties and good properties have been used as materials constituting the photoconductive layer. Amorphous materials containing silicon atoms that can provide mechanical durability, so-called amorphous silicon materials, are attracting attention.

On the other hand, as the above-mentioned protective layer provided on the electrophotographic photoreceptor,
It has a high Vickers hardness (JIS B??74) and is excellent in the above characteristics required for a protective layer. A layer (hereinafter referred to as an SiC layer) made of an amorphous material containing silicon atoms and carbon atoms, and further containing hydrogen atoms as necessary, has come to be used.

[Problem that the invention seeks to solve]

However, in electrophotographic photoreceptors that have a SiC layer as a protective layer on the outermost surface, unevenness in the layer thickness tends to occur in the protective layer provided on the outermost surface due to the influence of wear during manufacturing or during use. The thickness unevenness in the SiC layer is 100 to 800 depending on the thickness difference between the thick and thin parts.
This often occurs within the range A, and is a factor that causes variations in the sensitivity of the electrophotographic photoreceptor, which causes density unevenness in images.

Therefore, it is necessary to correct the unevenness in the thickness of the protective layer on the surface of the photoreceptor at the crossroads of production or after a certain amount of usage time has passed.

To correct such layer thickness unevenness, a method of polishing the surface of the protective layer can be applied, but since the Vickers hardness of the SiC layer is extremely high, for example, 1000 kg/am2 or more, cerium oxide, alumina, etc. The conventional polishing techniques used did not provide sufficient technical effects, and it was extremely difficult to correct layer thickness unevenness on the order of .

The present invention was made in view of these problems, and an object of the present invention is to provide an apparatus capable of precisely and uniformly polishing the surface of a workpiece having a rotating body shape such as a cylindrical shape.

Another object of the present invention is to provide an apparatus capable of precisely and uniformly polishing a processed surface made of a material having high hardness, such as an electrophotographic photoreceptor having a SiC surface layer.

Another object of the present invention is to provide an apparatus that automatically searches for a polished part and performs surface polishing with a predetermined accuracy.

[Means for solving problems]

The above object can be achieved by the following invention.

In other words, the rotating body polishing apparatus of the present invention includes a workpiece rotation means for rotating a workpiece having the shape of a single rotating body around an axis of symmetry of the rotary body shape; a polishing tape that polishes the rotating surface by being brought into sliding contact with the rotating surface while moving at a speed different from the moving speed of the rotating surface; and pressure contact means for pressing the polishing tape into sliding contact.

Hereinafter, the apparatus of the present invention will be explained in detail using the drawings.

The basic configuration of the device of the present invention is shown in FIG.

FIG. 1(A) is a view from the front side of the workpiece when the workpiece to be polished is placed in the apparatus of the present invention, and FIG. 1(B) is a view from the side side of the workpiece. This is a diagram from .

The apparatus of the present invention basically includes a workpiece rotation means 1 for rotating a workpiece 1O having a rotating body shape (in this case, a cylindrical shape) to be polished, and a predetermined rotation surface 10a of the workpiece 10.
A polishing tape 2 (shown in cross section in FIG. 1(A)) is pressed against a predetermined rotation surface LOa of the workpiece, and the polishing tape 2 is pressed against a predetermined rotation surface LOa of the workpiece. It is configured to have a pressure contact means 3 for doing so.

The workpiece rotation means 1 has the function of supporting the workpiece 10 and rotating it around the symmetrical axis X of its rotating body shape, and can take various configurations as desired.

The polishing tape 2 has a polishing surface for polishing the rotating surface 10a on the side that comes into sliding contact with the rotating surface 10a of the workpiece 10, and is made of various materials such as the material of the surface of the workpiece 10, the desired amount of polishing, and the like. An appropriate one is used depending on accuracy etc.

The pressing means 3 has a function of uniformly pressing the polishing tape 2 against the rotating surface 10a of the workpiece 10 with a pressure according to a predetermined polishing state, polishing amount, etc. The mechanism for pressing the polishing tape 2 against the workpiece lO by the pressure contact means 3 is such that the pressure contact means 3 can be advanced in the direction of arrow A, that is, with a predetermined pressing force toward the workpiece lO during the polishing process. In addition, there is a structure in which the workpiece can be retreated from the surface of the workpiece at the end of polishing, or a structure in which the pressure contact means 3 is fixed in position and the workpiece 10 is pressed against the pressure contact means 3 during the polishing process. can be mentioned.

