JPH02155181A - Ic connector - Google Patents

Ic connector

Info

Publication number
JPH02155181A
JPH02155181A JP25838189A JP25838189A JPH02155181A JP H02155181 A JPH02155181 A JP H02155181A JP 25838189 A JP25838189 A JP 25838189A JP 25838189 A JP25838189 A JP 25838189A JP H02155181 A JPH02155181 A JP H02155181A
Authority
JP
Japan
Prior art keywords
contact
package
piece
lead
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25838189A
Other languages
Japanese (ja)
Other versions
JPH0352195B2 (en
Inventor
Yoshinori Egawa
江川 吉徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to JP25838189A priority Critical patent/JPH02155181A/en
Publication of JPH02155181A publication Critical patent/JPH02155181A/en
Publication of JPH0352195B2 publication Critical patent/JPH0352195B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

PURPOSE:To prevent separation of an IC package in the direction opposite to the loading direction and achieve electric contact by causing an elastic contact segment, constituting a contact of a connector, to engage a shoulder segment of an IC reed base. CONSTITUTION:An IC package 1 is loaded into a connector 4 with a contact 6 being elastically displaced backwardly, and when a contact segment 6a of the contact 6 reaches a shoulder segment 3a of an IC reed 3 the segment 6a elastically returns to original form, and the shape of the L-shaped shoulder segment 3a is utilized to cause an engaging part 6d provided at the free end of the contact 6 to abut the outer surface thereof with elastic pressure to achieve sure hooking engagement effect for every IC reed 3. Thus, by the cooperation of the IC reed 3 and the contact 6, the IC package 1 can be retained properly in the connector, so that accidental flotation and separation of the IC package 1 due to vibration and shock, etc., can be prevented, and at the same time, good electrical contact between the IC reed 3 and the contact 6 can be achieved by the engaging part 6d.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はICリードが側面に沿い構成されたICパッケ
ージ用の接続器に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a connector for an IC package in which IC leads are arranged along the sides.

従来技術と問題点 ICパッケージにはそのリードの形態により、Jベンド
型と呼称されるものがある。これはICパッケージ本体
側面より側方へ肩部片を短く突出し、更に該肩部片から
折曲部片をtCパッケージ側面に沿い折曲し、該折曲部
片先端を内側へU字形に曲げ込んだICリードを有する
ものを指称する。
Prior Art and Problems Some IC packages are called J-bend type, depending on the shape of their leads. This involves protruding a shoulder piece to the side from the side of the IC package body, then bending a bent piece from the shoulder piece along the side of the TC package, and bending the tip of the bent piece inward into a U-shape. Refers to those with a deep IC lead.

又上記Jベンド型のICリードの上記U字曲げ片を除去
した形態のICリードを持ったICパッケージも実用さ
れており、前者と同様ICリードがICパッケージ本体
の側面に沿いコ形に構成された基本形態を呈する。
Also, an IC package having an IC lead in which the U-shaped bent piece of the J-bend type IC lead is removed is also in practical use, and like the former, the IC lead is configured in a U-shape along the side of the IC package body. It has a basic form.

而してこれらを例えばプリント配線基板へ搭載する場合
に使用する接続器は、上記ICリードの上記折曲部片の
外側面へコンタクトを弾性的に押し当てる方法により電
気的接触を図り、且つその摩擦接触によりICパッケー
ジを保持する機構が採られているが、単なる摩擦に依存
するため、押し込みが不充分となる場合もあって、振動
や衝撃によりICパッケージが接続器より浮上ったり、
離脱する恐れがあり、ひいては電気的接触の信頼性を損
なう問題がある。
Therefore, the connector used when mounting these on a printed wiring board, for example, establishes electrical contact by elastically pressing a contact against the outer surface of the bent piece of the IC lead, and A mechanism is used to hold the IC package through frictional contact, but since it relies on mere friction, there are cases where the pushing is insufficient, and the IC package may rise above the connector due to vibration or impact.
There is a risk that the wires may come off, which may further impair the reliability of electrical contact.

