JPS62181148A - Manufacture of laminated structure - Google Patents
Manufacture of laminated structureInfo
- Publication number
- JPS62181148A JPS62181148A JP62019598A JP1959887A JPS62181148A JP S62181148 A JPS62181148 A JP S62181148A JP 62019598 A JP62019598 A JP 62019598A JP 1959887 A JP1959887 A JP 1959887A JP S62181148 A JPS62181148 A JP S62181148A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- laminated
- heat
- laminated structure
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- DRFDPXKCEWYIAW-UHFFFAOYSA-M Risedronate sodium Chemical compound [Na+].OP(=O)(O)C(P(O)([O-])=O)(O)CC1=CC=CN=C1 DRFDPXKCEWYIAW-UHFFFAOYSA-M 0.000 description 1
- 208000036366 Sensation of pressure Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
（ｉｎ＋ｐｒｏｖｅｄ ５ｔｒｕｃｔｕｒａｌ ｐｒｏ
ｐｅｒｔｉｅｓ）を有する積層構造物製造方法に関する
。より詳しく述べると、本発明は、積層構造物製造中に
その積層構造物の構成部分の品質を損なうことなく、隣
接する薄層（ｌａｍｉｎａｔｅｄ １ａｙｅｒｓ）同士
を結合する接着力を強化することに関する。[Detailed description of the invention] [Technical field of the invention] (in+proved 5 structural pro
perties). More particularly, the present invention relates to enhancing the adhesive forces that bond adjacent laminated layers together during the manufacture of the laminated structure without compromising the quality of the components of the laminated structure.
熱インクジェット・プリンター用のプリントヘッドの製
造のような確定した技術において、ひとつの複合構造物
（ｕｎｉｔａｒｙ ｃｏｍｐｏｓｉｔｅ ５ｔｒｕｃｔ
ｕｒｅ）を形成するのにしばしば各種異種材料が共に接
着される。このような接着方法において、選ばれた接着
剤が隣接する層の間にしばしば供給され、これらの層間
に良好な接着結合（ａｄｈｅｓｉｖｅ ｂｏｎｄ）を生
じるのに充分な時間中、あらかじめ決められた熱と圧力
にさらされる。このような構造の具体例は、典型的に金
属オリフィス板（ｍｅｔａｌ ｏｒｉｆｉｃｅｐｌａｔ
ｅ）が加熱用抵抗（ｔｈｅｒｍａｌ ｈｅａｔｅｒ ｒ
ｅｓｉｓｔｏｒ）及びそれに対応するインクだめを含む
シリコン基板の上に接着結合されている薄膜抵抗・熱イ
ンクジェット・プリントヘッドの製造において見られる
。しかしながら、接着が熱圧縮結合（ｔｈｅｒｍａｌｃ
ｏｍｐｒｅｓｓｉｏｎ ｂｏｎｄ）で成される、向かい
合ったそれぞれの面上に不均一な表面平滑性及び表面形
状（ｃｏｎｔｏｕｒ）が存在するということは、ひんば
んに起きる。これらの不平滑性及び不均一形状は、また
、ヒート・ステーカー（ｈｅａｔ ５ｔａｋｅｒ）のよ
うな技術において周知である、熱及び圧力を加えるため
の部材に接触する上段の層の表面上にも存在する。この
ような不均一な表面平滑性及び表面形状同士をあらかじ
め決められた熱条件及び圧力条件のもとで結合する時、
その薄層の表面領域にわたって、各点に対応する圧力及
び温度の変化が存在する。これらの圧力の変化は、硬化
後の積層構造物において構造的に弱い箇所を生じさせ、
結果的に、実際の使用条件のもとで、積層構造物の望ま
しくない故障を生じさせる。In established technologies such as the manufacture of printheads for thermal inkjet printers, a unitary composite 5truct
Various dissimilar materials are often bonded together to form a urethane. In such bonding methods, a selected adhesive is often applied between adjacent layers and subjected to a predetermined amount of heat and heat for a period of time sufficient to produce a good adhesive bond between these layers. exposed to pressure. An example of such a structure is typically a metal orifice plate.
e) is a heating resistor (thermal heater r)
in the manufacture of thin film resistive thermal inkjet printheads that are adhesively bonded onto a silicon substrate containing a resistor (resistor) and a corresponding ink reservoir. However, adhesion is not possible due to thermal compression bonding (thermalc bonding).