Note that the shape of a rotating body of a workpiece as used in the present invention refers to a three-dimensional shape created by rotating a plane figure composed of straight lines around an arbitrary straight line on the same plane, such as a cylinder, a cone, a cone, etc. This includes a stand or a hollow body of these.

[Effect]

The polishing tape 2 is provided so as to move in the forward direction (in the direction of the arrow) with respect to the rotating surface 10a at a speed different from the moving speed of the rotating surface 10a of the workpiece tO to which it is pressed. The rotating surface 10a of the workpiece 10 is pressed against the rotating surface 10a with a predetermined pressure, and due to the difference in moving speed between the polishing tape 2 and the rotating surface 10a, the rotating surface 10a of the workpiece 10 and the polishing surface of the polishing tape 2 are rubbed and rotated. The plane IQa is sharpened.

Further, since the pressing means 3 is provided so as to press the polishing tape 2 in sliding contact along the generatrix Y of the rotating body shape of the workpiece 10, the polishing tape 2 is pressed against the rotating surface 10a with uniform pressure. This results in an even and precise polishing effect. In addition, the pressure at which the polishing tape 2 is brought into contact with the polishing tape 2 can be easily adjusted, and a desired polishing state can be easily obtained.

Furthermore, since the rotating surface 10a and the polishing tape 2 move in the forward direction, foreign matter such as polishing scum is quickly removed from between the polishing tape 2 and the rotating surface lea, and it does not stay there, which is a good result. A polishing effect can be obtained.

By configuring the rotating body shape of the polishing tape 2 and the pressure contact means 3 so that their positions in the generatrix Y direction (arrow B direction) can be changed, the entire surface of the workpiece or a predetermined position can be effectively polished. It's me.

〔Example〕

The present invention will be described in detail below with reference to one drawing.

FIG. 2 shows an embodiment of the apparatus of the present invention, which polishes the surface of a workpiece having a cylindrical shape and having a hydrogenated 7-morphous silicon carbide (a-3iCH) layer as a SiC layer on the surface. This is a device that implements this. In addition, Figure 2 (
A) is a partial view from the side of the workpiece when the workpiece to be polished is placed in the apparatus of the present invention, and FIG. 2(B) is a partial view from the front side of the workpiece. It is a diagram. In addition,
In these figures, the workpiece is represented in a cross-sectional view or a partial cross-sectional view.

In this apparatus, a cylindrical workpiece 210 is rotated in the direction of arrow C at a predetermined speed by a workpiece rotation means (not shown) about the axis of symmetry X of the rotating body shape.

The polishing tape 202 (the cross section of which is shown in FIG. 2(B)) is a lapping tape LT-2000 having a polishing surface to which crystalline SiC particles are fixed as an abrasive.
(trade name, manufactured by Fuji Photo Film Co., Ltd.) is used. A weight 205 is connected to the tip of the polishing tape 202, and during the polishing process, the polishing tape 202 is moved from the state where it is wound around the take-up roller 208 to the weight 205.
The workpiece 210 is pulled by the weight of the workpiece 210 and sent out, and moves in the rotational direction (arrow C direction) and the forward direction (arrow direction) of the workpiece 210. The speed at that time is adjusted by the supply roller 204 connected to a motor 204a driven at a rotation speed corresponding to a desired polishing tape feed speed.

Note that the mechanism for feeding out the polishing tape 202 is not limited to the mechanism shown in the example shown in FIG. Various options can be selected, such as a mechanism for winding up at a predetermined speed using this winding roller.

The moving speed of the polishing tape 202 is at least as high as the workpiece 2
No. 10 rotating surface 210a to be polished and polishing tape 20
The speed is set to be different from that of the rotating surface 210a so as to obtain a sliding state with the rotating surface 210a, that is, a polishing effect.

The pressure contact means 203 includes a pressure contact member 203a and a pressure contact member 20.
3a, and a pressure contact member 203a.
It is configured to have a weight 203C for generating a predetermined pressure, and is provided so as to be movable in the direction shown by arrow A. The pressing member 203a preferably has a cylindrical shape, and is arranged so that its central axis is parallel to the generatrix Y of the rotating body shape of the workpiece 210 by the support body 203b, and as a result, as shown in FIG. As shown in (B), the polishing tape 20 is placed along the generatrix Y of the rotating body shape of the workpiece 21G.
2 sliding contact surfaces can be obtained.

Note that the shape of the pressure contact member 203a may be any one having a cylindrical outer shape, and it does not matter whether it has a hollow portion or not.
Alternatively, as shown in FIG. 3(B), it may be configured as a convex curved surface 303a integrated with a support 303b.

