JPS62178340A - Surface-hardened film - Google Patents
Surface-hardened filmInfo
- Publication number
- JPS62178340A JPS62178340A JP61020276A JP2027686A JPS62178340A JP S62178340 A JPS62178340 A JP S62178340A JP 61020276 A JP61020276 A JP 61020276A JP 2027686 A JP2027686 A JP 2027686A JP S62178340 A JPS62178340 A JP S62178340A
- Authority
- JP
- Japan
- Prior art keywords
- film
- coating
- compound
- present
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 claims description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 15
- -1 cationic ions Chemical class 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000002585 base Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000002500 ions Chemical group 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 150000003377 silicon compounds Chemical class 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical class ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 230000002522 swelling effect Effects 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N thiocyanic acid Chemical class SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical class CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- ASZFCDOTGITCJI-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hex-2-ene Chemical compound C1C=CC2OC12 ASZFCDOTGITCJI-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 241000951471 Citrus junos Species 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- REEVUBVBEQNVEP-UHFFFAOYSA-N acetic acid;methyl acetate Chemical compound CC(O)=O.COC(C)=O REEVUBVBEQNVEP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000003254 anti-foaming effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 101150036577 fl11 gene Proteins 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical class O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000003601 intercostal effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical class CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- DJFBJKSMACBYBD-UHFFFAOYSA-N phosphane;hydrate Chemical group O.P DJFBJKSMACBYBD-UHFFFAOYSA-N 0.000 description 1
- 229910052615 phyllosilicate Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- MDDPTCUZZASZIQ-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]alumane Chemical compound [Al+3].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-] MDDPTCUZZASZIQ-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明ね、耐スクラッチ性、鵬摩耗恒、帯電防止性、摩
擦件数に優れたシートキーボード、リーダーテープ、デ
ィスプレイ、オーバーレイ材料として好適な表面硬度化
フィルムに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides surface hardness suitable for sheet keyboards, leader tapes, displays, and overlay materials with excellent scratch resistance, wear resistance, antistatic properties, and friction resistance. This relates to film.
従来表面硬度化フィルムとして、アクリル系樹脂コーテ
ィングフィルムあるいはシラン系カップリング剤コーテ
ィングフィルムなどが知られていた。Conventionally, acrylic resin coating films, silane coupling agent coating films, and the like have been known as surface hardening films.
しかし、このよう々硬度化フィルムはコーティング層の
耐摩耗性1表面硬度には優れているもののアンダーコー
ト層を設けても基材との接着が十分でなく、又帯電防止
性に欠けるなどの欠点があった。However, although these hardened films have excellent abrasion resistance and surface hardness of the coating layer, they have drawbacks such as insufficient adhesion to the substrate even with an undercoat layer, and lack of antistatic properties. was there.
本発明の目的は、上記欠点のないものすなわち基材とよ
く接着した′@涌防止性表面硬度化層を保護層、とじて
有するフィルムを提供することにちる。It is an object of the present invention to provide a film which does not have the above-mentioned drawbacks, that is, a film having a protective layer and a hardened surface layer with anti-foaming properties that adheres well to the substrate.
本発明の表助仙・度フィルムは保護層として分子内にエ
ポキシ基およびシラノールを含む化合’t&(a)、シ
ラノールおよび/甘たはシロキサン基を含む化合Q−(
bl、エポキシ化合物(c)より少くとも2fIl−選
ばれた混合物からなる硬化+!1′成分囚とkr性無様
層状ケイ酸塩(Blとの沖量混合比(B/A )1/1
000〜2/1の静合*+の硬化体を用いるものである
り
本発明における基体プラスチックフィルムとしては、単
体あるいlllVt合体、あるいは延伸、未延伸を問わ
す連室のプラスチックフィルムを用いうるが、代表的な
ものとして、ポリオレフィンフィルム、ポリスチレンフ
ィルム、ポリエステルフィルム、ポリカーボネートフィ
ルム、トリアセチルセルロースフィルム、セロハンフィ
ルム、ポリアミドフィルム、ポリイミドフィルム、ポリ
フェニレンスルフィドフィルム、ポリエーテルイミドフ
ィルム、ポリエーテルスルホンフイルム、ポリスルホン
フイルム、ポリアクリロニトリルフィルム、ポリ酢酸ビ
ニルフィルム、ポリエーテルエーテルケトンフィルムな
どの公知のプラスチックフィルムを挙げることができる
。その中でも熱寸法変化が小さく、剛性が高いという点
から、ポリエステル単体あるいはり合体フィルム(%に
延伸したフィルム)が特に好適である。The protective layer of the Omotesukesen/Date film of the present invention includes a compound 't&(a) containing an epoxy group and a silanol in the molecule, and a compound Q-(
bl, epoxy compound (c) at least 2fIl-curing consisting of a selected mixture +! Mixing ratio (B/A) of 1' component and KR amorphous layered silicate (Bl) 1/1
The base plastic film in the present invention may be a single film, a IllVt combination, or a continuous plastic film, whether stretched or unstretched. However, typical examples include polyolefin film, polystyrene film, polyester film, polycarbonate film, triacetyl cellulose film, cellophane film, polyamide film, polyimide film, polyphenylene sulfide film, polyetherimide film, polyether sulfone film, and polysulfone film. , polyacrylonitrile film, polyvinyl acetate film, polyether ether ketone film, and other known plastic films. Among these, single polyester or polyester composite films (films stretched to 100%) are particularly suitable because of their small thermal dimensional change and high rigidity.
