JPS62186418A - Manufacture of flat cable - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field] The present invention relates to a method for manufacturing a flat cable that can include a plurality of conductors within an insulator.

[Conventional technology]

Conventional flat cables are usually made by continuously extruding a conductor inside with a conductor embedded in a synthetic resin through a so-called extrusion coating through an extrusion molding cap, or by forming two conductors into a synthetic resin. They were manufactured by placing them between synthetic resin sheets and melting and pressing them together to integrate them.

[Problem that the invention seeks to solve]

The conventional method uses thermoplastic resin, and there are restrictions on the thickness of the coating resin, making it difficult to obtain a flant cable made of resin with a thin wall thickness and excellent dimensional stability. In addition, it has the disadvantage that a special extrusion device and die are required for manufacturing, which requires a large amount of equipment cost. Furthermore, the product had the disadvantage that the adhesiveness at the interface between the metal conductor and the coating resin was weak, making it difficult to reliably integrate the product.

However, the insulation of the flat cable manufactured in this way is mainly made of vinyl chloride resin, and due to its nature, placing heavy objects on the flat cable involves the risk of electrical leakage, etc. The usage itself was also restricted.

The present invention eliminates the drawbacks of such conventional manufacturing methods,
To provide a method for easily manufacturing a flat cable made of resin with excellent dimensional stability, which is thin and flexible, whose coating resin does not peel off, and which is safe even when heavy objects are placed on it.

[Means for solving problems]

That is, the present invention includes (A) a step of applying a vinyl chloride-based plastisol composition containing an adhesion promoter to the entire surface or a portion of an insulating film having excellent dimensional stability;
) a step of overlaying a sheet-like, band-like, or linear conductor on the plastisol composition; (C) a step of then overlaying another insulating film thereon and integrating it by heating and bonding; This is a method for manufacturing a flat cable characterized by passing through the steps (A), (B), and (C).

In the present invention, examples of the insulating film with excellent dimensional stability include polyester resin films, polyamide resin films, polyimide resin films, polysulfone resin films, etc., which are molded by known extrusion methods, casting methods, etc. So, the thickness is 10-3
00μ, preferably 30-200″μ, usually 50-15
Those with a diameter of about 0μ are often used.

The vinyl chloride plastisol composition applied thereto consists of a vinyl chloride polymer, a plasticizer, and a stabilizer, and includes, for example,
It is necessary to contain an adhesion imparting agent that imparts adhesion to an insulating film such as a polyester resin film. To explain this in more detail below, the vinyl chloride polymer is produced by emulsion polymerization of vinyl chloride or a mixture of vinyl chloride and a comonomer copolymerizable with it in the presence of an emulsifier and a water-soluble polymerization initiator. Particle size 5μ
Hereinafter, preferably in the presence of a paste resin of about 0.05 to 3μ, or a dispersant and an oil-soluble polymerization initiator, the whole or a part of vinyl chloride or a mixture of vinyl chloride and a comonomer copolymerizable therewith is mechanically mixed. This is a resin for mixing base resin or paste resin, which is produced by a fine suspension polymerization method in which resin is finely dispersed in water and then polymerized. Also,
A vinyl chloride resin with a large particle size produced by ordinary suspension polymerization may be used in combination as long as it does not adversely affect the viscosity, fluidity, processability, etc. of the paste sol. Examples of comonomers that can be copolymerized with vinyl chloride include vinyl esters such as vinyl acetate, vinyl propionate, and vinyl laurate, acrylic esters such as methyl acrylate, ethyl acrylate, and butyl acrylate, methyl acrylate, and ethyl methacrylate. methacrylic acid esters such as dibutyl maley 1-, maleic acid esters such as diethyl maleate, fulleric acid esters such as dibutyl fumarate and diethyl fumarate,
Vinyl ethers such as vinyl methyl ether, vinyl butyl ether, and vinyl octyl ether, vinyl cyanides such as acrylonitrile and methacrylonitrile, α-olefins such as ethylene, propylene, and styrene, and non-vinyl chloride such as vinylidene chloride and vinyl bromide. vinylidene halides or vinyl halides,
One or more of these is used in an amount of 30 weight % or less, preferably 20 weight % or less.

Vinyl chloride polymers are often polymerized using emulsifiers containing alkali metal salts, but due to the adhesive properties of plastisol compositions, the alkali metal content in the vinyl chloride polymer must be 11,000 pp or less. It is desirable to select and use emulsifiers to achieve the desired results. Examples of emulsifiers that produce vinyl chloride polymers with a low alkali metal content include ammonium salts or alkali metal salts of fatty acids whose alkyl groups have 8 to 18 carbon atoms. Of course, the emulsifier is not limited to those mentioned above.

