JPS62178564U - - Google Patents
Info
- Publication number
- JPS62178564U JPS62178564U JP6708686U JP6708686U JPS62178564U JP S62178564 U JPS62178564 U JP S62178564U JP 6708686 U JP6708686 U JP 6708686U JP 6708686 U JP6708686 U JP 6708686U JP S62178564 U JPS62178564 U JP S62178564U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- wiring board
- component side
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6708686U JPS62178564U (it) | 1986-05-02 | 1986-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6708686U JPS62178564U (it) | 1986-05-02 | 1986-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62178564U true JPS62178564U (it) | 1987-11-12 |
Family
ID=30905671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6708686U Pending JPS62178564U (it) | 1986-05-02 | 1986-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62178564U (it) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09107159A (ja) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | 回路基板とその製造方法 |
| JP2014049648A (ja) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | プリント配線基板 |
| JP2018515941A (ja) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法 |
-
1986
- 1986-05-02 JP JP6708686U patent/JPS62178564U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09107159A (ja) * | 1996-10-07 | 1997-04-22 | Hokuriku Electric Ind Co Ltd | 回路基板とその製造方法 |
| JP2014049648A (ja) * | 2012-08-31 | 2014-03-17 | Yazaki Corp | プリント配線基板 |
| JP2018515941A (ja) * | 2015-05-08 | 2018-06-14 | アジャイル・パワー・スイッチ・３・ディー−インテグレイション・エイ・ピー・エス・アイ・３・ディー | 半導体パワーデバイスおよび半導体パワーデバイスの組立て方法 |
| US10714428B2 (en) | 2015-05-08 | 2020-07-14 | Agile Power Switch 3D—Integration Apsi3D | Semiconductor power device and a method of assembling a semiconductor power device |