プラスチックフィルムの厚みは特に限定されないが通常
は0.5μm以上500μm以下であシ、コーテイング
性の面から2μm以上250μm以下のものが特に好ま
しい。The thickness of the plastic film is not particularly limited, but it is usually 0.5 μm or more and 500 μm or less, and particularly preferably 2 μm or more and 250 μm or less from the viewpoint of coating properties.
複合フィルムを使用する場合、その層数あるいは方法は
特に限定されないが、通常は複合押出法あるいは、基材
フィルム上への押出ラミネート法、あるいは柚々の接着
剤を用いたラミネート法などにより、延伸が必要な場合
は延伸前徒を問わず、複合される。When using a composite film, the number of layers or the method is not particularly limited, but it is usually stretched by a composite extrusion method, an extrusion lamination method on a base film, or a lamination method using Yuzu adhesive. If necessary, it will be combined regardless of whether it is stretched or not.
本発明では保I11層の一成分として、膨潤性無機層状
ケイ酸塩を用いることを本質とする。ここで膨潤性とは
眉間に水を配位していわゆる「膨潤」する性個を有する
無機層状ケイ酸塩をいい、本発明のコーティングフィル
ムのコーティング層中ではこの膨潤性を利用して少くと
も部分的に層間分離して形成された微細粒子の形でこれ
が存在することを本質とする。The essence of the present invention is to use a swellable inorganic layered silicate as a component of the retention I11 layer. Here, the term "swellable" refers to an inorganic layered silicate that has the property of "swelling" by coordinating water between the eyebrows, and in the coating layer of the coating film of the present invention, this swelling property is utilized to at least Its essence is that it exists in the form of fine particles formed by partial interlayer separation.
本発明で用いられる膨潤性無機層状ケイ酸塩は構造的に
は5i04 四面体のSt対0の比が理論上2:5の
フィロケイ酸塩で結晶単位格子が犀み方向にl!#シ返
された結晶構造を有するものであシ、その代表例を化学
式で示すと次のように表わすことができる。Structurally, the swellable inorganic layered silicate used in the present invention is a phyllosilicate in which the ratio of St to 0 of the 5i04 tetrahedron is theoretically 2:5, and the crystal unit cell is oriented in the crystalline direction. It has a reversed crystal structure, and a typical example thereof can be expressed as a chemical formula as follows.
W113〜L、S Xts〜3.2 (S i 3.5
〜4.110 + o ) Z hトz、zここで
W:N間イオンでsb、1種以上のカチオン性イオンっ
X:八面体位置のイオンであシ、Mg2+又はMg2+
の1部をLi”、Fe”、Ni”、Mn”、AI”+及
びF3+からなる群から選ばれる少なくとも1種のイオ
ンで置換したイオン、
O:酸素
z:F″″又はOH−の中から選ばれ六−科又は二種の
イオン□
同、本発明では上記の四面体位置のSi’+がGe4+
又はこれらの一部がA13+、Fe3+、B3+ 等で
置きかわったものでもよく、本発明にいう膨潤性無機層
状ケイ酸塩はこれらも包含する。W113~L, S Xts~3.2 (S i 3.5
~4.110 + o) Z h to z, z where W: sb is an ion between N, one or more cationic ions X: ion at an octahedral position, Mg2+ or Mg2+
An ion in which a part of is replaced with at least one ion selected from the group consisting of Li", Fe", Ni", Mn", AI"+ and F3+, O: oxygen z: F"" or OH- □ Similarly, in the present invention, Si'+ at the above-mentioned tetrahedral position is Ge4+
Alternatively, some of these may be replaced with A13+, Fe3+, B3+, etc., and the swellable inorganic layered silicate referred to in the present invention also includes these.
これらの具体例としては、モンモリロナイト、バーミキ
ュライト等の天然物や前記一般式を有する溶融あるいは
水熱で合成されるテトラシリシックマイカ、テニオライ
ト、ヘクトライト等の合成物の如き粘土糸、雲母系鉱物
がある。Specific examples of these include clay threads and mica-based minerals such as natural products such as montmorillonite and vermiculite, and synthetic products such as tetrasilisic mica, taeniolite, and hectorite, which are synthesized by melting or hydrothermally and having the above general formula. be.
これらのうちでも不純物が少ないこと、組成が均一でら
るため均一な結晶となることから、特に合成物が好まし
く、またその中でも結晶の平角1件にすぐれると共に、
結晶サイズが大きいという点から、
WX−11−X+111Mg 2.8−X−3,2−z
L ’ z (813,5〜4.00 s o )
F 1.s〜2.。Among these, synthetic materials are particularly preferred because they contain fewer impurities and have a uniform composition, resulting in uniform crystals.
From the point of view of large crystal size, WX-11-X+111Mg 2.8-X-3,2-z
L'z (813,5~4.00 s o )
F1. s~2. .