The plasticizer that is one component of the plastisol composition is not particularly limited as long as it is used for vinyl chloride polymers, but for example, di-n-butyl phthalate (DBP) is used.
, di-n-octyl phthalate, Fucl M';-2-ethylhexyl (DOP), diisooctyl phthalate, octyldecyl phthalate, diisodecyl phthalate, butylbenzyl phthalate (BBP), di-2-ethylhexyl isophthalate, etc. Phthalic acid plasticizer, adipic acid di-2=
Ethylhexyl (DOA), di-n-decyl adipate, diisodecyl adipate, di-2-ethylhexyl azelaate, dibutyl sepacate, di-2-sebacate
Fatty acid ester plasticizers such as ethylhexyl, tributyl phosphate, tri-2-ethylhexyl phosphate, phosphorus, phosphate ester plasticizers such as 2-ethylhexyl diphenyl phosphate, tricresyl phosphate, epoxidized soybean oil, epoxidized Examples include epoxy plasticizers such as tall oil fatty acid-2-ethylhexyl, and these may be used alone or in combination of two or more. The amount of plasticizer used should be selected appropriately depending on the desired solid content concentration and fluidity of the paste sol, the performance of the flat cable to be obtained, the method of using the flat cable, etc. , 30 to 40 parts by weight per 100 parts by weight of vinyl chloride polymer
0 parts by weight, preferably in the range of 50 to 200 parts by weight. In particular, when considering the adhesiveness and fluidity of plastisol, it is appropriate that the amount be in the range of 40 to 100 parts by weight.

In addition, part of the plasticizer can be replaced with a diluent such as mineral spirit, texanol isobutyrate, dodecylbenzene, or an organic solvent that swells vinyl chloride polymers such as toluene or xylene. You may also do so.

The amount of diluent and organic solvent to be added is appropriately determined depending on the performance of the flat cable to be obtained, etc., but the amount of plasticizer used can be reduced by using the diluent and organic solvent.

The plastisol composition contains an adhesion-imparting agent so that strong adhesive force can be obtained between the polyester film and the vinyl chloride resin obtained by gelling the plastisol composition. The adhesion promoter is in the composition,
Those having reactivity to chemically bond with the polyester film are preferable, such as polyisocyanate compounds, polyisocyanate polymers, blocks of these compounds or polymers, polyaminoamide compounds, epoxy compounds, acrylic compounds, Diallyl compounds and the like are used, and among these, polyisocyanate compounds having isocyanate groups, polyisocyanate polymers, and blocks of these isocyanate groups are particularly preferred.

Examples of polyisocyanate compounds include fatty acid diisocyanates such as hexamethylene diisocyanate and lysine diisocyanate, alicyclic diisocyanates such as hydrogenated diphenylmethane diisocyanate, isophorone diisocyanate, and hydrogenated tolylene diisocyanate, tolylene diisocyanate, diphenylmethane diisocyanate,
Examples include aromatic diisocyanates such as naphthylene diisocyanate and xylene diisocyanate.

Among these, aromatic diisocyanates, particularly tolylene diisocyanate and diphenylmethane diisocyanate are preferred. In addition, polyisocyanate polymers are
The above-mentioned polyisocyanate compounds are mixed in an inactivating solution such as ethyl acetate, methyl acetate, butyl acetate, methyl ethyl ketone, dioxane, or chlorobenzene, or in a plasticizer such as phthalate, phosphate, adipate, or trimellitate. Among them, it is obtained by polymerization using a known method using a known catalyst such as a tertiary amine, an alkali metal of Mannich base fatty acid, or an alcoholade.

As the polyisocyanate polymer used in the present invention, it is particularly preferable to use one containing an isocyanurate ring obtained by polymerizing a polyisocyanate compound. Those containing isocyanurate rings are produced according to the method described above. Of course, polyisocyanate polymers are
It is also possible to use polyurethane, polyurea, etc., which are obtained by the reaction of polyisocyanate and an active hydrogen compound, and which are terminated with so-called isocyanate groups.

Sequestering or blocking agents used to prevent the low-temperature reactivity of the isocyane-1= group include, but are of course limited to, long-chain alkylphenols, oxyhenzoinoquasidoesters, and lactams. It's not a thing. The amount of blocking agent to be used is appropriately within the range of the free isocyanate groups. Blocking of isocyanate groups can be easily carried out in the above-mentioned medium, and polyisocyanate blocks and polyisocyanate polymer blocks can be obtained. For example, it is preferable to use a diisocyanate polymer block having an average molecular weight in the range of 1,000 to 10,000. The average degree of polymerization of the block is 1.0
If it is smaller than 0.00, the anchor effect as an adhesive cannot be fully exhibited and the adhesive strength is insufficient;
If it is larger than 00, the viscosity of the sol composition will significantly increase, which is not preferable.