発明の目的 本発明は上記Jベンド型等のICパッケージにおいて、
ICパッケージのIcリードと接続器の前記コンタクト
とが良好な電気的接触を果し且つその接触状態を維持す
ると共に、ICリードとコンタクトとの協働にてICパ
ッケージが接続器へ適切に保持されるようにした接続器
を提供するものである。
Purpose of the Invention The present invention provides an IC package such as the above-mentioned J-bend type,
The IC lead of the IC package and the contact of the connector make and maintain good electrical contact, and the IC package is properly held to the connector by the cooperation of the IC lead and the contact. The present invention provides a connector designed to allow

発明の構成 本発明は上記目的を達成すべく構成されたものであフて
、後記する実施例に詳述する如く、接続器のコンタクト
を構成する弾性接触片をJベンド型ICパッケージ等の
本来接触部位として形成されたICリード遊離片たる折
曲部片へ接触させずに、ICリード基部の肩部片へ上記
弾性接触片自由端を弾性的に係合させ、ICパッケージ
の装填方向とは逆方向への離脱を防止し、且つ電気的接
触を図る構成としたものである。
DESCRIPTION OF THE INVENTION The present invention has been constructed to achieve the above-mentioned object, and as will be described in detail in the embodiments to be described later, the elastic contact pieces constituting the contacts of the connector can be used in a J-bend type IC package or the like. The free end of the elastic contact piece is elastically engaged with the shoulder piece of the IC lead base without contacting the bent piece that is the free piece of the IC lead formed as a contact part, and the loading direction of the IC package is The structure is designed to prevent separation in the opposite direction and to establish electrical contact.

発明の実施例 以下本発明を実施例として示した第1図乃至第4図に基
いて詳述する。
Embodiments of the Invention The present invention will be described in detail below with reference to FIGS. 1 to 4, which are shown as embodiments.

図において1はJベンド型と呼称されるICパッケージ
、2はICを内蔵せる方形絶縁盤から成るICパッケー
ジ本体を示す。
In the figure, 1 shows an IC package called a J-bend type, and 2 shows an IC package main body consisting of a rectangular insulating board in which the IC is built.

ICパッケージ1は同本体2の側面に並設された多数の
ICリード3を有する。該ICリード3はICパッケー
ジ本体2の側面より側方へ短く突出された肩部片3aと
、該肩部片3aから本体2の側面に沿い本体背面側へ向
い折曲された折曲部片3bとから成り、更に折曲部片3
bの先端から本体2の底面側へ0字状に折り返された先
端部片3Cを有する。
The IC package 1 has a large number of IC leads 3 arranged in parallel on the side surface of the main body 2. The IC lead 3 includes a shoulder piece 3a that protrudes laterally from the side surface of the IC package main body 2, and a bent piece that is bent from the shoulder piece 3a along the side surface of the main body 2 toward the back side of the main body. 3b, and further includes a bent piece 3
It has a tip piece 3C folded back in a 0-shape from the tip of b to the bottom side of the main body 2.

他方4は上記ICパッケージ1用の接続器、5は絶縁材
から成る接続器本体を示す、該接続器本体5は周壁5a
を有し、該周壁5aにてIC収容室5bを画成する。I
Cパッケージ1は該IC収容室5bに収容され、その側
面に配置のICリード3を周壁5aの内側面と対向する
On the other hand, 4 is a connector for the IC package 1, and 5 is a connector body made of an insulating material.
The peripheral wall 5a defines an IC storage chamber 5b. I
The C package 1 is housed in the IC housing chamber 5b, and the IC leads 3 disposed on its side faces the inner side of the peripheral wall 5a.

