JPS62186461U - - Google Patents
Info
- Publication number
- JPS62186461U JPS62186461U JP7519886U JP7519886U JPS62186461U JP S62186461 U JPS62186461 U JP S62186461U JP 7519886 U JP7519886 U JP 7519886U JP 7519886 U JP7519886 U JP 7519886U JP S62186461 U JPS62186461 U JP S62186461U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- fixing plate
- body portion
- section
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7519886U JPS62186461U (US08197722-20120612-C00093.png) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7519886U JPS62186461U (US08197722-20120612-C00093.png) | 1986-05-19 | 1986-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62186461U true JPS62186461U (US08197722-20120612-C00093.png) | 1987-11-27 |
Family
ID=30921118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7519886U Pending JPS62186461U (US08197722-20120612-C00093.png) | 1986-05-19 | 1986-05-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62186461U (US08197722-20120612-C00093.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067254U (ja) * | 1991-12-25 | 1994-01-28 | 政洋 西尾 | 半導体素子のリード端子構造 |
JP2007173292A (ja) * | 2005-12-19 | 2007-07-05 | Sharp Corp | リード端子導出型電子部品 |
JP2015026682A (ja) * | 2013-07-25 | 2015-02-05 | 株式会社アドヴィックス | 回路基板支持装置 |
WO2016021123A1 (ja) * | 2014-08-08 | 2016-02-11 | 株式会社デンソー | 電子回路部品 |
-
1986
- 1986-05-19 JP JP7519886U patent/JPS62186461U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067254U (ja) * | 1991-12-25 | 1994-01-28 | 政洋 西尾 | 半導体素子のリード端子構造 |
JP2007173292A (ja) * | 2005-12-19 | 2007-07-05 | Sharp Corp | リード端子導出型電子部品 |
JP4486591B2 (ja) * | 2005-12-19 | 2010-06-23 | シャープ株式会社 | リード端子導出型電子部品 |
JP2015026682A (ja) * | 2013-07-25 | 2015-02-05 | 株式会社アドヴィックス | 回路基板支持装置 |
WO2016021123A1 (ja) * | 2014-08-08 | 2016-02-11 | 株式会社デンソー | 電子回路部品 |
JP2016039291A (ja) * | 2014-08-08 | 2016-03-22 | 株式会社デンソー | 電子回路部品 |