JPS62188174U - - Google Patents

Info

Publication number

JPS62188174U

JPS62188174U JP7632086U JP7632086U JPS62188174U JP S62188174 U JPS62188174 U JP S62188174U JP 7632086 U JP7632086 U JP 7632086U JP 7632086 U JP7632086 U JP 7632086U JP S62188174 U JPS62188174 U JP S62188174U

Authority

JP

Japan

Prior art keywords

resist layer

plating

base material

conductor portion

circuit

Prior art date

1986-05-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007747 plating Methods 0.000 claims description 5
• 239000004020 conductor Substances 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 3
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 239000003054 catalyst Substances 0.000 claims 1
• 238000007796 conventional method Methods 0.000 description 1
• 238000006073 displacement reaction Methods 0.000 description 1

Cited By (1)