The presence of non-uniform surface smoothness and contour on each opposing surface is a common occurrence. These non-smoothness and non-uniform shapes are also present on the surfaces of upper layers that contact elements for applying heat and pressure, well known in the art such as heat takers. . When such uneven surface smoothness and surface shapes are bonded together under predetermined heat and pressure conditions,
Across the surface area of the thin layer there is a corresponding pressure and temperature change at each point. These pressure changes create structurally weak points in the cured laminate structure,
This results in undesirable failure of the laminated structure under actual conditions of use.
本発明は、表面形状の不均一性による上記接着力の不均
一性の問題が、実質上消去される、積層構造物の製造に
対する新しく、かつ、改善された方法を供給することを
目的とする。The present invention aims to provide a new and improved method for the production of laminated structures in which the problem of non-uniformity of adhesion due to non-uniformity of surface topography is substantially eliminated. .
本発明の一実施例によれば、上記目的は、接着、積層さ
れる構造物と、それ用の熱及び圧力付加装置（ｈｅａｔ
５ｔａｋｅｒ）との間に、圧力均一化部材（ｐｒｅｓ
−ｓｕｒｅ ｅｑｕａｌｉｚｉｎｇ ｍｅｍｂｅｒ）を
設置することによって達成される。圧力均一化部材は、
一対の薄い、弾力性のある外側金属箔層とその間に置か
れた、選ばれた体積を持つ液化可能な材料（Ｉｉｑｕｉ
ｆｉａｂｌｅｍａｔｅｒｉａｌ）とから構成されている
。その一対から成る薄い、柔軟性のある外側金属箔層同
士は、周囲を前記液化可能な材料の不溶融部分によって
効果的に結合、封止されていて、前記液化可能な材料は
、それら金属箔層間の内部に完全に包含されている。According to an embodiment of the present invention, the above object is to provide a bonded and laminated structure and a heat and pressure application device therefor.
A pressure equalization member (pres
-sure equalizing members). The pressure equalization member is
A pair of thin, resilient outer metal foil layers with a selected volume of liquefiable material (Iiqui
fiable material). The pair of thin, flexible outer metal foil layers are effectively bonded and sealed around the periphery by an infusible portion of the liquefiable material, and the liquefiable material is Completely contained within the interlayers.
積層構造とされる薄膜抵抗半導体基板及び金属オリフィ
ス板のような、２つの隣接する部材が接着結合される時
、それらの上に圧力均一化部材が置かれ、その後、その
部材の上面にヒート・ステー力が当てられる。ヒート・
ステー力がらの熱と圧力を受けると、圧力均一化部材の
薄い柔軟性のある金属箔層内の材料は、液化し、下側の
柔軟性のある層に流体静力学的な力（ｈｙｄｒｏｓｔａ
ｔｉｃ ｆｏｒｃｅ）を与え、それによって、その層は
、たとえば、オリフィス板の不均一な表面形状に合致し
、積層構造物の全表面領域にわたって均一な圧力を伝え
る。When two adjacent components, such as a thin film resistor semiconductor substrate and a metal orifice plate in a stacked structure, are adhesively bonded, a pressure equalization component is placed over them, and then a heat source is applied to the top surface of the component. Stay force is applied. Heat·
When subjected to heat and pressure from the stay forces, the material within the thin flexible metal foil layer of the pressure equalization member liquefies and exerts hydrostatic forces on the underlying flexible layer.
tic force) so that the layer conforms to the non-uniform surface topography of, for example, an orifice plate and transmits a uniform pressure over the entire surface area of the laminated structure.
このようにして、接着結合に適用される圧力は、従来技
術による方法と比較して積層構造物の表面の面方向にわ
たって実質的に一様に供給される。In this way, the pressure applied to the adhesive bond is applied substantially uniformly across the surface of the laminate structure compared to prior art methods.
かくして、本発明は、より強力な接着力を持つ複合積層
構造物を生産する能力がある。本発明によって与えられ
る重要な進歩性は以下に示す、添付した図面の記述を参
照することによってより良く理解されるでしょう。Thus, the present invention has the ability to produce composite laminate structures with stronger adhesion. The significant inventive step provided by the present invention will be better understood by reference to the following description of the accompanying drawings.
