JPS62185900A - Apparatus for observing waveform of treating current in cell for surface treatment - Google Patents
Apparatus for observing waveform of treating current in cell for surface treatmentInfo
- Publication number
- JPS62185900A JPS62185900A JP2673686A JP2673686A JPS62185900A JP S62185900 A JPS62185900 A JP S62185900A JP 2673686 A JP2673686 A JP 2673686A JP 2673686 A JP2673686 A JP 2673686A JP S62185900 A JPS62185900 A JP S62185900A
- Authority
- JP
- Japan
- Prior art keywords
- current
- shunt
- waveform
- treating
- oscilloscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 title claims abstract description 9
- 239000000523 sample Substances 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 abstract description 5
- 239000003792 electrolyte Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000003321 amplification Effects 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、表面処理（めっき、アルマイト・電解研磨
等）に於ける電解槽内各位型の処理電流波形の観測装置
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a device for observing processing current waveforms of various types inside an electrolytic cell during surface treatment (plating, alumite, electrolytic polishing, etc.).
（従来の技術）
表面処理に於て処理電流波形が処理に大きく影響する事
は、古くはアルマイトに於ける交直流重畳波形、背化銅
めっきに於けるＰＲ，波形、又、最近に於ける電子部品
用金めっきに於ける矩形波パルス波形等の例を引くまで
もなく周知である。(Prior art) The fact that the processing current waveform greatly influences the processing in surface treatment is the AC/DC superimposed waveform in alumite in the past, the PR waveform in reverse copper plating, and the current waveform in recent years. It goes without saying that the rectangular pulse waveform used in gold plating for electronic parts is well known.
一方、表面処理現場に於ける波形観測の現状は次の通シ
である。On the other hand, the current state of waveform observation at surface treatment sites is as follows.
（ｂ） Ｘ圧波形、電流波形の両方の観測が必要であ
るが、行われているのは電圧波形が殆んどで、電流波形
の観測は殆んど行われていない。行われていても正しく
観測されていないケースが多い。(b) Although it is necessary to observe both the X-pressure waveform and the current waveform, most of the observations are made of the voltage waveform, and the current waveform is hardly observed. Even if this is done, there are many cases where it is not observed correctly.
（Ｃ） 電流波形の観測は現在電流をシャント、ＤＣ
−ＣＴ等を通して、それ等に於ける電圧陣形観測を行う
方法が取られている。その場合次の様な問題点がある。(C) Observation of the current waveform is performed by shunting the current and DC
- A method is being used to observe voltage formations through CT, etc. In that case, the following problems arise.
■ 電流検出位置が槽外である。■ The current detection position is outside the tank.
■ 処理作業中に容易に行えない場合が多い。クランプ
電流計を用いて波形を観測する方法もあるが、この場合
、直流配線がブスバー等の場合り２ンプ出来ないと云う
問題と、クランプで検出した波形は一種のフィルターを
通した結果となシ波形が変化していると云う問題権があ
る。■ Often cannot be easily performed during processing operations. There is also a method of observing the waveform using a clamp ammeter, but in this case, there is a problem in that DC wiring cannot be doubled if it is a bus bar, etc., and the waveform detected by the clamp is the result of passing through a kind of filter. There is a problem that the waveform is changing.
θ 最近の直流電源附属の直流電流計の動作源としてＤ
Ｃ−ＣＴが多く用いられている。これは平均値表示計器
については問題ないとしても、波形はりアクタンス回路
を通った事になシ正しい波形をこ＼から観測する事は出
来ない。θ D as the operating source of a DC ammeter attached to a recent DC power supply
C-CT is often used. Although this may not be a problem for average value display instruments, it is not possible to observe the correct waveform from here since the waveform has passed through the actance circuit.
■ シャントを直流配線に接続するには処理作業を中断
せねばならず、又、数千Ａ１数万Ａの直流配線に此の工
事を行うのは容易な事ではない。■ To connect the shunt to the DC wiring, the processing work must be interrupted, and it is not easy to perform this work on the DC wiring of several thousand A to tens of thousands of A.
以上の如く表面処理現場に於ける電流波形の観測は容易
ではなく、又、容易に行える方法は正しい波形を表示し
ないと云う問題がある。As described above, it is not easy to observe the current waveform at the surface treatment site, and there is a problem in that the easy method does not display the correct waveform.
