JPS62188181U - - Google Patents

Info

Publication number
JPS62188181U
JPS62188181U JP6196787U JP6196787U JPS62188181U JP S62188181 U JPS62188181 U JP S62188181U JP 6196787 U JP6196787 U JP 6196787U JP 6196787 U JP6196787 U JP 6196787U JP S62188181 U JPS62188181 U JP S62188181U
Authority
JP
Japan
Prior art keywords
inner layer
layer circuit
circuit board
substrate
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6196787U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6196787U priority Critical patent/JPS62188181U/ja
Publication of JPS62188181U publication Critical patent/JPS62188181U/ja
Pending legal-status Critical Current

Links

JP6196787U 1987-04-23 1987-04-23 Pending JPS62188181U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6196787U JPS62188181U (OSRAM) 1987-04-23 1987-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6196787U JPS62188181U (OSRAM) 1987-04-23 1987-04-23

Publications (1)

Publication Number Publication Date
JPS62188181U true JPS62188181U (OSRAM) 1987-11-30

Family

ID=30895792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6196787U Pending JPS62188181U (OSRAM) 1987-04-23 1987-04-23

Country Status (1)

Country Link
JP (1) JPS62188181U (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021150609A (ja) * 2020-03-23 2021-09-27 パナソニックＩｐマネジメント株式会社 積層板の製造方法、及びプリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021150609A (ja) * 2020-03-23 2021-09-27 パナソニックＩｐマネジメント株式会社 積層板の製造方法、及びプリント配線板の製造方法

Similar Documents

Publication Publication Date Title
EP0282625A3 (en) Method for producing rigid-type multilayer printed wiring board
JPS62188181U (OSRAM)
JPS63149561U (OSRAM)
JPS63147868U (OSRAM)
JPH0197581U (OSRAM)
EP1282343A4 (en) PROCESS FOR PRODUCING MULTILAYER CIRCUIT BOARDS
JPS6237728Y2 (OSRAM)
JPS6371598U (OSRAM)
JPH0472678U (OSRAM)
JPS6151779U (OSRAM)
JPS6435775U (OSRAM)
JPH0193764U (OSRAM)
JPS61136581U (OSRAM)
JPS58173274U (ja) 多層印刷配線板
JPH04268797A (ja) 積層板の製造方法
JPS6459989A (en) Manufacture of printed wiring board
JPS62158867U (OSRAM)
JPS6371597U (OSRAM)
JPS6262477U (OSRAM)
JPS61129379U (OSRAM)
JPS6359378U (OSRAM)
JPH01135774U (OSRAM)
JPH03270293A (ja) 印刷配線板の製造方法
JPS6240871U (OSRAM)
JPS6176994U (OSRAM)