第1図に示すように、周!l! 5 aの内側壁にIC
収容室5bの深さ方向(IC抜差方向)の隔壁7を同内
側壁に沿い等間隔に並設し、各隔壁7間に形成されたコ
ンタクト収容溝8内にTCIJ−ド3と接触するコンタ
クト6を収容し、隔壁7にて互いに隔絶する。又周壁5
aの対角線上にあるコーナ部には周壁をその間口端面側
から切除して工具挿入溝9を形成する。
As shown in Figure 1, Zhou! l! 5 IC on the inner wall of a
Partition walls 7 in the depth direction (IC removal/insertion direction) of the storage chamber 5b are arranged side by side at equal intervals along the inner wall thereof, and are brought into contact with the TCIJ-dead 3 in the contact storage groove 8 formed between each partition wall 7. The contacts 6 are accommodated and separated from each other by a partition wall 7. Also surrounding wall 5
A tool insertion groove 9 is formed in the corner portion on the diagonal line of a by cutting the peripheral wall from the mouth end surface side.

ICリード3はICパッケージの周囲四側面に等ピッチ
で配置され、これに対応しコンタクト6を周壁5aの四
側面に配置する。
The IC leads 3 are arranged at equal pitches on the four peripheral sides of the IC package, and correspondingly the contacts 6 are arranged on the four sides of the peripheral wall 5a.

コンタクト6は上記ICリード3の折曲部片3bの外側
位において該折曲部片3bとは逆方向、即ち折曲部片3
の先端側から基部側(肩部片3a側)へ向は延ばされた
弾性接触片6aを具備する。該弾性接触片6aはその基
端を接続器本体5に植付け、該植付部6Cを支点として
ICリード3の外側面に対し接近、IalI間する方向
へ弾性変位可とする。6bは上記植付部から接続器下方
へと突出された雄端子である。
The contact 6 is located outside the bent portion 3b of the IC lead 3 in the opposite direction to the bent portion 3b, that is, the bent portion 3
The elastic contact piece 6a is extended from the distal end side to the base side (shoulder piece 3a side). The elastic contact piece 6a has its proximal end planted in the connector main body 5, and can be elastically displaced toward and away from the outer surface of the IC lead 3 using the planted portion 6C as a fulcrum. Reference numeral 6b is a male terminal projecting from the planting part to the lower side of the connector.

而して上記の如く弾性変位可となされた弾性接触片6a
の自由端をその内方向弾性復元力でICリード3の前記
肩部片3d外面へ係合させる。該係合手段として弾性接
触片6aの自由端をICリード側へ向は湾曲し係合部(
接点構成部を兼ねる)6dを形成する。該係合状態はI
Cパッケージ1をICリード3の弾性接触片6a先端側
からIC収容室5bに装填することによつて得られる。
Thus, the elastic contact piece 6a, which is elastically displaceable as described above,
The free end of the shoulder piece 3d of the IC lead 3 is engaged with the outer surface of the shoulder piece 3d of the IC lead 3 by its inward elastic restoring force. As the engagement means, the free end of the elastic contact piece 6a is curved toward the IC lead side, and the engagement portion (
) 6d which also serves as a contact component. The engaged state is I
This is obtained by loading the C package 1 into the IC storage chamber 5b from the tip side of the elastic contact piece 6a of the IC lead 3.

即ち、該rcパッケージ装填は折曲部片3bの外側面が
弾性接触片6aの保合部6dをその弾性に抗し外方へ押
しのけることによって進行され、一定の装填量に達した
時、弾性接触片6aの自由端の係合部6dが折曲部片3
bの外面を滑りつつ肩部片3d外面へと係合するに至る
That is, the loading of the RC package proceeds as the outer surface of the bent piece 3b pushes the retaining part 6d of the elastic contact piece 6a outward against its elasticity, and when a certain loading amount is reached, the elastic The engaging portion 6d at the free end of the contact piece 6a is bent by the bent portion 3.
While sliding on the outer surface of shoulder piece 3d, it comes to engage with the outer surface of shoulder piece 3d.