又は
WX−(Ll−X+(LI Mg2.8−x−3,2−
xL i X (S i 3.5〜4.00 io )
(OR) 1.s〜(ただしx−0,8〜1.2)な
るものが好ましい、、また層間イオンWとしては、1f
tk以上のカチオン性イオンであればよぐ特に限定され
ないが、全肋間イオンの40%以上、好ましくは60%
以上、更に好ましくは85%以上がLi”、水素又は炭
素数1〜50のアルキル基)である場合好適である。特
にR,−NH,” (ただしR1は炭素数6以下のア
ルキル基)あるい位Li”、特にRt NHsとLi
+の併存糸がその合格性が良好であるため好ましい。or WX-(Ll-X+(LI Mg2.8-x-3,2-
xL i X (S i 3.5-4.00 io)
(OR) 1. s ~ (however, x-0,8~1.2) is preferable, and as the interlayer ion W, 1f
It is not particularly limited as long as it is a cationic ion with a tk or higher, but it is 40% or more, preferably 60% of all intercostal ions.
Above, more preferably 85% or more is Li", hydrogen or an alkyl group having 1 to 50 carbon atoms). In particular, R, -NH," (wherein R1 is an alkyl group having 6 or less carbon atoms) is suitable. Li", especially Rt NHs and Li
Coexisting yarns with + are preferable because they have good passability.
本発明において使用される膨潤性無機層状ケイl!i!
i!地のサイズは特に限定さねないが、沈降法によね測
定された平均粒径が0.05μm〜15μm好ましくけ
01μm〜8μm。Swellable inorganic layered silicon used in the present invention! i!
i! The grain size is not particularly limited, but the average particle diameter measured by a sedimentation method is 0.05 μm to 15 μm, preferably 01 μm to 8 μm.
更に好ましくは0.15μm〜3μmの節回にある場合
、均一な層を得ることができるkめ好ましい。また全粒
子の4o50%、好ましくは80チ、丈に好ましくは9
0%の豚み’11800A以下、好ましくは400A以
下、更に好ましくは100八以下でおる場合、コーティ
ング層表面が平滑となるため好ましい。このような庫み
の麺いものを有る方法については、%IjA昭58−9
7557号明細1.に記恥されている。More preferably, the thickness is between 0.15 μm and 3 μm, since a uniform layer can be obtained. Also, 4o50% of the total particles, preferably 80cm, preferably 9cm in length
It is preferable that the surface of the coating layer is 11800A or less, preferably 400A or less, and more preferably 1008 or less, since the surface of the coating layer becomes smooth. For information on how to make such stored noodles, see %IjA 1986-9
No. 7557 specification 1. has been shamed.
本発明では保設層の他方の成分としてエポキシ基とケイ
素原子を含有する硬化糸(以下ケイ素化合物・と・略B
ピする場合がある)が用いられる。In the present invention, the other component of the retention layer is a cured thread containing an epoxy group and a silicon atom (hereinafter referred to as silicon compound).
) is used.
ケイ素化合物のうち、分子内にエポキシ基およびシラノ
ールおよび/まfCはシロキサン遍を含む41合物 と
は、一般式
%式%(
またはアリール、nは2または3、aはθ〜2、bは1
〜6)で表わされる化合物である□
具体的々代表例としては、γ−クリシトキシプロビルト
リアルコキシシラン、γ−クリシトキシプロピルアルキ
ルジアルコキシシラン、β(3,4−エポキシシクロヘ
キシル)エチルトリアルコキシシランの加水分鋼物をあ
げることができる。Among silicon compounds, 41 compounds containing epoxy groups and silanol and/or siloxane in the molecule are defined by the general formula % (or aryl, n is 2 or 3, a is θ ~ 2, b is 1
~6) □ Specific representative examples include γ-crisitoxypropylalkyldialkoxysilane, γ-crisitoxypropylalkyldialkoxysilane, β(3,4-epoxycyclohexyl)ethyltrialkoxy Examples include silane-hydrolyzed steel products.
シラノールおよび/またはシロキサン基を含む化合物と
は、4アルコキシケイ素の加水分解物および(但X”
ttct〜6 のアルキル、ハロゲン、ビニル、アリー
ル、メタクリロキシ、メルカプト、アミノ、HxN−(
CHz)b−Nu−基、R1はC1〜6のアルキルまた
はアリール、nね2または3.bは1〜6)で表わされ
る化合物である。Compounds containing silanol and/or siloxane groups refer to hydrolysates of 4-alkoxy silicon and
ttct~6 alkyl, halogen, vinyl, aryl, methacryloxy, mercapto, amino, HxN-(
CHz) b-Nu- group, R1 is C1-6 alkyl or aryl, nne2 or 3. b is a compound represented by 1 to 6).
