JPS62178575U - - Google Patents

Info

Publication number

JPS62178575U

JPS62178575U JP6706186U JP6706186U JPS62178575U JP S62178575 U JPS62178575 U JP S62178575U JP 6706186 U JP6706186 U JP 6706186U JP 6706186 U JP6706186 U JP 6706186U JP S62178575 U JPS62178575 U JP S62178575U

Authority

JP

Japan

Prior art keywords

component mounting

electronic component

soldering

solder resist

conductive foil

Prior art date

1986-04-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims description 4
• 239000011888 foil Substances 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 238000000034 method Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1