上記弾性接触片6a自出端の係合部6dと肩部片3aと
の係合はICパッケージ1の装填方向とは逆方向への不
容易な離脱を抑止し、且つ係合部6dにおいて電気的接
点を構成する。
The engagement between the engaging portion 6d of the protruding end of the elastic contact piece 6a and the shoulder piece 3a prevents the IC package 1 from being easily removed in the opposite direction to the loading direction, and also prevents the IC package 1 from being easily removed in the direction opposite to the loading direction. Configure points of contact.

32図A、B、第3図、第4図は上記説明に従りて構成
した幾つかの実施例を示すものである。
Figures 32A and 32B, 3 and 4 show several embodiments constructed in accordance with the above description.

第2図A、Bは一枚の弾性に富む板条片でコンタクト6
を形成し、接触片6aを植付部6cからICリードへ向
は前傾させて設け、該前傾端にICリードへ向は湾曲加
工して前記係合部6dを形成し、該保合部6dをICパ
ッケージ挿入時、第2図Aに示す如<ICリード3の折
曲部片3b外側面に当接しつつ、弾性に抗し後方へ反り
曲げ、肩部片3aに至フて復元し、第2図Bに矢印で示
す方向の弾力を以って当接係合するようにし、該保合部
6dにて前記ICパッケージの離脱抑止と電気的接触と
を図るようにしたものである。上記係合状態はICパッ
ケージ本体2底面がIC収容室5b内底部の支持壁5d
に支持された状態で得られる。
Figure 2 A and B show contact 6 with a single highly elastic plate strip.
The contact piece 6a is provided tilted forward from the planting part 6c toward the IC lead, and the engaging part 6d is formed by bending the forward tilted end toward the IC lead. When the part 6d is inserted into the IC package, as shown in FIG. 2A, it is bent backward against the elasticity while abutting the outer surface of the bent part 3b of the IC lead 3, and is restored to the shoulder part 3a. The IC package is brought into contact and engaged with elasticity in the direction shown by the arrow in FIG. be. In the above engaged state, the bottom surface of the IC package body 2 is connected to the support wall 5d at the inner bottom of the IC storage chamber 5b.
obtained in a state supported by.

第3図は一枚の弾性に富む板条片でコンタクト6を形成
し、弾性接触片6aを前記と同様植付部6Cより前傾姿
勢で設けて良好なバネ性を付与すると共に、植付部は弾
性接触片6aの基部に連なる条片部分を二枚重ね折りに
して立上げて植込脚片6eを形成し、これを接続器本体
5の周壁5a内側面に形成した植込孔5Cに圧入して植
込みを図り、該周壁植込用の脚片6e端部から雄端子6
bを接続器本体下方へ向は突出させたものであり、更に
同実施例はIcリート3の肩部片3aに係合する係合部
6dの直下に第2接点部6f(係合部6dを第1接点部
とする)を形成し、該第2接点部6fを肩部片3aと折
曲部片3bとの連設部に形成された折曲角部付近の折曲
部片端部へ弾性的に接触させる構成とする。
In Fig. 3, the contact 6 is formed of a single highly elastic plate strip, and the elastic contact piece 6a is tilted forward from the planting part 6C in the same manner as above to impart good springiness and to The strip portion connected to the base of the elastic contact piece 6a is folded in two and raised to form the implant leg piece 6e, which is press-fitted into the implant hole 5C formed on the inner surface of the peripheral wall 5a of the connector main body 5. The male terminal 6 is inserted from the end of the leg piece 6e for implantation into the peripheral wall.
In this embodiment, a second contact portion 6f (an engaging portion 6d) is provided directly below the engaging portion 6d that engages with the shoulder piece 3a of the Ic lead 3. is the first contact portion), and the second contact portion 6f is connected to the end of the bent portion near the bent corner formed in the continuous portion between the shoulder piece 3a and the bent portion 3b. The structure is such that they are brought into elastic contact.

