JPS62188143U - - Google Patents

Info

Publication number
JPS62188143U
JPS62188143U JP7778186U JP7778186U JPS62188143U JP S62188143 U JPS62188143 U JP S62188143U JP 7778186 U JP7778186 U JP 7778186U JP 7778186 U JP7778186 U JP 7778186U JP S62188143 U JPS62188143 U JP S62188143U
Authority
JP
Japan
Prior art keywords
mold
gates
communicate
parting line
disposed opposite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7778186U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7778186U priority Critical patent/JPS62188143U/ja
Publication of JPS62188143U publication Critical patent/JPS62188143U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7778186U 1986-05-22 1986-05-22 Pending JPS62188143U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7778186U JPS62188143U (cs) 1986-05-22 1986-05-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7778186U JPS62188143U (cs) 1986-05-22 1986-05-22

Publications (1)

Publication Number Publication Date
JPS62188143U true JPS62188143U (cs) 1987-11-30

Family

ID=30926110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7778186U Pending JPS62188143U (cs) 1986-05-22 1986-05-22

Country Status (1)

Country Link
JP (1) JPS62188143U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124241A (ja) * 1984-07-13 1986-02-01 Nec Corp 半導体装置の樹脂封止金型

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124241A (ja) * 1984-07-13 1986-02-01 Nec Corp 半導体装置の樹脂封止金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法

Similar Documents

Publication Publication Date Title
JPS62188143U (cs)
JPS638130Y2 (cs)
JPS61179746U (cs)
JPH0267639U (cs)
JPH01115240U (cs)
JPH0276838U (cs)
JPS6420728U (cs)
JPS6167113U (cs)
JPH0460416U (cs)
JPS62114440U (cs)
JPH02102742U (cs)
JPH01104730U (cs)
JPH01167039U (cs)
JPS63162531U (cs)
JPS63156720U (cs)
JPS63159830U (cs)
JPS63155632U (cs)
JPH0345116U (cs)
JPH0450216U (cs)
JPS63162529U (cs)
JPH0167741U (cs)
JPH0465440U (cs)
JPH0415854U (cs)
JPS62109911U (cs)
JPS6447040U (cs)