JPS62178555U - - Google Patents
Info
- Publication number
- JPS62178555U JPS62178555U JP1986065909U JP6590986U JPS62178555U JP S62178555 U JPS62178555 U JP S62178555U JP 1986065909 U JP1986065909 U JP 1986065909U JP 6590986 U JP6590986 U JP 6590986U JP S62178555 U JPS62178555 U JP S62178555U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- copper
- heat exchange
- pattern
- thermoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986065909U JPS62178555U (US06589383-20030708-C00041.png) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986065909U JPS62178555U (US06589383-20030708-C00041.png) | 1986-04-30 | 1986-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62178555U true JPS62178555U (US06589383-20030708-C00041.png) | 1987-11-12 |
Family
ID=30903418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986065909U Pending JPS62178555U (US06589383-20030708-C00041.png) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62178555U (US06589383-20030708-C00041.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997045882A1 (fr) * | 1996-05-28 | 1997-12-04 | Matsushita Electric Works, Ltd. | Procede de fabrication d'un module thermoelectrique |
JP2020034198A (ja) * | 2018-08-28 | 2020-03-05 | 日本碍子株式会社 | ヒートポンプ、暖房システム及び冷房システム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572679B2 (US06589383-20030708-C00041.png) * | 1973-11-29 | 1982-01-18 | ||
JPS6076179A (ja) * | 1983-09-30 | 1985-04-30 | Saamobonitsuku:Kk | 熱電変換装置 |
JPS60189942A (ja) * | 1984-03-12 | 1985-09-27 | Toshiba Corp | 半導体装置 |
-
1986
- 1986-04-30 JP JP1986065909U patent/JPS62178555U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572679B2 (US06589383-20030708-C00041.png) * | 1973-11-29 | 1982-01-18 | ||
JPS6076179A (ja) * | 1983-09-30 | 1985-04-30 | Saamobonitsuku:Kk | 熱電変換装置 |
JPS60189942A (ja) * | 1984-03-12 | 1985-09-27 | Toshiba Corp | 半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997045882A1 (fr) * | 1996-05-28 | 1997-12-04 | Matsushita Electric Works, Ltd. | Procede de fabrication d'un module thermoelectrique |
JP2020034198A (ja) * | 2018-08-28 | 2020-03-05 | 日本碍子株式会社 | ヒートポンプ、暖房システム及び冷房システム |