以下に本発明の一実施例を記述する。第１Ａ図から第１
Ｅ図を参照すると、第１八図に、熱インクジェット・プ
リンターにおける使用で良く知られた半導体デバイス構
造のインクだめ及び加熱用抵抗（図示されていない）の
保持に典型的に用いられる薄膜抵抗シリコン基板１０が
示されている。各抵抗及びインクだめ（図示されていな
い）はノズル板１２の中のノズル・パターンに対応して
いる。そしてノズル板１２は典型的にニッケルから作ら
れ、シリコン基板１０と同様、熱インクジェット・プリ
ンティング技術において一般に周知である。したがって
、ここではさらに詳しく記述することはしない。しかし
ながら、そこで用いられている各種の層材料の記述を含
む薄膜抵抗プリントヘッド構造の参考のために％ ｌ
ｌｅｗｌｅｔｔ Ｐａｃｋａｒｄ Ｊｏｕｒｎａｌ。An embodiment of the present invention will be described below. 1 from Figure 1A
Referring to Figure E, Figure 18 shows a thin film resistive silicon typically used to hold the ink reservoir and heating resistor (not shown) in a semiconductor device structure well known for use in thermal inkjet printers. A substrate 10 is shown. Each resistor and reservoir (not shown) corresponds to a nozzle pattern in nozzle plate 12. The nozzle plate 12 is then typically made of nickel and, like the silicon substrate 10, is commonly known in the thermal inkjet printing art. Therefore, it will not be described in further detail here. However, for reference of thin film resistive printhead construction including a description of the various layer materials used therein, % l
lewlett Packard Journal.
Ｖｏｌｕｍｅ ３６． Ｎｕｍｂｅｒ ５． Ｍａｙ
１９８５を参照されたい。Volume 36. Number 5. May
See 1985.
この型のプリントヘッド構造は、Ｃｏｎｒａｄ Ｌ、
Ｗｒｉｇｈｔ及びその他の者に授与され、本願出願人に
譲渡された特開昭６０−１０９８５０にも記述されてい
る。This type of printhead structure is known from Conrad L,
It is also described in Japanese Patent Application Laid-Open No. 60-109850, assigned to Wright and others and assigned to the assignee of the present application.
金属ノズル板１２は、第１Ｂ図に示されるように、パラ
フィルム（ｐａｒａｆ ｉｌｍ）として一般的に知られ
ている紫外線硬化形ポリマー１４の手段によってシリコ
ン基板１０に接着される。このパラフィルムはプラウエ
ア州つィルミントンのデュポン社（Ｄｕ ＰｏｎｔＣｏ
ｍｐａｎｙ）によってＶＡＣＲＥＬの商品名で売られて
いる。The metal nozzle plate 12 is adhered to the silicon substrate 10 by means of a UV curable polymer 14, commonly known as parafilm, as shown in FIG. 1B. This parafilm was manufactured by Du Pont Co. of Wilmington, P.O.
It is sold under the trade name VACREL by Mpany.
ＶＡＣＲＥＬ層１４は、さらに詳しく記述される方法で
、熱及び圧力を加えることによる熱硬化（ｔｈｅｒｍａ
ｌｃｊｒｉｎｇ）を受ける。VACREL layer 14 is thermally cured by applying heat and pressure in a manner that will be described in more detail.
lcjring).
第１Ｃ図に示されるように置かれたノズル板１２の上面
に圧力均一化複合部材１６が置かれる。その圧力均一化
複合部材は、一対のアルミ箔の外側層１８と２０を持ち
、その間に、硬化されない（ｕｎｃｕｒｅｄ）ＶＡＣＲ
ＥＬあるいはパラフィルム材料２２が内部に閉じ込めら
れている。このパラフィルム材料２２は、約１）５°Ｃ
〜１２０℃のあらかじめ決められた温度に高められると
液化する。圧力均一化複合構造物１６はウォータベッド
・サンドイッチ（ｗａｔｅｒｂｅｄ ｓａｎｄｗｉｃｈ
）とも呼ばれ、その中で液化可能な材料２２は、接着結
合される材料１２及び１０上の形状及び圧力に合致する
。A pressure equalizing composite member 16 is placed on top of the nozzle plate 12 placed as shown in FIG. 1C. The pressure equalizing composite member has a pair of outer layers 18 and 20 of aluminum foil between which an uncured VACR
EL or Parafilm material 22 is trapped inside. This parafilm material 22 has a temperature of about 1) 5°C.
It liquefies when raised to a predetermined temperature of ~120°C. The pressure equalizing composite structure 16 is a waterbed sandwich.
) in which the liquefiable material 22 conforms to the shape and pressure on the materials 12 and 10 to be adhesively bonded.