上記実施例の利点は、多数のコンタクト6中には製作誤
差等から不揃いが発生するものもあり、係合部6dと肩
部片3aとの間に遊びを生じ接触不良となる恐れがある
The advantage of the above-mentioned embodiment is that some of the contacts 6 may be uneven due to manufacturing errors, and there is a possibility that play may occur between the engaging portion 6d and the shoulder piece 3a, resulting in poor contact.

この場合接触片6は第2接点部6fがICリード3へ当
接するまで復元し接触を確保し、係合部6dはICパッ
ケージが浮動せんとする時、肩部片3aへ保合可能な状
態に置かれる。IC収容室5b内に収容されコンタクト
6の弾力にて保持されたICパッケージ1は第1図に示
す工具挿入溝9から工具を差し入れ離脱される。
In this case, the contact piece 6 restores itself until the second contact part 6f comes into contact with the IC lead 3 to ensure contact, and the engaging part 6d is in a state where it can be held on the shoulder piece 3a when the IC package tries to float. placed in The IC package 1 housed in the IC housing chamber 5b and held by the elasticity of the contacts 6 is removed by inserting a tool into the tool insertion groove 9 shown in FIG.

更に第4図は前記コンタクト60弾性接触片6a自由端
の第1接点部たる係合部6dによる接触係合と、第2接
点部6fによる接触を図ると同時に、コンタクト6にI
Cリード3の先端部片3cを支える弾性支持部片6gを
具備させて該支持部片6gによるICリード先端部片3
cの支持にてICパッケージ1全体を弾性的に支持する
ようにした場合を示す。
Furthermore, FIG. 4 shows that the contact 60 is engaged by the engaging part 6d which is the first contact part of the free end of the elastic contact piece 6a, and the contact is made by the second contact part 6f.
An elastic support piece 6g that supports the tip piece 3c of the C lead 3 is provided, and the IC lead tip piece 3 is supported by the support piece 6g.
A case is shown in which the entire IC package 1 is elastically supported by the support shown in FIG.

接触部片6aは既述のように係合部6dにて肩部片3a
を図中矢印方向に押し、下方向の分力を生じさせてIC
パッケージ本体を押し込み方向へ常時押圧する。逆に上
記弾性支持部片6gはICパッケージ本体へ押上刃を与
え、これに対向する上記係合部6dとの間で同ICパッ
ケージ本体2をバランス的に捕捉する。
As described above, the contact piece 6a is connected to the shoulder piece 3a at the engaging part 6d.
Push the IC in the direction of the arrow in the figure to generate a downward component of force.
Always press the package body in the pushing direction. On the other hand, the elastic support piece 6g provides a push-up edge to the IC package body, and catches the IC package body 2 in a balanced manner between the elastic support piece 6g and the engaging portion 6d facing therebetween.

上記弾性支持部片6gは同時にICリード3との電気的
接触手段として機能し接触部片6aと協働して信頼性高
い接触を果す。
The elastic support piece 6g also functions as an electrical contact means with the IC lead 3, and cooperates with the contact piece 6a to achieve highly reliable contact.

発明の効果 本発明は以上詳述したように、ICパッケージをコンタ
クトを後方へ弾性変位しながら接続器へ装填し、コンタ
クトの接触部片をICリードの肩部片まで到達させて弾
性復元させ、コ形となっている同肩部片の形状を利用し
、その外面へコンタクト自由端に設けた係合部をその弾
性圧を以って当接させICリードの一本一木に対し確実
な引掛は係合効果を得ることができる。又肩部片の形状
利用に加え、最も強度が高い肩部片を活用することで係
合はより確実なものとなる。
Effects of the Invention As described in detail above, the present invention loads an IC package into a connector while elastically displacing the contacts backward, and causes the contact portions of the contacts to reach the shoulder portions of the IC leads and elastically restores their shape. Utilizing the U-shaped shape of the shoulder piece, the engaging part provided at the free end of the contact is brought into contact with the outer surface of the shoulder piece using its elastic pressure, ensuring a reliable contact with each IC lead. The hook can have an engaging effect. In addition to utilizing the shape of the shoulder piece, the engagement becomes more reliable by utilizing the shoulder piece with the highest strength.