尭発明が解決しようとする問題点）
この発明は、以上の如き問題点を次の如く解決せんと喰
るものである。(Problems to be Solved by the Invention) This invention attempts to solve the above-mentioned problems as follows.
（ａ） 検出場所を槽内（各位置）より取シ得る。(a) The detection location can be taken from inside the tank (each position).
Φ） 処理作業を中断しないで検出観測できる。Φ) Detection and observation are possible without interrupting processing work.
（Ｃ） 波形は現在行われているいくつかの方法の中
で、真の電流波形との違いが最も少ないシャント（分流
器）による電流／電圧変換方式を用いる事が出来る。(C) For the waveform, a current/voltage conversion method using a shunt (current divider) can be used, which has the least difference from the true current waveform among several methods currently in use.
（問題を解決する為の手段）
第１図に於て、処理（例えばアルミニウムの陽極酸化処
理・・・・・・以下これを例に説明する）電解槽１の筒
内側面近くに対極板（陰極）５．５を対極棒６．６（陰
極棒）よりミ解液２の中につシ下げ、その＃１ソ中間に
、処理物３を処理極棒７（陽極棒）から電解液２の中に
クシ下げて処理作業を行っている。この様に処理作業を
行っている電解槽１中の処理物３０近くに電流検出位置
の電流検出面４ａを挿入する。この電流検出具４は電流
検出面４ａ（平面或いは球面）絶縁皮膜のない電導部分
４ｂから電導出来る様にしたものである。電流検出面４
ａは使用９忙電蝕されたシ、電解酸化等によって電導性
の変化しない材質のものを用いる必要がある。電流検出
具４の電解液２外の電導性の電導部分４ｂから分流器８
の１極へ１、又、分流器８の他極より処理極棒７までを
フレキシブル絶縁電線等にて結線する。分流器８０両極
へオシロスコープ１′
９よりのブロー≠１０を接続する。(Means for solving the problem) In Fig. 1, a counter electrode ( Cathode) 5.5 is lowered into the electrolyte solution 2 from the counter electrode rod 6.6 (cathode rod), and the material to be treated 3 is lowered into the electrolyte solution 2 from the treatment electrode rod 7 (anode rod) in the middle of #1. Processing work is carried out by lowering the comb inside. The current detection surface 4a at the current detection position is inserted near the object to be treated 30 in the electrolytic cell 1 undergoing treatment work in this manner. This current detection device 4 is configured so that conduction can be conducted from a current detection surface 4a (flat or spherical) and a conductive portion 4b without an insulating film. Current detection surface 4
For a, it is necessary to use a material whose conductivity does not change due to electrolytic corrosion or electrolytic oxidation during use. From the conductive part 4b of the current detection device 4 outside the electrolyte 2 to the shunt 8
1 to one pole of the shunt 8, and from the other pole of the shunt 8 to the processing pole rod 7 using a flexible insulated wire or the like. Connect the blow≠10 from the oscilloscope 1'9 to both poles of the shunt 80.
（作用）
処理電流の一部が分流する。従って、この分流した電流
が分流器８に於て電流／電圧賃換され７゛′
、それがプロー−１０を経てオシロスコープ９のブラウ
ン管面に波形表示される。(Function) Part of the processing current is shunted. Therefore, this shunted current is converted into current/voltage in the shunt 8, and is displayed as a waveform on the cathode ray tube surface of the oscilloscope 9 via the probe 10.
（実施例）
第２図に於て、分流器８の両極を信号入力線１１にて増
幅器１２に結線する。信号入力線１１は電磁的影響を避
ける為にシールド線が望ましい。増幅器１２に於ては、
通常６０ミリボルト定格である分流器８よりの信号を数
ボルト程度に増幅する。この増幅した信号電圧を波形観
ブ。(Embodiment) In FIG. 2, both poles of the shunt 8 are connected to an amplifier 12 through a signal input line 11. The signal input line 11 is preferably a shielded line to avoid electromagnetic influence. In the amplifier 12,
The signal from the shunt 8, which is normally rated at 60 millivolts, is amplified to about several volts. View the waveform of this amplified signal voltage.
測用端子２１からプローグ１０を通じてオシロスコープ
９ヘインプツトする。An oscilloscope 9 is input from the measuring terminal 21 through the probe 10.