この熱圧縮結合は、第１Ｅ図に示されるように、鋼製支
持台２４の上にシリコン基板１０を最初に置くことによ
って成される。操作中、ヒート・ステーカーの頭の部分
３０は、あらかじめ決められた熱及び圧力条件のもとで
、ノズル板１２とその下に位置するシリコン基板１０の
間のＶＡＣＲＥＬ層１４を熱圧縮結合するのに充分な時
間、複合構造物１６に接触される。この場合、温度が１
）５℃〜１２０°Ｃにおいて１５秒から２０秒間、１４
０６１６ｋｇ／ ｍ 〜１５８１９３ｋｇ／ ｔｒｉ
（２００ｐｓｉ〜２２５ｐｓｉ）の範囲の圧力をかける
と、本発明は非常によく作用することがわかった。しか
しながら、必要ならば、圧力範囲は、１４０６２ｋｇ／
ｔｒｉ〜１４０６１６２ｋｇ／ ｍ （２０ｐｓ ｉ
〜２０００ｐｓ ｉ）、時間は５秒から６０秒、温度
は９０℃〜１６０℃に拡大しても良い。This thermocompression bonding is accomplished by first placing the silicon substrate 10 on a steel support 24, as shown in FIG. 1E. In operation, the heat staker head 30 thermally compresses the VACREL layer 14 between the nozzle plate 12 and the underlying silicon substrate 10 under predetermined heat and pressure conditions. is contacted with composite structure 16 for a sufficient period of time. In this case, the temperature is 1
) for 15 to 20 seconds at 5°C to 120°C, 14
0616kg/m ~158193kg/tri
It has been found that the present invention works very well when applying pressures in the range of (200 psi to 225 psi). However, if necessary, the pressure range can be increased to 14062 kg/
tri~1406162kg/m (20ps i
~2000 psi), time may be increased from 5 seconds to 60 seconds, and temperature from 90°C to 160°C.
第２Ａ図から第２Ｄ図を参照すると、第静図には、ＶＡ
ＣＲＥＬ接着剤が、ノズル板から引き裂かれている接着
の故障が示されている。第２Ｂ図においては、ＶＡＣＲ
ＥＬ接着剤が、シリコン基板から引き裂かれている。第
２Ｃ図においては、ＶＡＣＲＥＬが部分的にノズル板か
ら引き裂かれ、かつ、部分的にシリコン基板から引き裂
かれている混合形故障が示されている。Referring to FIGS. 2A to 2D, the static diagram includes VA
A bond failure is shown where the CREL adhesive is torn from the nozzle plate. In Figure 2B, VACR
The EL adhesive is torn from the silicon substrate. In FIG. 2C, a mixed failure is shown where the VACREL is partially torn from the nozzle plate and partially torn from the silicon substrate.
第２Ｄ図には、本発明によって可能とされるＶＡＣＲＥ
Ｌの最適かつ望ましい凝集破壊（ｃｏｈｅｓｉｖｅ ｆ
ａｉｌｕｒｅ）が示されている。ここでは、ＶＡＣＲＥ
Ｌはどちら側からも引き裂かれていす、むしろ接着剤の
内部で、上下方向に引き裂かれていて、この型の接着結
合法を使用することにより最強の接着が可能になること
を示している。FIG. 2D shows the VACRE
The optimal and desirable cohesive failure of L (cohesive f
ailure) is shown. Here, VACRE
L was not torn from either side, but rather torn inside the adhesive in an up-and-down direction, indicating that using this type of adhesive bonding method allows for the strongest bond.
上記実施例において、本発明の範囲からはずれることな
しに、いろいろな変形例が作られる。たとえば、本発明
は、プリントヘッドデバイスの積層あるいは、積層され
る明確な数の層部材に制限されるものではない。Various modifications may be made to the embodiments described above without departing from the scope of the invention. For example, the present invention is not limited to the stacking of printhead devices or to a specific number of stacked layer members.
以上説明したように、本発明を用いることにより、複合
積層構造物における各層部材間の接着結合を容易に強化
することができる。As explained above, by using the present invention, the adhesive bond between each layer member in a composite laminate structure can be easily strengthened.