The amount of adhesion imparting agent added is preferably in the range of 1 to 25 parts by weight per 100 parts by weight of the vinyl chloride polymer, and the amount of effective NGO in the plastisol composition is 0.01 to 1% by weight.
, preferably from 0.03 to 0.6% by weight, especially from 0.05 to
Preferably, it is present in a range of 0.5% by weight. For example, when a 33% by weight dibutyl phthalate diluted solution of oxybenzoin acid esterified diisocyanate polymer after polymerization and blocking in dibutyl phthalate is used, 1% per 100 parts by weight of the vinyl chloride polymer is used.
A plastisol composition is prepared by using ~50 parts by weight and supplementing the insufficient amount of plasticizer if the amount is insufficient. Furthermore, since the content of effective NGO in the diluted solution of 33% by weight dibutyl phthalate varies, the diluted solution is appropriately adjusted and added so as to obtain the desired NGO content of the plastisol composition. If the effective NGO content is less than 0.03% by weight, the adhesive effect will be small, and if it is more than 1% by weight, undesirable phenomena such as increased sol viscosity and coloring are likely to occur, and moisture absorption and rapid adhesive reactions may occur. The phenomenon of bubble generation at the adhesive interface is observed, which tends to cause a decrease in adhesive strength.

Adhesive agents other than those mentioned above that can be contained in the plastisol composition include the following compounds.

Examples of polyaminoamide compounds include commercially available products such as Oiltic 505 and Oiltic 506 (manufactured by Schering Co., Ltd.); epoxy compounds include Epicoat 828 (manufactured by Shell Chemical Co., Ltd.); and acrylic compounds include: Trimethylolpropane trimethacrylate is used together with a small amount of peroxide, and diallyl phthalate is used as the diallyl compound. These adhesion-imparting agents are used in an appropriate amount in consideration of their adhesion to the polyester film.

Plastisol compositions are typically mixed with stabilizers used in vinyl chloride resins. Many of these stabilizers generally act as dissociation promoters of isocyanate blocks. Stabilizers include lead white, basic lead silicate, tribasic lead sulfate, tribasic lead phosphite, silica gel co-precipitated lead silicate, inorganic metal compounds such as zinc white, lauric acid, stearic acid, and ricinol. acids, naphthenic acid, salicylic acid, 2-
Examples include organic compounds such as metal salts of cadmium, barium, calcium, zinc, lead, tin or magnesium such as ethylhexoic acid fatty acids or resin acids, as well as zinc octylate, dibutyltin laurate, dioctyltin malate, dibutyltin Examples include mercaptide. Organic acid liquid composite stabilizers such as calcium-zinc, barium-zinc, magnesium-zinc, and cadmium-barium-zinc stabilizers, which are usually commercially available as stabilizers for vinyl chloride resins, can also be used.

Although the amount added is not particularly limited, the objective can usually be achieved with an amount of 0.5 to 10 parts by weight, preferably 1 to 5 parts by weight, per 100 parts by weight of the vinyl chloride polymer. Furthermore, when an alkali metal compound and a metal compound such as lead, tin, cadmium, or zinc are used together, the adhesive strength is synergistically improved.

To produce a plastisol composition, a vinyl chloride polymer, a plasticizer, an adhesion promoter, and, if necessary, a stabilizer, a colorant, and other additives are uniformly mixed. For example, ■ Using a vinyl chloride polymer that has been completely sealed and stored immediately after production, ■ Performing a vacuum defoaming process during plastisol production before adding an adhesion agent, and ■ Using an adhesion agent. After adding, it is preferable to perform stirring and mixing after the gas phase is degassed under vacuum or replaced with an inert gas such as nitrogen.

When producing a composition, the incorporation of moisture into the composition should be avoided as much as possible, and specifically, it is desirable to prepare the composition in an atmosphere with a relative humidity of 80% or less. Generally 80% relative humidity
When mixed in the above atmosphere, the sol contains at least
It absorbs a trace amount of moisture of 0.2% by weight or more, which causes a decrease in adhesive properties.

The vinyl chloride plastisol composition as described above is
The above-mentioned plastic film with excellent dimensional stability can be easily coated by a known ordinary coating method, and after coating heat treatment, the film has an O', 5 k
It exhibits a T-peel strength of g/inch or more. It is necessary for the plastisol composition used in the present invention to have such a peel strength, and if it is less than this, it is difficult to expect a sufficient effect to encapsulate and integrate the conductor and achieve the purpose of a flat cable.