第３図は、増幅器１２に平均値電流その他（この例に於
ては真の実効値電流）をディジタル表示させる機能を持
たせた実施例の配線概念図である。分流器８よりの信号
電圧は信号入力線１１を経て、増幅器１２の分流器より
の信号入力端子１３にインプットされる。この信号電圧
は増幅部１４にて増幅されて波形及び平均値表示部１５
に至る。ＢＣＩとＢＯ２の端子はプロープ１０を経てオ
シロスコープ９へ至ｐ、ＢＯ２とＢＯ２は積分方式のデ
ィジタルパネルメーター（ＤＰＭ）の信号端子に結線さ
れる。波形及び平均値表示部１５と並列に他の値の表示
部（この例では真の実効値表示部１６）を設けＢＯ４と
ＢＯ５（ＢＯ２を代用してもよい）端子を積分方式のＤ
ＰＭの信号端子に結線する。FIG. 3 is a conceptual wiring diagram of an embodiment in which the amplifier 12 is provided with a function of digitally displaying the average value current and other values (in this example, the true effective value current). The signal voltage from the shunt 8 is input to a signal input terminal 13 from the shunt of the amplifier 12 via a signal input line 11 . This signal voltage is amplified by the amplification section 14 and the waveform and average value display section 15
leading to. The terminals of BCI and BO2 are connected to an oscilloscope 9 via a probe 10, and BO2 and BO2 are connected to signal terminals of an integral type digital panel meter (DPM). Another value display section (in this example, the true effective value display section 16) is provided in parallel with the waveform and average value display section 15, and the BO4 and BO5 (BO2 may be substituted) terminals are connected to the integral type D.
Connect to the PM signal terminal.
第４図は第３図実施例の配線概念図にて製作した表示器
（ＤＰＭ）付増幅器の外観正面図である。ケース１７の
正面には分流器よりの信号入力端子１３、増幅器用０Ｎ
１０ＦＦスイツチ２０、波形観測用端子２１、平均値電
流表示用ＤＰＭ！８、真の実効値電流表委用ＤＰＭ１９
が設けられである。FIG. 4 is an external front view of an amplifier with a display device (DPM) manufactured based on the wiring conceptual diagram of the embodiment shown in FIG. On the front of the case 17 is a signal input terminal 13 from the shunt, and a 0N terminal for the amplifier.
10FF switch 20, waveform observation terminal 21, DPM for average value current display! 8. True RMS current table used by DPM19
is provided.
第５図は第４図実施例のケース内に分流器８及び信号入
力１ｆｊ１１１も納めたものである。分流器よりの信号
入力端子１３の代わシに直流電流入力用端子２２ａ、２
２ｂ及び直流入力電流用ヒユーズ２３が設けである。FIG. 5 shows a case in which the shunt 8 and signal input 1fj111 are also housed in the case of the embodiment shown in FIG. Direct current input terminals 22a, 2 instead of the signal input terminal 13 from the shunt
2b and a fuse 23 for direct current input current.
（発明の効果） 本発明によって次の如き効果が生ずる。(Effect of the invention) The present invention brings about the following effects.
■ 電流検出位置は槽内であシ、且つ処理物と条件が殆
んど同じである。(2) The current detection position is within the tank, and the conditions are almost the same as those of the processed material.
■ 処理作業を妨げたシ、中断したシする事なしに処理
電流の波形を観測する事が出来る。■ The waveform of the processing current can be observed without disturbing or interrupting the processing work.
θ 電流検出面を移動する事により、槽内各位室に於け
る処理電流波形を自由に観測する事が出来る。更らに実
施例の場合には、Ｏ観測した電流波形の平均値、真の実
効値等も同時に測定する事が出来る。By moving the θ current detection surface, it is possible to freely observe the processing current waveform in each chamber in the tank. Furthermore, in the case of the embodiment, the average value, true effective value, etc. of the observed current waveform can be measured at the same time.
■ 増幅器を使用しているので波形を充分に大きく観測
する事が出来る、等である。■ Since an amplifier is used, the waveform can be observed sufficiently large.
以上の如くであるので、本発明は近時管理条件がさらに
高度に且つ厳しくなって来た表面処理に於て有効且つ独
自な管理手段を提供するものである。As described above, the present invention provides an effective and unique control means for surface treatment, where control conditions have recently become more advanced and severe.