第１Ａ図から第１Ｅ図は本発明の一実施例による積層及
び、接着結合方法を示す概略断面図。第ｕ図から第２Ｄ
図は本発明の一実施例による、凝集破壊モードを含む名
種の接着の故障モードを示す図である。
１０：シリコン基板、１２：／ズルｊ反、１４ ： Ｖ
ＡＣＲＥＬ、１６：圧力均一化複合部材、２４：鋼製支
持台、３０：ヒート・ステーカーの頭。1A to 1E are schematic cross-sectional views showing a lamination and adhesive bonding method according to an embodiment of the present invention. Figures U to 2D
The figure is a diagram illustrating a variety of adhesive failure modes, including cohesive failure modes, in accordance with one embodiment of the present invention. 10: Silicon substrate, 12: / Zuru j anti, 14: V
ACREL, 16: Pressure equalization composite member, 24: Steel support, 30: Heat staker head.
Claims (3)
めの圧力を供給する装置との間にサ ンドイッチ状構造物を置くことを特徴とす る積層構造物製造方法。(1) A method for manufacturing a laminated structure, characterized in that a sandwich-like structure is placed between a member to be laminated and a device for supplying pressure for laminating and adhering the laminated member.
柔軟性のある金属部材ではさむ構造 をしていることを特徴とする特許請求の範 囲第１項記載の積層構造物製造方法。(2) The method for manufacturing a laminated structure according to claim 1, wherein the sandwich-like structure has a structure in which a liquefiable member is sandwiched between flexible metal members.
ることを特徴とする特許請求の範囲 第１項記載の積層構造物製造方法。(3) The method for manufacturing a laminated structure according to claim 1, wherein the laminated members are laminated and bonded using an adhesive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82433586A | 1986-01-30 | 1986-01-30 | |
| US824335 | 1986-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62181148A true JPS62181148A (en) | 1987-08-08 |
| JPH0794165B2 JPH0794165B2 (en) | 1995-10-11 |
Family
ID=25241122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62019598A Expired - Lifetime JPH0794165B2 (en) | 1986-01-30 | 1987-01-29 | Laminated structure manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0231790A3 (en) |
| JP (1) | JPH0794165B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2006047A1 (en) * | 1989-03-27 | 1990-09-27 | Niels J. Nielsen | Printhead performance tuning via ink viscosity adjustment |
| US5436650A (en) * | 1991-07-05 | 1995-07-25 | Canon Kabushiki Kaisha | Ink jet recording head, process for producing the head and ink jet recording apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS533475A (en) * | 1976-06-30 | 1978-01-13 | Dantani Plywood Co | Method of manufacture of decorative plate consisted of plate provided with overrlayer of synthetic resin film |
| JPS53147782A (en) * | 1977-05-27 | 1978-12-22 | Freudenberg Carl | Balance plate for vulcanization press and the like |
| JPS5796823A (en) * | 1980-12-08 | 1982-06-16 | Hitachi Chem Co Ltd | Method of molding laminated product |
| JPS5871107A (en) * | 1981-10-23 | 1983-04-27 | 松下電工株式会社 | Manufacture of decorative plywood |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2430015C3 (en) * | 1974-06-22 | 1978-04-06 | Th. Goldschmidt Ag, 4300 Essen | Process for the surface treatment of flat materials with the achievement of a surface structure |
| DE2627442A1 (en) * | 1976-06-18 | 1977-12-29 | Becker & Van Huellen | Heating plate press contg. press pad - of synthetic and/or inorganic random fibre web coated with silicone rubber |
| JPS57102366A (en) * | 1980-12-18 | 1982-06-25 | Canon Inc | Ink jet head |
| US4437100A (en) * | 1981-06-18 | 1984-03-13 | Canon Kabushiki Kaisha | Ink-jet head and method for production thereof |
-
1987
- 1987-01-16 EP EP87100520A patent/EP0231790A3/en not_active Withdrawn
- 1987-01-29 JP JP62019598A patent/JPH0794165B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS533475A (en) * | 1976-06-30 | 1978-01-13 | Dantani Plywood Co | Method of manufacture of decorative plate consisted of plate provided with overrlayer of synthetic resin film |
| JPS53147782A (en) * | 1977-05-27 | 1978-12-22 | Freudenberg Carl | Balance plate for vulcanization press and the like |
| JPS5796823A (en) * | 1980-12-08 | 1982-06-16 | Hitachi Chem Co Ltd | Method of molding laminated product |
| JPS5871107A (en) * | 1981-10-23 | 1983-04-27 | 松下電工株式会社 | Manufacture of decorative plywood |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0231790A2 (en) | 1987-08-12 |
| JPH0794165B2 (en) | 1995-10-11 |
| EP0231790A3 (en) | 1989-06-14 |
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