In addition, other insulating films used in the method of the present invention are films coated with a plastisol composition, which are coated with the plastisol composition, and if necessary, the plastisol composition is heated and gelled once to integrate the film. It may be.

The conductor disposed and fixed in such a material is made of an ordinary conductive metal material, and is arbitrarily selected to have a linear shape, a thin strip shape, a sheet shape, or the like, depending on the intended use of the flat cable.

Usually, as shown in FIG. 1, a vinyl chloride plastisol composition layer 2 is coated on a film 1 using various conventionally known coating means such as a coater, and a strip-shaped conductor 3 or a linear conductor 3' is coated on the coated layer. When placed, the conductor is buried in the plastisol layer 2 under its own weight as shown in FIG. Next, if the film 1a is further layered on top of the film 1a and heated appropriately in an oven and then cooled, a flat cable with an integrated whole as shown in cross section in FIG. 2 can be obtained.After the plastisol composition 2 is once heated and cooled to gel If the conductor 3.3 is placed on top of the conductor 3.3, and then the film 1a is placed on top of the film 1a and subjected to heat and pressure treatment, the resultant structure shown in FIG. 3 will be obtained, and either method can be used as desired.

If the films 1 and 1a are made transparent and plastisols 2 and 2b of different colors are sequentially applied to each other as shown in FIG. 4, a flat cable with different colors on the front and back sides can be obtained.

〔Effect of the invention〕

According to the method of the present invention, a film with excellent insulating properties and a vinyl chloride resin are in strong contact with each other without using special equipment or machinery as in the past, and the film can be made into a flexible, robust, and dimensionally stable material that can be formed into any desired structure. Not only can you easily obtain flat cables, but you can also easily manufacture relatively thin ones.
The use of a transparent film and the color scheme of plastisol allows for free coloring, which has extremely great effects. Furthermore, even if this flat cable is wired under a carpet or carpet tiles, no unevenness will appear on the surface of the carpet tiles, and even if a heavy object is placed on it, there will be no risk of cutting or electrical leakage.

〔Example〕

On a polyethylene terephthalate film with a width of 5 cm, a length of 1 m, and a thickness of 38 μm, a plastisol of the following formulation is coated with a bar coater to a width of 5 marks and a thickness of 100 μm. After placing the foil and further superimposing a polyethylene terephthalate film on top of it, heating it in an oven at 180°C, which is higher than the dissociation temperature of the blocked polyisocyanurate, for 3 minutes to bring the plastisol and the polyethylene terephthalate film into contact with each other. Cooled. The copper foil was buried in the plastisol due to its own weight, and a highly flexible flat cable with a thickness of approximately 150 μm, as shown in cross section in FIG. 2, was obtained.

The peel strength between film layer 1 and intermediate layer 2 is 0.6.
kg/1nch Peel strength of 13 film layers and intermediate layer 2 is 0.7 kir
/ 1 nch, and it was a thin and robust flat cable that did not peel off even when bent.

Plastisol formulation: Vinyl chloride paste resin 100 ffiffi parts (Vinca P-540, manufactured by Mitsubishi Kasei Vinyl Corporation) Polyester plasticizer 45 parts by weight (Dianizer D
-409, manufactured by Mitsubishi Kasei Vinyl Co., Ltd.) DOP
10 parts by weight liquid 5n-3H stabilizer (MA
RK465, manufactured by Adeka Argus)
4 parts by weight blocked polyisocyanurate
(Oxybenzoin acid ester brosoxylated TD
I Sankeitai 33% DBP solution) 15 parts by weight

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a state in which a plastisol composition is applied onto a film and a conductor is layered thereon, and FIGS. 2 to 4 are sectional views showing examples of flat cables obtained by the present invention. 1... Film with excellent dimensional stability, 2... Plastisol composition layer, 3,3'... Conductor patent applicant Mitsubishi Kasei Vinyl Co., Ltd. Representative Patent Attorney Yoshio Kimura Figure 1 Figure 2 O Figure 3 Figure 4 a

Claims (1)

[Claims] 1. (A) a step of applying a vinyl chloride-based plastisol composition containing an adhesion promoter to the entire surface or a part of an insulating film having excellent dimensional stability; (B) the above plastisol; A step of overlaying a sheet-like, band-like, or linear conductor on top of the composition; (C) Next, a step of overlaying another insulating film thereon and heat laminating it to integrate it. Characteristic flat cable manufacturing method. 2. The method for manufacturing a flat cable according to claim 1, which includes the step of heating and gelling the plastisol composition applied on the insulating film before the step of overlapping the conductor. 3. Claims 1 or 2, wherein the other insulating film is the same insulating film used in step (A) and coated with a plastisol composition containing an adhesion promoter. manufacturing method for flat cables.