JPS62180538U - - Google Patents

Info

Publication number
JPS62180538U
JPS62180538U JP1986068511U JP6851186U JPS62180538U JP S62180538 U JPS62180538 U JP S62180538U JP 1986068511 U JP1986068511 U JP 1986068511U JP 6851186 U JP6851186 U JP 6851186U JP S62180538 U JPS62180538 U JP S62180538U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
substrate
driving element
diode arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986068511U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0517249Y2 (US08197722-20120612-C00042.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986068511U priority Critical patent/JPH0517249Y2/ja
Publication of JPS62180538U publication Critical patent/JPS62180538U/ja
Application granted granted Critical
Publication of JPH0517249Y2 publication Critical patent/JPH0517249Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP1986068511U 1986-05-07 1986-05-07 Expired - Lifetime JPH0517249Y2 (US08197722-20120612-C00042.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (US08197722-20120612-C00042.png) 1986-05-07 1986-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986068511U JPH0517249Y2 (US08197722-20120612-C00042.png) 1986-05-07 1986-05-07

Publications (2)

Publication Number Publication Date
JPS62180538U true JPS62180538U (US08197722-20120612-C00042.png) 1987-11-16
JPH0517249Y2 JPH0517249Y2 (US08197722-20120612-C00042.png) 1993-05-10

Family

ID=30908392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986068511U Expired - Lifetime JPH0517249Y2 (US08197722-20120612-C00042.png) 1986-05-07 1986-05-07

Country Status (1)

Country Link
JP (1) JPH0517249Y2 (US08197722-20120612-C00042.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124228A (en) * 1978-03-22 1979-09-27 Toshiba Corp Parent-and-child type transformer for use in meters

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59148340U (ja) * 1983-03-25 1984-10-03 沖電気工業株式会社 発光出力補正装置
JPS6118848U (ja) * 1984-07-06 1986-02-03 三洋電機株式会社 光プリントヘツド

Also Published As

Publication number Publication date
JPH0517249Y2 (US08197722-20120612-C00042.png) 1993-05-10

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