具体的な例はメチルシリケート、エチルシリケート、イ
ソプロピルシリケート、n−プロピルシリケート、n−
ブチルシリケート、8ee−ブチルシリケート、ter
t−ブチルシリケート、メチルトリアルコキシシラン、
ビニルトリアルコキシシラン、ビニルトリアセトキシシ
ラン、ビニルトリアルコキシアルコキシシラン、フェニ
ルトリアルコキシシラン、メタクリロキシプロピルトリ
アルコキシシラン、クロロプロピルトリアルコキシシラ
ン、アルキルトリアシo−t−ジシラン、γ−アミノプ
ロピルトリアルコキシシラン、N−β(アミノニブル)
γ−アミノプロピルトリアルコキシシラン、γ−メルカ
プトプロピルトリアルコキシシラン、ジアルキルジアル
コキシシラン、アルキルフェニルジアルコキシシラン、
ジフェニルジアルコキシシラン、N−β(アミンエチル
)γ−アミノプロピルメチルジアルコキシシラン、アル
キルトリクロロシランの加水分解物などをあげることが
できる。Specific examples include methyl silicate, ethyl silicate, isopropyl silicate, n-propyl silicate, n-
butyl silicate, 8ee-butyl silicate, ter
t-butyl silicate, methyltrialkoxysilane,
Vinyltrialkoxysilane, vinyltriacetoxysilane, vinyltrialkoxyalkoxysilane, phenyltrialkoxysilane, methacryloxypropyltrialkoxysilane, chloropropyltrialkoxysilane, alkyltriacyo-t-disilane, γ-aminopropyltrialkoxysilane , N-β (amino nibble)
γ-aminopropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, dialkyldialkoxysilane, alkylphenyldialkoxysilane,
Examples include hydrolyzates of diphenyldialkoxysilane, N-β(amineethyl)γ-aminopropylmethyldialkoxysilane, and alkyltrichlorosilane.
これらケイ素化合物の加水分触は水″’Ifcは塩酸あ
るいは硫酸などのe外水#i液を添加指押することによ
って製造される。辿猟は上記ケイ素化合物中に酸性水を
一度に、あるいは徐々に添加することによって行なわれ
る。加水分解に際してはアルコール、アルコキシアルコ
ール、酢酸などの有様カルボン酸などが生成してくるの
で無溶幌で加水分触することがE]’*Iでちる。、あ
るいは鏑当な溶〃(古にケイ素化合物を混合したのち加
水分解することもできる。通常は得られた加水分解物・
溶液をそのまま使用するが、目的によっては無済媒で加
水分触を行なったのち、生成するアルコール等を加熱お
よび/またはし圧下に適当セY除去して使用することも
可能であるし、その後に適当な溶媒を添加することによ
り実効的に溶媒を置換することも可能である。溶媒とし
てはアルコール、エステル、エーテル、ケトン、ハロケ
ンイヒ炭化水素あるいはトルエンなどの芳香族系などの
溶媒が目的に応じて釉々使用司fit′、であり、必要
に応じて混合溶媒を使用することもできる。Hydrolysis of these silicon compounds is produced by adding and pressing a water solution such as hydrochloric acid or sulfuric acid with your fingers. It is carried out by adding gradually.During hydrolysis, alcohol, alkoxy alcohol, and various carboxylic acids such as acetic acid are produced, so hydrolysis can be carried out without dissolution. Alternatively, it is also possible to mix a silicon compound and then hydrolyze it.Usually, the resulting hydrolyzate
The solution is used as it is, but depending on the purpose, it is also possible to perform hydrocatalysis with a non-reactive medium and remove the resulting alcohol etc. by heating and/or under pressure. It is also possible to effectively replace the solvent by adding a suitable solvent to it. As the solvent, alcohols, esters, ethers, ketones, hydrocarbons, or aromatic solvents such as toluene can be used depending on the purpose, and mixed solvents can also be used if necessary. can.
2秒以上の場合はそれぞれ加水分別して混合してもよい
し、2種以上を混合しfcあと加水分触してもよい。In the case of 2 seconds or more, the hydrolysis may be carried out separately and mixed, or two or more kinds may be mixed and hydrolyzed after fc.
エポキシ化合物 としては、塗料、注型用など
に広く実用されているもので、例えば過酸化法で合成さ
れるポリオレフィン系エポキシ樹脂、シクロペンタジェ
ンオキシドあるいはへキサヒドロフタル酸とエピクロル
ヒドリンから得られるポリグリシジルエステル、ビスフ
ェノールAやカテコール、レゾルシノールなどの多価フ
ェノールあるいは(ポリ)エチレンクリコール、(ポリ
)プロピレングリコール、ネオペンチルグリコール、グ
リセリン、トリメチロールプロパン、ペンタエリスリト
ール、シグリセロール、ソルビトールなどの多価アルコ
ールとエピクロルヒドリンから得られるポリグリシジル
エステル、環式エポキシ樹脂、エポキシ化植物油、ノボ
ラック型フェノール樹脂とエピクロルヒドリンから得ら
れるエポキシノボラック樹月旨、フェノールフタレイン
とエピクロルヒドリンから得られるエポキシ樹脂、さら
にりクリシジルメタクリレートトメチルメタクリレート
などのアクリレート系モノマーあるいはスチレンなどと
の共重合体などがあげられる。これらケイ素化合物は通
常硬化剤および/または硬化触媒を混入して用いられる
。硬化剤(硬化側@)としては例えば有様カルボン酸、
亜硝酸、亜硝酸、アルミン酸、炭酸およびチオシアン酸
の各アルカリ金庚ユ、オクチル酸およびナフテン酸の各
金属塩、有機アミノ堵、有様スズ化合物、7ツ化ホウ素
フンブレツクス、ホウフッ化亜鉛、ホウフッ化スズ。Epoxy compounds are widely used for paints, casting, etc., such as polyolefin epoxy resins synthesized by peroxidation method, polyglycidyl obtained from cyclopentadiene oxide or hexahydrophthalic acid and epichlorohydrin. Esters, polyhydric phenols such as bisphenol A, catechol, and resorcinol, or polyhydric alcohols such as (poly)ethylene glycol, (poly)propylene glycol, neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol, siglycerol, and sorbitol. Polyglycidyl esters obtained from epichlorohydrin, cyclic epoxy resins, epoxidized vegetable oils, novolac type phenolic resins and epoxy novolacs obtained from epichlorohydrin, epoxy resins obtained from phenolphthalein and epichlorohydrin, and tomethyl chrycidyl methacrylate. Examples include acrylate monomers such as methacrylate or copolymers with styrene and the like. These silicon compounds are usually mixed with a curing agent and/or a curing catalyst. As the curing agent (curing side @), for example, specific carboxylic acid,
Alkali metal salts of nitrous acid, nitrous acid, aluminic acid, carbonic acid and thiocyanic acid, metal salts of octylic acid and naphthenic acid, organic amino acids, tin compounds, boron heptadide, zinc borofluoride, borofluoride Chemical tin.