本発明によれば、ICリードとコンタクトとの協働にて
接続器におけるICパッケージの保持が通正に果され、
撮動、衝撃等によるICバッケジの不用意な浮動、離脱
を効果的に防止する6同時に上記保合部にてICリード
とコンタクトとの良好な電気的接触を果し且つ該接触状
態を確実に維持する。
According to the present invention, the IC package is normally held in the connector by the cooperation of the IC lead and the contact,
Effectively prevents the IC bag from accidentally floating or detaching due to photography, impact, etc. 6. At the same time, the above-mentioned retaining portion makes good electrical contact between the IC lead and the contact, and ensures the contact state. maintain.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例たるrc接続器を一部破断して
示す斜視図、第2図はICリードとコンタクトの接触部
の拡大断面図で同A図はICパッケージ装填過程の状態
、同B図は同装填完了状態を夫々示し、第3図は他例を
示すICリードとコンタクトの接触部の拡大断面図、第
4図は更に他例を示すICリードとコンタクトの接触部
の拡大断面図である。 1・・・ICパッケージ、2・・・ICパッケージ本体
、3・・・ICリード、3a・・・肩部片、3b・・・
折曲部片、3C・・・先端部片、4・・・接続器、5・
・・接続器本体、6・・・コンタクト、6a・・・接触
部片、6d・・・係合部。 第2 図(A) 第2 図(B) 第3 図 b
Fig. 1 is a partially cutaway perspective view of an RC connector according to an embodiment of the present invention, Fig. 2 is an enlarged cross-sectional view of the contact area between the IC lead and the contact, and Fig. A is the state of the IC package loading process. Figure B shows the same loaded state, Figure 3 is an enlarged sectional view of the contact area between the IC lead and contact showing another example, and Figure 4 is an enlarged view of the contact area between the IC lead and contact showing another example. FIG. DESCRIPTION OF SYMBOLS 1...IC package, 2...IC package body, 3...IC lead, 3a...shoulder piece, 3b...
Bent piece, 3C... Tip piece, 4... Connector, 5.
... Connector body, 6... Contact, 6a... Contact piece, 6d... Engagement part. Figure 2 (A) Figure 2 (B) Figure 3 b

Claims (1)

【特許請求の範囲】[Claims] ICパッケージが該ICパッケージ本体側面より側方へ
突出された肩部片と、更に該肩部片からICパッケージ
本体側面に沿い折曲された折曲部片とを有する多数のI
Cリードを備え、該ICパッケージを上記折曲部片先端
側から接続器体へ装填し、接続器体に具備させた多数の
コンタクトとの接触を得る接続器において、上記ICリ
ード接触用のコンタクトをICリードの外側面に対し接
近、離間する方向に弾性変位可に配し、該コンタクトに
上記ICリードの折曲部片の外側位において該折曲部片
とは逆方向に延ばされた弾性接触片を具備させ、該弾性
接触片の自由端に上記肩部片外面に弾性的に係合しIC
パッケージの装填方向とは逆方向への離脱を防止する係
合部を具備させ、該係合部を以ってICリードとの電気
的接触を図る構成としたことを特徴とするIC接続器。
The IC package has a plurality of I-shaped parts, each having a shoulder piece projecting laterally from the side surface of the IC package body, and a bent piece bent from the shoulder piece along the side surface of the IC package body.
In a connector that is provided with a C lead, the IC package is loaded into the connector body from the tip side of the bent portion, and is brought into contact with a large number of contacts provided on the connector body, the IC lead contact contact is disposed so as to be elastically displaceable in the direction toward and away from the outer surface of the IC lead, and is extended to the contact at a position outside the bent portion of the IC lead in a direction opposite to the bent portion. an elastic contact piece is provided, the free end of the elastic contact piece is elastically engaged with the outer surface of the shoulder piece;
An IC connector characterized in that it has an engaging part that prevents the package from coming off in a direction opposite to the loading direction, and the engaging part is used to make electrical contact with an IC lead.
JP25838189A 1989-10-02 1989-10-02 Ic connector Granted JPH02155181A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25838189A JPH02155181A (en) 1989-10-02 1989-10-02 Ic connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25838189A JPH02155181A (en) 1989-10-02 1989-10-02 Ic connector

