JPS62177038U - - Google Patents

Info

Publication number
JPS62177038U
JPS62177038U JP1986065991U JP6599186U JPS62177038U JP S62177038 U JPS62177038 U JP S62177038U JP 1986065991 U JP1986065991 U JP 1986065991U JP 6599186 U JP6599186 U JP 6599186U JP S62177038 U JPS62177038 U JP S62177038U
Authority
JP
Japan
Prior art keywords
bonding pads
bonding
chip
square
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986065991U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986065991U priority Critical patent/JPS62177038U/ja
Publication of JPS62177038U publication Critical patent/JPS62177038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/932

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP1986065991U 1986-04-28 1986-04-28 Pending JPS62177038U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986065991U JPS62177038U (cg-RX-API-DMAC10.html) 1986-04-28 1986-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986065991U JPS62177038U (cg-RX-API-DMAC10.html) 1986-04-28 1986-04-28

Publications (1)

Publication Number Publication Date
JPS62177038U true JPS62177038U (cg-RX-API-DMAC10.html) 1987-11-10

Family

ID=30903576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986065991U Pending JPS62177038U (cg-RX-API-DMAC10.html) 1986-04-28 1986-04-28

Country Status (1)

Country Link
JP (1) JPS62177038U (cg-RX-API-DMAC10.html)

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