第１図は本発明の概念図、
第２図は本発明実施例の概念図、
第３図は本発明の別の実施例の増幅器の配線図、
第４図は第３図による実施例の外観正面図、第５図はさ
らに別の実施例の外観正面図であシ、図中符号は、
１：電解槽 ２：電解液
３：処理物 ４：電流検出具
４ａ：電流検出面 ４ｂ：’Ｉ、導部分５．５：対極
板 ６．６：対極棒
７：処理極棒′ ８：分流器
１３：分流器よりの信号入力端子
１４：増幅部
１５：波形及び平均値表示部
１６：真の実効値表示部 １７：ケース１８：平均値
表示ＤＰＭ
１９：真の実効値表示ＤＰＭ
２０：増幅用０Ｎ１０ＦＦスイッチ
２１：波形観測用端子
２２ａ、２２ｂ：直流電流入力用端子
２３：直流入力電流用ヒユーズ、をそれぞれ示す。Fig. 1 is a conceptual diagram of the present invention, Fig. 2 is a conceptual diagram of an embodiment of the present invention, Fig. 3 is a wiring diagram of an amplifier according to another embodiment of the present invention, and Fig. 4 is a diagram of the embodiment according to Fig. 3. External front view, FIG. 5 is an external front view of yet another embodiment, and the symbols in the figure are as follows: 1: Electrolytic cell 2: Electrolyte 3: Processing material 4: Current detection device 4a: Current detection surface 4b: 'I, conductive part 5.5: return electrode plate 6.6: return electrode 7: processing pole' 8: shunt 13: signal input terminal from the shunt 14: amplification section 15: waveform and average value display section 16: True effective value display section 17: Case 18: Average value display DPM 19: True effective value display DPM 20: 0N10FF switch for amplification 21: Waveform observation terminals 22a, 22b: DC current input terminal 23: For DC input current The fuses are shown respectively.
Claims (1)
流検出面（４ａ）を挿入し、電流検出具（４）の電導部
分（４ｂ）から分流器（８）の１極へ、又、分流器（８
）の他極より処理極棒（７）までを絶縁電線等で結線し
、分流器（８）の両極へオシロスコープ（９）よりのプ
ロープ（１０）を接続した事を特徴とする表面処理に於
ける槽内処理電流波形観測装置。 ２）分流器（８）の両極を信号入力線（１１）にて増幅
器（１２）に結線し、増幅器（１２）の波形観測用端子
（２１）へオシロスコープ（９）のプロープ（１０）を
接続した事を特徴とする特許請求の範囲第１項記載の表
面処理に於ける槽内処理電流波形観測装置。 ３）増幅器（１２）に平均値電流その他の表示機能を有
せしめた事を特徴とする特許請求の範囲第１項及び第２
項記載の表面処理に於ける槽内処理電流波形観測装置。[Claims] 1) Insert the current detection surface (4a) of the current detection device (4) into the surface-treated electrolytic cell (1), and connect the current detection surface (4b) of the current detection device (4) to the shunt (8) to one pole, and the shunt (8)
) is connected from the other pole to the treatment pole rod (7) with an insulated wire, etc., and a probe (10) from an oscilloscope (9) is connected to both poles of the shunt (8). In-tank treatment current waveform observation device. 2) Connect both poles of the shunt (8) to the amplifier (12) using the signal input line (11), and connect the probe (10) of the oscilloscope (9) to the waveform observation terminal (21) of the amplifier (12). An in-tank treatment current waveform observation device in surface treatment according to claim 1, characterized in that: 3) Claims 1 and 2, characterized in that the amplifier (12) has an average value current and other display functions.
An in-tank treatment current waveform observation device for surface treatment as described in Section 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2673686A JPS62185900A (en) | 1986-02-12 | 1986-02-12 | Apparatus for observing waveform of treating current in cell for surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2673686A JPS62185900A (en) | 1986-02-12 | 1986-02-12 | Apparatus for observing waveform of treating current in cell for surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62185900A true JPS62185900A (en) | 1987-08-14 |
Family
ID=12201590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2673686A Pending JPS62185900A (en) | 1986-02-12 | 1986-02-12 | Apparatus for observing waveform of treating current in cell for surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62185900A (en) |
-
1986
- 1986-02-12 JP JP2673686A patent/JPS62185900A/en active Pending
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