水酸化テトラメチルアンモニウム、水酸化テトラn−ブ
チルホスホニウム、第4アンモニウムヒドロキシド、第
4ホスホニウムヒドロキシド、アルミニウムキレート化
合物、各種エポキシ硬化剤などがあげられる0これらの
2秒以上を混合して使用することも可能である。Examples include tetramethylammonium hydroxide, tetran-butylphosphonium hydroxide, quaternary ammonium hydroxide, quaternary phosphonium hydroxide, aluminum chelate compounds, various epoxy curing agents, etc. Mix these for 2 seconds or more and use. It is also possible.
特に下記構造のアルミニウム化合物がオ・考案の目的の
達成に著しく効果的である。該化合物に−嵌式At−Y
m−2c3−m)
〔但し、Yは0L(LけC1−6(’)7 ルキ、a−
)、2は一般式%式%1
M3、M4けいずれもC1〜6のアルキル)で示される
化合物に由来する配位子から選ばれる少なくとも1つで
あり、mは0〜3の3P8である〕で示される化合物で
ある。この化合物の具体例としては各種の化合物をあげ
得るが、組成、物への溶解性、安定性、硬化触媒として
の効!J!、力どの観1点から好ましいのは、アルミニ
ウム1so−プロポキシド、アルミニウムエトキシド、
アルミニウムtert−ブトキシド、アルミニウムアセ
チルアセトネート、アルミ、ニウムビス−エチルアセト
アセテート−モノ−アセチルアセトネート、アルミニウ
ムージ−n−ブトキシド−モノエチルアセトアセテート
、アルミニウムージー1so−7’ロポキシドーモノー
メチルアセトアセテート、アルミニウムージーglee
−ブトキシド−モノ−エチルアセトアセテート、アルミ
ニウムージーメトキシドーモノーメテルアセトアセテー
トカどである。こハらは2に4!復上を混合して使用す
ることも回部であるり
硬化剤の添加量は上記ケイ素化合物1型邪部あたり0.
0001〜0.5i[置部、吸、に好ましくは0.00
05〜0.23ft部が適当であり、これより少なくて
H[1−化不十分となるし、一方これ以上では塗膜ある
い扛樹脂の透明性の低下、耐水性の低下などの欠陥を生
ずる。In particular, an aluminum compound having the following structure is extremely effective in achieving the object of the invention. The compound is fitted with At-Y
m-2c3-m) [However, Y is 0L (L ke C1-6(')7 ruki, a-
), 2 is at least one ligand derived from a compound represented by the general formula %1 (both M3 and M4 are C1-6 alkyl), and m is 3P8 of 0-3. ] This is a compound represented by Specific examples of this compound include various compounds, including composition, solubility in materials, stability, and effectiveness as a curing catalyst! J! Preferred from the viewpoint of strength are aluminum 1so-propoxide, aluminum ethoxide,
Aluminum tert-butoxide, aluminum acetylacetonate, aluminum, bis-ethylacetoacetate-mono-acetylacetonate, aluminum-di-n-butoxide-monoethylacetoacetate, aluminum-di-1so-7'lopoxide monomethylacetate acetate, aluminum glee
-butoxide-mono-ethyl acetoacetate, aluminum-dimethoxide mono-methyl acetoacetate, etc. Kohara and others are 2 to 4! It is also possible to mix and use the curing agent, and the amount of the curing agent added is 0.00% per silicon compound type 1.
0001 to 0.5i [Preferably 0.00 to
0.05 to 0.23 ft part is appropriate; less than this will result in insufficient H[1- conversion, while more than this will cause defects such as a decrease in transparency of the coating or coating resin, and a decrease in water resistance. arise.
本発明においては、ケイ累砂化成分(A)と膨潤せ無機
層状ケイ酸塩(B)の重量混合比(B/A )を1/1
000〜2/1とすることが必要でおる。これは1/1
000より小さい時は、アンダコートなしでは十分な接
着力を示さず、また帝を防止効架も殆んどないためであ
る。一方2/1より多い場合、基材とはよく接着するが
コート層内部での骨間が起こシ易くカリ、耐久性が悪化
するため好ましく力いのである。In the present invention, the weight mixing ratio (B/A) of the silica sand forming component (A) and the swollen inorganic layered silicate (B) is set to 1/1.
