JPS62182574U - - Google Patents
Info
- Publication number
- JPS62182574U JPS62182574U JP7138186U JP7138186U JPS62182574U JP S62182574 U JPS62182574 U JP S62182574U JP 7138186 U JP7138186 U JP 7138186U JP 7138186 U JP7138186 U JP 7138186U JP S62182574 U JPS62182574 U JP S62182574U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductor foils
- hole
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 239000011888 foil Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7138186U JPS62182574U (it) | 1986-05-12 | 1986-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7138186U JPS62182574U (it) | 1986-05-12 | 1986-05-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62182574U true JPS62182574U (it) | 1987-11-19 |
Family
ID=30913880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7138186U Pending JPS62182574U (it) | 1986-05-12 | 1986-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62182574U (it) |
-
1986
- 1986-05-12 JP JP7138186U patent/JPS62182574U/ja active Pending