JPS6217835B2 - - Google Patents
Info
- Publication number
- JPS6217835B2 JPS6217835B2 JP54046855A JP4685579A JPS6217835B2 JP S6217835 B2 JPS6217835 B2 JP S6217835B2 JP 54046855 A JP54046855 A JP 54046855A JP 4685579 A JP4685579 A JP 4685579A JP S6217835 B2 JPS6217835 B2 JP S6217835B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating board
- socket
- internal insulating
- lead
- fixing jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
Landscapes
- Connecting Device With Holders (AREA)
Description
【発明の詳細な説明】
この発明は半導体装置のソケツトに係り、特に
デユアル・イン・ライン型パツケージを有する
IC用ソケツトに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a socket for a semiconductor device, and particularly to a socket having a dual-in-line type package.
This relates to IC sockets.
従来、一般的なIC用ソケツトは第１図ａに示
すような断面構造を有していた。 Conventionally, a general IC socket has had a cross-sectional structure as shown in FIG. 1a.
この構造によれば、コンタクトピン５がIC６
のリード７を、ICのソケツトへの挿入時点から
加圧接触する様になつているので、ICの挿入、
取外しに際しては大きな力を有するという欠点が
あつた。特にリード７が拡がつている場合IC６
の着脱に際して大きな力が必要である。このた
め、たまたまIC６のリード７がうまくコンタク
トピン５の中心にはいらなかつた場合には、第１
図ｂに示すようにIC６のリード７が曲つてしま
うという欠点があつた。 According to this structure, the contact pin 5 is connected to the IC6
Since the lead 7 of the IC is pressed into contact with the IC from the time of insertion into the socket, it is easy to insert the IC into the socket.
It had the disadvantage of requiring a large amount of force when removed. Especially if lead 7 is widened, IC6
A large amount of force is required when attaching and detaching. Therefore, if the lead 7 of the IC 6 does not fit into the center of the contact pin 5, the first
As shown in Figure b, the lead 7 of the IC 6 was bent.
この発明は、第１に内部絶縁基板をIC装着前
の時点では浮き上がらせておくことにより、IC
のICソケツト上での左右方向の移動を容易に行
なわしめることでもつてICのICソケツトへの自
動装着装置をシンプルなものとすることにある。 This invention firstly allows the internal insulating board to float before mounting the IC.
The object of the present invention is to simplify an automatic mounting device for an IC on an IC socket by easily moving the IC in the left and right directions on the IC socket.
第２に、ICをコンタクトピンから離した状態
でICソケツトに対して位置決めを行ない、かつ
背面方向より挿入するために、ICのリードが挿
入時に変形するというトラブルが極めて少なくす
ることにある。第３に、ICの装着を固定用治具
によつて行なうが、ICを取外す際、この固定用
治具を取外すだけで、ICは内部絶縁基板下に設
けられた弾性体の復帰力により、自動的に、IC
ソケツトから取外すことを可能にする。 Second, since the IC is positioned with respect to the IC socket while being separated from the contact pins and inserted from the back side, troubles such as the IC leads being deformed during insertion are minimized. Thirdly, the IC is mounted using a fixing jig, but when removing the IC, simply removing this fixing jig allows the IC to be fixed by the restoring force of the elastic body provided under the internal insulating board. Automatically, IC
Allows for removal from the socket.
次に、この発明の実施例を、図面を用いて説明
する。 Next, embodiments of the invention will be described using the drawings.
この発明の一構成例は、第２図ａに示すよう
に、IC６が上下移動可能な構造を有し、IC６の
ガイド溝を有する内部絶縁基板１と、この基板１
の復帰力となる弾性体２等を備えている。他に、
外側絶縁基板４およびこれに固定されたコンクタ
トピン５により構成され、さらに、IC装着用と
しての固定用治具３によつて構成されている。 One configuration example of the present invention, as shown in FIG.
It is equipped with an elastic body 2, etc., which provides a restoring force. other,
It is composed of an outer insulating substrate 4 and contact pins 5 fixed thereto, and further composed of a fixing jig 3 for mounting an IC.
このようなICソケツトの使用方法としては第
２図ｂに示すように最初の状態で内部絶縁基板１
は浮いた状態になつている。この内部絶縁基板１
上をガイドに沿つてICは左右方向の移動を行な
い、所定の位置で停止する。 As shown in Figure 2b, the method of using such an IC socket is to connect the internal insulating board 1 in the initial state.
is in a floating state. This internal insulating board 1
The IC moves horizontally along the guide at the top and stops at a predetermined position.
次に固定用治具３を用いてIC６は下方に移動
を行ない、所定の位置で停止する。 Next, the IC 6 is moved downward using the fixing jig 3 and stopped at a predetermined position.