It is necessary to set it to 000-2/1. This is 1/1
This is because when it is smaller than 000, sufficient adhesive strength is not exhibited without an undercoat, and there is also little effect on preventing damage. On the other hand, when the amount is more than 2/1, it is preferably strong because although it adheres well to the base material, inter-boning is likely to occur inside the coating layer, resulting in poor durability.
保護層形成に肖ってはその特性を損なわない範囲で適宜
他の成分を併用しうる。この場合、本発明必須成分は通
常、60ifjA−チ以上、好ましくは80重量%以上
、更に好ましくFi90重tチ以上存在させる。たとえ
ば塗布時におけるフローおよび塗膜の平滑性を向上させ
るために界面活性剤を使用することも′5]能である。When forming the protective layer, other components may be used in combination as appropriate within a range that does not impair its properties. In this case, the essential components of the present invention are usually present in an amount of 60% by weight or more, preferably 80% by weight or more, and more preferably 90% by weight or more. For example, it is also possible to use a surfactant to improve the flow during coating and the smoothness of the coating film.
さらに必要に応じて硬化触媒、添加剤(例えば、シリコ
ーンオイルのような離型性改良剤、接着促進剤、pHh
整剤、可塑剤、安定剤、酸化防止剤、紫外紐吸収剤、地
粘剤、消泡剤、着色剤など)を併用しうる。Furthermore, if necessary, curing catalysts, additives (e.g., mold release improvers such as silicone oil, adhesion promoters, pH
Conditioners, plasticizers, stabilizers, antioxidants, ultraviolet string absorbers, adhesives, antifoaming agents, colorants, etc.) may be used in combination.
本発明における表面硬度化層は該プラスチックフィルム
の片面あるいは両面に、全面あるいはストライブ状、あ
るいは部分的にコートされているものとする。The surface hardening layer in the present invention is coated on one or both sides of the plastic film, either entirely, in stripes, or partially.
また表面硬度化層の厚みは特に限定され力いが通常は0
.01〜20 pm、好ましくは0.1〜8μm、更に
好ましくは1〜4μmの範囲である。In addition, the thickness of the surface hardening layer is particularly limited, but is usually 0.
.. The range is 0.01 to 20 pm, preferably 0.1 to 8 μm, and more preferably 1 to 4 μm.
本発明における表面硬度化フィルムは、表面が硬度化し
ていればよく、特に硬度には限定はないが、エンピッ硬
度(JIS K 5400)による表面硬度が2H
以上、より好ましくは3L以上あれば表面に傷がつきK
くいため好ましい0
本発明に述べた表面硬度化フィルムの用途は特に限定さ
れないが、代表的用途としてはシートキーボード、ディ
スプレイ、CRT用フィルター、リーダーテープ、パネ
ル化粧板、a図フィルム等の表面保護材、広告表示板等
を挙げることができる。The surface hardened film in the present invention only needs to have a hardened surface, and there is no particular limitation on the hardness, but the surface hardness according to Empi hardness (JIS K 5400) is 2H.
Above, more preferably 3L or above, the surface will be scratched.
0 The use of the surface hardened film described in the present invention is not particularly limited, but typical uses include surface protection materials for sheet keyboards, displays, CRT filters, leader tapes, panel decorative boards, A-diagram films, etc. , advertising display boards, etc.
次に本発明の代表的な製造方法について説明するが、当
然これに限定されるものではない。Next, a typical manufacturing method of the present invention will be described, but it is not limited thereto.
膨g1性無機層状ケイ酸[(B)を水又は水溶性有機溶
剤中に分散させて非凝集状態の貴紙粒子分散系をつくり
これにケイ素硬化成分(A)を所定1量比で泪合し、こ
れを基体プラスチックフィルムの表面に塗布する。Swollen g1 type inorganic layered silicic acid [(B) is dispersed in water or a water-soluble organic solvent to create a non-agglomerated state particle dispersion system, and silicon curing component (A) is combined with this in a predetermined ratio of 1. This is then applied to the surface of the base plastic film.
コーテイング液中にて膨潤性無機層状ケイ酸塩はその膨
潤性を利用して微細粒子化し##さ、沈降することなく
分散している。コーテイング液を形成する砂体は水又は
アルコール等の水溶性有機溶剤であり、これらは単独又
は混合して用いうる。In the coating liquid, the swellable inorganic layered silicate utilizes its swelling property to form fine particles and is dispersed without settling. The sand body forming the coating liquid is water or a water-soluble organic solvent such as alcohol, and these may be used alone or in combination.