The size of the pressing member 203a is suitable for uniformly applying a predetermined pressure to the polishing tape 202, and may be adjusted as appropriate depending on the type, shape and size of the workpiece to be polished, or the type of polishing tape. It is to be determined.

As in this example, a-S i 08 layer 2 on the surface
For example, in order to precisely polish the workpiece 210 having the diameter of
It is preferable that the diameter is 5 mm to 20 m, the length is 5 mm to 5 G mm, and the error in parallelism is within 10 μs. That is, if the diameter and length of the pressing member 203a exceed the above values, the contact area between the polishing tape 202 and the workpiece 210 increases, making it difficult to apply uniform pressure; In this case, this contact area decreases and good polishing efficiency cannot be obtained. On the other hand, if the error in parallelism becomes larger than the above value, it becomes impossible to uniformly contact the polishing tape 202 with the workpiece 210. In order to perform a good polishing operation, it is preferable to reduce the frictional resistance between the pressing member 203a and the polishing tape 202 by covering the pressing member 203a with a Teflon tape or the like.

Weight 2 when performing polishing processing with this device
The operating conditions such as the weight of 03C1205, the feeding speed of the polishing tape, the rotation speed of the workpiece 210, and the polishing time of the polished surface are determined depending on the type, shape and size of the workpiece, the desired amount of polishing, etc. be selected as appropriate.

In addition, in order to obtain a good polishing effect without causing foreign matter such as polishing scum to remain between the polishing tape 202 and the rotating surface 210a, the weight of the weight 203c should be set to 100 g to 2 kg, and the feeding speed of the polishing tape 202 should be adjusted. It is preferable to set the speed to 10 mm/hr or more.

In addition, in order to obtain the desired amount of polishing on the surface of the workpiece, the weight of the weight 203c, the feeding speed of the polishing tape, the rotation speed of the workpiece 210, the polishing time, etc. may be adjusted as appropriate, as described above. In order to carry out more precise and accurate polishing in the A order, it is better to adjust the amount of polishing based on the polishing time.

On the other hand, the pressure contact means 203 and the polishing tape 202 are positioned in the direction of the generating line Y of the rotating body (arrow B) shown in FIG. 2(B).
The polishing process can be performed while changing the polishing position of the workpiece 210 as desired.

The mechanism for changing the positions of the pressure contact means 203 and the polishing tape 202 can be obtained by a configuration in which the pressure contact means 203 and the polishing tape 202 themselves are provided movably, and/or the workpiece 210 is provided movably.

In this apparatus, the surface of the protective layer of an electrophotographic photoreceptor having a structure in which a photoconductive layer is formed of hydrogenated amorphous silicon on a cylindrical substrate with a diameter of 100 mm is coated with a weight of a weight 205 of 800 g and a feeding speed of a polishing tape 202 of 160 seconds.
■ When polishing was performed with the movement speed of the surface of the protective layer 211 accompanying rotation being 1000 layers/sec, IO
It was possible to perform the polishing process on the order of A/■in, that is, on the order of A/■in.

Furthermore, the apparatus of the present invention includes a measuring device for measuring the thickness of the portion of the workpiece 210 to be polished, and a mechanism for changing the position of the pressing means 203 and the polishing tape 202 in the generatrix Y direction as described above. In combination with.

For example, the a-5icH surface layer 211 can be a device that automatically searches the polishing position and controls the polishing amount.
When polishing an electrophotographic photoreceptor having
By measuring the interference peak of the a-9iCH layer, the thickness of the aJiCH layer can be measured.

Specifically, 1, for example, a spectrometer MCPD-2 for reflected light analysis.
A device 212 capable of measuring interference peaks such as 00 (manufactured by Union Giken Co., Ltd.) is provided so as to be always installed at a position corresponding to the pressure contact means 203 and the polishing tape 202 as shown in FIG. a-S408 of workpiece 210
Next, the interference peak of the layer 211 is measured at the 0th order, and this measurement value and the wave number (K) and a given in advance as data are
-3i From the refractive index (n÷1.9) of the CtI layer, the computer 213 automatically calculates a-S4 using the equation for thin film interference;
The thickness of the 08 layer 211 is calculated. At this time, a-Si
C) If the film thickness at the measurement position of the calendar 211 is thicker than the predetermined film thickness, the polishing tape 202 is brought into pressure contact with the surface of the a-9iCH layer by the pressure contact means 203 to perform the polishing process. When the film thickness at the part reaches a predetermined film thickness, the polishing process is stopped, and the pressing means 203 and the polishing tape 2
02 in the direction of the generatrix Y of the rotating body shape, and when a part thicker than a predetermined film thickness is detected by the spectrometer 212, that part is polished. Polishing can be performed automatically while controlling the film thickness in the axial direction.