Publications (2)

Publication Number Publication Date
JPH02155181A true JPH02155181A (en) 1990-06-14
JPH0352195B2 JPH0352195B2 (en) 1991-08-09

Family

ID=17319453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25838189A Granted JPH02155181A (en) 1989-10-02 1989-10-02 Ic connector

Country Status (1)

Country Link
JP (1) JPH02155181A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081397A (en) * 1997-04-08 2000-06-27 International Business Machines Corporation Method and apparatus for SID-to-SID period estimation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341979A (en) * 1976-09-27 1978-04-15 Amp Inc Electric connector
JPS55136481A (en) * 1979-04-09 1980-10-24 Fujitsu Ltd Socket for integrated circuit package and method of mounting same
JPS55139776A (en) * 1979-04-17 1980-10-31 Kyushu Nippon Electric Socket for semiconductor device
JPS56128584A (en) * 1980-03-12 1981-10-08 Kyushu Nippon Electric Socket for semiconductor device
JPS60211787A (en) * 1984-02-27 1985-10-24 アンプ インコーポレーテツド Contact for chip holder and method of inserting it into housing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341979A (en) * 1976-09-27 1978-04-15 Amp Inc Electric connector
JPS55136481A (en) * 1979-04-09 1980-10-24 Fujitsu Ltd Socket for integrated circuit package and method of mounting same
JPS55139776A (en) * 1979-04-17 1980-10-31 Kyushu Nippon Electric Socket for semiconductor device
JPS56128584A (en) * 1980-03-12 1981-10-08 Kyushu Nippon Electric Socket for semiconductor device
JPS60211787A (en) * 1984-02-27 1985-10-24 アンプ インコーポレーテツド Contact for chip holder and method of inserting it into housing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081397A (en) * 1997-04-08 2000-06-27 International Business Machines Corporation Method and apparatus for SID-to-SID period estimation

Also Published As

Publication number Publication date
JPH0352195B2 (en) 1991-08-09

Similar Documents

Publication Publication Date Title
US5073116A (en) Surface mount LCC socket
KR100216378B1 (en) Retention device for flat pack sockets
CA1310380C (en) Surface mount electrical connector and an electrical terminal therefor
US7364434B2 (en) Electrical connector with improved terminal
JP2551485B2 (en) Chip carrier socket
US7390195B2 (en) Electrical connector with contact terminal
KR20040024458A (en) Lga socket contact
US20060040518A1 (en) Electrical connector having protecting protrusions
US6576853B2 (en) Switch exhibition non-unidirectional displacement
JPH10507033A (en) Contact retention mechanism for electrical connectors
JPH0631088U (en) Edge connector and contactor used for it
JPH0218547Y2 (en)
US6019617A (en) Pick-up device for an electrical connector and electrical connector having the same
US4679871A (en) IC package connector
JPH0225257B2 (en)
JP2006339141A (en) Low insertion force connector and terminal
JP2681263B2 (en) IC connector for IC package
KR101391476B1 (en) Connector position assurance
KR900008278B1 (en) Electrical receptacle
JPH02155181A (en) Ic connector
JP5659212B2 (en) Circuit board electrical connector
JP2945087B2 (en) Electrical connector
US20050095906A1 (en) Socket connector with reliable retaining means
CN110364893A (en) Electrical connector with terminal pressing construction
JPH0142313Y2 (en)