基材フィルムに、必要に応じ、空気中その他種々の雰囲
気中でコロナ放電処理を施しておいてもよい。またウレ
タン樹脂、エポキシ樹脂など公知のアンカー処理剤を用
いてアンカー処理を施しておいてもよい。かかる基材フ
ィルムの−又は両kTh上に上記コーテイング液を、グ
ラビアコート、リバースコート、スプレーコート等公知
の方法を用いて塗布する。コーテイング後は通常60〜
250℃で1秒〜15分程度乾燥させる。同コーティン
グ層を別途製膜しておき、あとからラミネートしても良
いが、層状ケイ酸塩を主体とする層は、やや弘・度が不
足である点から、直摺基材フィルム上にコーティングす
る方が好ましいり〔作用〕
本発明の表面硬度化フィルムでは帯1し防止性をもつ膨
潤1性無機層状ケイ酸塩を使用したので、凝集なく均一
に混合することが可能となり、その結果コーティング層
と基材との間に働く残留歪を大きく減少させることが可
能となり基材との接着力が向上したのである。If necessary, the base film may be subjected to corona discharge treatment in air or other various atmospheres. Further, anchor treatment may be performed using a known anchor treatment agent such as urethane resin or epoxy resin. The above-mentioned coating liquid is applied onto one or both kTh of the base film using a known method such as gravure coating, reverse coating, or spray coating. After coating, it is usually 60~
Dry at 250°C for about 1 second to 15 minutes. The same coating layer can be formed separately and laminated later, but since the layer mainly made of layered silicate is somewhat lacking in breadth and strength, it can be coated on the direct printing base film. [Function] Since the surface-hardened film of the present invention uses a swollen monomorphic inorganic layered silicate with banding prevention properties, it is possible to mix uniformly without agglomeration, and as a result, the coating This makes it possible to greatly reduce the residual strain that acts between the layer and the base material, and improves the adhesive strength with the base material.
〔発明の効果〕 (1) 基材との接着力が大きく向上した。〔Effect of the invention〕 (1) The adhesive strength with the base material was greatly improved.
(2) 帯電防止性が発現した。(2) Antistatic properties were exhibited.
(3) 易滑性を示す。(3) Shows slipperiness.
なお、本発明における特性の測定方法および評価基準は
次の通シである。In addition, the measuring method and evaluation criteria of the characteristics in the present invention are as follows.
(1)表面比抵抗:20℃、65チRHの雰囲気下で8
時間数かした後、超絶縁計を用いて測定した。(1) Surface resistivity: 8 at 20℃, 65cmRH atmosphere
After several hours, measurements were taken using a super megohmmeter.
(2)耐スクラッチ性ニスチールウールテストを行つf
C□スp−ルウールは+0000を用い、500gで5
0回こすった後、傷が著しいものを「×」、やや傷がつ
くものを「△」、傷がつかないものを「○」とした。(2) Perform scratch resistance steel wool test
C□sp-le wool uses +0000, 500g is 5
After rubbing 0 times, those with significant scratches were rated "x", those with slight scratches were rated "△", and those with no scratches were rated "○".
(3)細組硬度:JIS−に5400に基づいて測定し
た。(3) Fine hardness: Measured based on JIS-5400.
(Aン 静摩擦係数ps:ASTM−D−1894B−
63に従い、スリップテスターを用いて測定した。(A Static friction coefficient ps: ASTM-D-1894B-
63, using a slip tester.
(5)?−714カニ■〕販のセロファン粘着テープに
チバン株式会社製)により90°剥離し、剥離後セロハ
ンテープに打箔した曹榛コーティング胤++J着面枝が
40チ未満の場合を、基材との接着力「○」と、また4
0%以上の場合をrXJとした。(5)? -714 Crab■] Peeled at 90 degrees using commercially available cellophane adhesive tape (manufactured by Chiban Co., Ltd.), and after peeling, cast foil on the cellophane tape. Adhesive strength "○" and 4 again
The case of 0% or more was defined as rXJ.
次に実於;例に基づいて本発明の実が・!!1様を説明
する。Next, let's see the fruits of this invention based on examples! ! Let me explain the first person.
実施例1〜4、比較例1.2
暦さ100μmのポリエチレンテレフタレート211・
延伸フィルムの上に膣さ0.1μmの酸成分としてテレ
フタル酸(85%ル%)と5−スルホンジウムイソフク
リックアシツド(15モル%)、グリコール取分として
エチレングリコールを使用した共重合ポリエステルをコ
ーティングしたフィルムを基材として用意する。この共
1合ポリエステル上に以下の組成の保護層を、S w
を襲ゾルの状態で乾燥後の浮みにして2μmコートする
。ただし7jE’l!JtJ 165℃熱風中で2分間
行った。Examples 1 to 4, Comparative Example 1.2 Polyethylene terephthalate 211 with a diameter of 100 μm.
A copolymerized polyester using terephthalic acid (85%) and 5-sulfondium isophthalic acid (15% by mole) as the acid components and ethylene glycol as the glycol component was placed on the stretched film with a diameter of 0.1 μm. A coated film is prepared as a base material. A protective layer having the following composition was formed on this co-polyester by S w
After drying in a sol state, coat it with a thickness of 2 μm. However, 7jE'l! JtJ It was carried out for 2 minutes in hot air at 165°C.
層状ケイfit地(A) : WMg2 Li (S
i40to ) F2ただしW: CH3CH2−CH
2NH3” (プロピルアミン−TNと略記する)
ケイ集硬化層(B):
(3) CH3(CH2)3 St (OH)3し
た。Layered silicone fit fabric (A): WMg2 Li (S
i40to) F2 However, W: CH3CH2-CH
2NH3'' (abbreviated as propylamine-TN) Silicon hardened layer (B): (3) CH3(CH2)3St(OH)3.