〔Effect of the invention〕

According to the rotating body polishing apparatus of the present invention as described in detail above, the polishing tape is uniformly pressed against the polishing surface of the rotating workpiece by the tape pressure contacting means at a predetermined pressure. Surface polishing can be performed evenly. Furthermore, since the polishing process is performed while the polishing tape and the workpiece are moving in the forward direction, no polishing scum remains on the polishing surface, and a good polishing effect can be obtained.

Moreover, the operating conditions such as the type of abrasive tape, the pressure when pressing the abrasive tape, the speed at which the abrasive tape is fed, and the rotational speed of the workpiece can be easily adjusted according to the material, shape, and size of the workpiece. A desired polishing state and polishing amount can be easily obtained by changing the polishing condition. Therefore, even on the surface of a layer made of a highly hard material such as a layer made of an amorphous material containing carbon atoms and silicon atoms, precise and uniform polishing can be performed on the order of, for example, a human being.

Furthermore, by adopting a configuration in which the position of the polishing tape and its pressure contact means in the direction of the generatrix of the rotating body can be changed, it is possible to effectively polish the entire surface or a predetermined position of the workpiece. Furthermore, by combining a mechanism for controlling the position of the polishing tape and its pressure contact means, and a means for measuring the thickness of the polished portion of the workpiece, an apparatus is provided that automatically searches for the polishing position and controls the amount of polishing. It became possible.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing the basic configuration of the apparatus of the present invention, and FIG. 1(A) is a front view of a workpiece placed in the apparatus to be polished. Yes, Figure 1 (B)
is a view from the side of the workpiece. FIG. 2 is a diagram showing one embodiment of the apparatus of the present invention, and FIG. 2 (A) shows the side surface of the workpiece when the workpiece to be polished is placed in the apparatus of the present invention. is a partial diagram from
FIG. 2(B) is a partial view of the workpiece from the front side. Furthermore, FIGS. 3(A) and 3(CB) show other embodiments of the pressure contact means. l: Workpiece rotating means 2.202: Polishing tape 3.203: Pressing means 1O121O: Workpiece 10a, 210a: Rotating surface 203a: Pressing members 203b, 303b: Supports 203c, 205, 303c: Weight 204: Supply Roller 2G4a: Motor 20B = Take-up roller 211: a-9iCHM+ 212: Interference peak measuring instrument 213: Computer 303a: Convex curved surface

Claims (1)

[Claims] 1) Workpiece rotating means for rotating a workpiece having a rotating body shape around an axis of symmetry of the rotating body shape; , and a polishing tape that polishes the rotating surface by being pressed against the rotating surface while moving at a speed different from the moving speed of the rotating surface; sliding contact along the generatrix of the rotating body shape of the workpiece; and a pressure contact means for pressing the polishing tape against the state. 2) Claim 1, wherein the pressing means has a convex curved surface arranged parallel to the generatrix direction of the rotating body shape of the workpiece for pressing the polishing tape. The rotary polishing device described. 3) Claim 1, wherein the pressing means comprises a cylindrical member arranged parallel to the generatrix direction of the rotating body shape of the workpiece for pressing the polishing tape.
The rotating body polishing device described in Section 1. 4) The diameter of the cylindrical member is 1 to 20 mm, the length is 5 to 50 mm, and the error in parallelism is 10 mm.
The rotating body polishing apparatus according to claim 3, wherein the polishing apparatus has a diameter within μm. 5) The invention according to any one of the patent scope items 1 to 4, which has a position control mechanism that freely changes the position of the pressing means and/or the polishing tape in the generatrix direction of the rotating body shape of the workpiece. Rotary polishing equipment. 6) The polishing surface of the polishing tape is made of crystalline SiC as an abrasive.
According to any one of claims 1 to 5, which is a polishing treatment for a workpiece having a layer of an amorphous material containing particles and containing carbon atoms and silicon atoms on the surface. The rotary polishing device described. 7) A means for measuring the film thickness of the surface layer made of an amorphous material containing carbon atoms and silicon atoms of the workpiece, and a means for measuring the thickness of the surface layer of the workpiece, and measuring the thickness of the surface layer of the pressing means and the polishing tape according to the film thickness measured by the measuring means. 7. The rotating body polishing apparatus according to claim 6, further comprising a mechanism for automatically controlling the position of the rotating body shape of the workpiece in the generatrix direction and the amount of polishing of the surface layer of the workpiece.