次に固定用治具３を用いてIC６を下方に移動
せしめ、ソケツトに装着せしめる。こうして、
IC６のピンとソケツトのピン５とが接触する。
取外し法としては、固定用治具３を上へ取外すこ
とで、IC６は内部絶縁基板１下の弾性体２によ
り自動的に復帰する。その後、IC６を左右いず
れかの方向に移動させると、IC６は外れる。 Next, use the fixing jig 3 to move the IC 6 downward and attach it to the socket. thus,
The pin of IC6 and pin 5 of the socket come into contact.
As for the removal method, by removing the fixing jig 3 upward, the IC 6 is automatically returned to its original position by the elastic body 2 under the internal insulating board 1. After that, if the IC6 is moved to either the left or right direction, the IC6 will come off.
以上のように本発明は、例えばICのソケツト
への装着を背面方向より行なう方式に関し、IC
用ソケツトの内部絶縁基板が上下に移動して、前
記ICの装着と取外しができ、かつIC背面を長手
方向に移動させるための溝型ガイド構造を有して
いること等を特徴とする。 As described above, the present invention relates to, for example, a method for mounting an IC into a socket from the back side.
The internal insulating board of the socket can be moved up and down to allow mounting and removal of the IC, and the IC socket is characterized by having a groove-type guide structure for moving the back surface of the IC in the longitudinal direction.
この発明の効果は、ICの着脱時において、IC
のリードの変形が極めて小さいということと、着
脱方法が簡単であるということ等である。従つ
て、ICのソケツトへの自動装着装置が極めてシ
ンプルになるという効果がある。 The effect of this invention is that the IC
The deformation of the lead is extremely small, and the method of attachment and detachment is simple. Therefore, there is an effect that the automatic mounting device for the IC into the socket becomes extremely simple.
第１図ａは従来方式のICソケツト装着を示す
断面図で、第１図ｂはICリードの曲がりを示す
断面図である。第２図ａ、及び第２図ｂはこの発
明のソケツトの一実施例を示す断面図である。
尚、図において１……内部絶縁基板、２……弾
性体、３……固定用治具、４……外側絶縁基板、
５……コンタクトピン、６……IC、７……ICリ
ード。
FIG. 1a is a sectional view showing conventional IC socket mounting, and FIG. 1b is a sectional view showing the bending of an IC lead. FIGS. 2a and 2b are sectional views showing one embodiment of the socket of the present invention. In the figure, 1...internal insulating substrate, 2...elastic body, 3...fixing jig, 4...outer insulating substrate,
5...Contact pin, 6...IC, 7...IC lead.
Claims (1)
によつて囲まれた内部空間に弾性体によつて上下
方向に移動する内部絶縁基板を設け、該内部絶縁
基板の表面は装着されるICのガイド溝を有し、
ICのリード折り曲げ方向とは逆方向からICを前
記内部絶縁基板のガイド溝に装着し、該ICに固
定用治具を用いて圧力をかけることによつて前記
内部絶縁基板を押し下げてICのリードと前記コ
ンタクトピンとを接触固定せしめ、前記固定用治
具を取りはずすことによつて前記弾性体の復帰力
を利用して前記内部絶縁基板を上方向に移動せし
め、前記ICを取りはずすことを特徴とする半導
体装置のソケツト。1. An internal insulating board that moves vertically by an elastic body is provided in an internal space surrounded by an external insulating board that has contact pins inside, and the surface of the internal insulating board has guide grooves for the IC to be mounted. have,
Mount the IC into the guide groove of the internal insulating board from the opposite direction to the bending direction of the IC lead, and apply pressure to the IC using a fixing jig to push down the internal insulating board and lead the IC. and the contact pin, and by removing the fixing jig, the internal insulating board is moved upward using the restoring force of the elastic body, and the IC is removed. Socket for semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4685579A JPS55139776A (en) | 1979-04-17 | 1979-04-17 | Socket for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4685579A JPS55139776A (en) | 1979-04-17 | 1979-04-17 | Socket for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55139776A JPS55139776A (en) | 1980-10-31 |
| JPS6217835B2 true JPS6217835B2 (en) | 1987-04-20 |
Family
ID=12758945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4685579A Granted JPS55139776A (en) | 1979-04-17 | 1979-04-17 | Socket for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55139776A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61157290U (en) * | 1985-03-22 | 1986-09-29 | ||
| JPS62283580A (en) * | 1986-05-30 | 1987-12-09 | 山一電機工業株式会社 | Ic socket |
| JPH02155181A (en) * | 1989-10-02 | 1990-06-14 | Yamaichi Electric Mfg Co Ltd | Ic connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498168A (en) * | 1972-05-10 | 1974-01-24 | ||
| JPS5435857B2 (en) * | 1975-04-22 | 1979-11-06 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5435857U (en) * | 1977-08-17 | 1979-03-08 |
-
1979
- 1979-04-17 JP JP4685579A patent/JPS55139776A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498168A (en) * | 1972-05-10 | 1974-01-24 | ||
| JPS5435857B2 (en) * | 1975-04-22 | 1979-11-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55139776A (en) | 1980-10-31 |
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