表にみる如く本発明範囲に比べ層状ケイ酸塩の少ない場
合(比較例1)は、抄部硬度はよいが接着力が十分では
なく不適当である。一方層状ケイ酸塩が本発明より多す
ぎる場合(比較例2)は、表向硬度がやや低下すると共
に接着力が不十分となシ好ましくない。本発明範囲にあ
る場合(実施例1〜4)のみ良好な品質を得ることがで
きるのである。特に1/400〜1/80の範囲にある
場合(実施例2.3)接着力および硬度のバランスがよ
り好適であるため好ましい。As shown in the table, when the amount of layered silicate is less than the range of the present invention (Comparative Example 1), the hardness of the paper part is good, but the adhesive strength is insufficient and is inappropriate. On the other hand, if the amount of layered silicate is larger than that of the present invention (Comparative Example 2), the surface hardness will be slightly lowered and the adhesive strength will be insufficient, which is not preferable. Good quality can be obtained only when it falls within the range of the present invention (Examples 1 to 4). In particular, the range of 1/400 to 1/80 (Example 2.3) is preferable because the balance between adhesive force and hardness is more suitable.
実施例5〜7
実施fl11と同様の条件でケイ素硬化層成分の比率を
クツして、同様その物性を調べた。表にみる如く組成が
異るため硬度にはやや差がみられるが接着性、帯電防止
性にすぐれた表面硬化度化フィルムであることにはかわ
りがないことが判る。Examples 5 to 7 Under the same conditions as in Example fl11, the ratio of the silicon hardened layer components was reduced and the physical properties thereof were examined in the same manner. As shown in the table, there is a slight difference in hardness due to the different compositions, but it is clear that the films are surface hardened films with excellent adhesiveness and antistatic properties.
実施例8、比較例3.4
実施例1と同様の条件で、層状ケイ酸塩を非膨11’M
I76状ケイ酸塩(トピー工業、ダイモナイ)PDM−
7)、Li y、 Mgz% r、t y、 (Si4
0to ) F2 (Li −HT と略記)と置火し
て同様に物性を調べた。表にみる如く非膨涌層状ケイ酸
塩を使用しfC場合は全く接着力を示さないため不適当
である(比較例3.4)Q一方組威は界なるが膨潤性層
状ケイ酸塩を使用すわば、硬度、接着力にすぐれた良好
な品質を持つ表面硬度化フィルムとなる(実施例8)。Example 8, Comparative Example 3.4 Under the same conditions as Example 1, the layered silicate was made into a non-expanded 11'M
I76-type silicate (Topy Industries, Daimonai) PDM-
7), Li y, Mgz% r, t y, (Si4
0to) F2 (abbreviated as Li-HT) was ignited and the physical properties were examined in the same manner. As shown in the table, when a non-swelling layered silicate is used, it is inappropriate because it shows no adhesive force at all (Comparative Example 3.4). When used, a surface-hardened film of good quality with excellent hardness and adhesive strength is obtained (Example 8).
比較例5
共重合ポリエステルをコートする前の腔さ100μmの
ポリエチレンテレフタレート2軸延伸フイルムについて
同様の品弛を評価した。耐スクラッチ性、表面硬度系不
満足なフィルムである。Comparative Example 5 A polyethylene terephthalate biaxially stretched film with a cavity size of 100 μm before being coated with copolymerized polyester was similarly evaluated for quality defects. The film is unsatisfactory in terms of scratch resistance and surface hardness.
Claims (1)
が、分子内にエポキシ基およびシラノールを含む化合物
(a)、シラノールおよび/またはシロキサン基を含む
化合物(b)、エポキシ化合物(c)より少くとも2種
選ばれた混合物からなる硬化性成分(A)と膨潤性無機
層状ケイ酸塩(B)との重量混合比(B/A)1/10
00〜2/1の混合物の硬化体からなることを特徴とす
る表面硬度化フィルム。In a film having a protective layer on the surface, the protective layer is less than the compound (a) containing an epoxy group and a silanol in the molecule, the compound (b) containing a silanol and/or siloxane group, or the epoxy compound (c). Weight mixing ratio (B/A) of curable component (A) consisting of a mixture of two selected types and swellable inorganic layered silicate (B) (B/A) 1/10
1. A surface-hardened film comprising a cured product of a mixture of 0.00 to 2/1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61020276A JPH0657442B2 (en) | 1986-02-03 | 1986-02-03 | Surface hardened film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61020276A JPH0657442B2 (en) | 1986-02-03 | 1986-02-03 | Surface hardened film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62178340A true JPS62178340A (en) | 1987-08-05 |
JPH0657442B2 JPH0657442B2 (en) | 1994-08-03 |
Family
ID=12022646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61020276A Expired - Lifetime JPH0657442B2 (en) | 1986-02-03 | 1986-02-03 | Surface hardened film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0657442B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62174148A (en) * | 1986-01-29 | 1987-07-30 | トピ−工業株式会社 | Coating film |
-
1986
- 1986-02-03 JP JP61020276A patent/JPH0657442B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62174148A (en) * | 1986-01-29 | 1987-07-30 | トピ−工業株式会社 | Coating film |
JPH0554428B2 (en) * | 1986-01-29 | 1993-08-12 | Topy Ind |
Also Published As
Publication number | Publication date |
---|---|
JPH0657442B2 (en) | 1994-08-03 |
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