JPS62176712A - Method of producing band saw for cutting hard substance - Google Patents
Method of producing band saw for cutting hard substanceInfo
- Publication number
- JPS62176712A JPS62176712A JP1758686A JP1758686A JPS62176712A JP S62176712 A JPS62176712 A JP S62176712A JP 1758686 A JP1758686 A JP 1758686A JP 1758686 A JP1758686 A JP 1758686A JP S62176712 A JPS62176712 A JP S62176712A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- band
- notches
- notch
- steel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title description 4
- 239000000126 substance Substances 0.000 title description 2
- 239000010432 diamond Substances 0.000 claims abstract description 6
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 abstract description 6
- 239000010959 steel Substances 0.000 abstract description 6
- 239000007787 solid Substances 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- -1 cemented carbide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、花崗岩、大理石、超硬合金、陶器そしてタ
イル、半導体、セラミックス等の各種金属を含む硬質物
を切削(切断を含む)するための硬質物切削用帯のこの
製造方法に関するものである。[Detailed Description of the Invention] (Industrial Application Field) This invention is for cutting (including cutting) hard materials including various metals such as granite, marble, cemented carbide, ceramics, tiles, semiconductors, and ceramics. The present invention relates to this method of manufacturing a strip for cutting hard materials.
(従来の技術)
従来、主として硬質物の切削に使用される帯のこは、第
2図で示すごとく鋼板等からなる帯条鈑(6)に等間隔
にU字状の間欠切欠(8)を設け、該間欠切欠(8)と
間欠切欠(8)との間に切欠部(9)を設け、該切欠部
(9)にダイヤモンドの砥粒を含む焼結合金から成る立
方体等のチップ(7)を約半分から3分の2程度突出す
るように埋嵌し、その埋嵌部分のチップ(7)と切欠部
(9)とを銀ろう付により結着して製造されていた。(Prior Art) Conventionally, band saws mainly used for cutting hard materials have U-shaped intermittent notches (8) equidistantly spaced on a band plate (6) made of steel plate, etc., as shown in Fig. 2. A notch (9) is provided between the intermittent notches (8), and a cube or other chip ( 7) is embedded so as to protrude from about half to two-thirds, and the embedded part of the chip (7) and the notch (9) are bonded together by silver soldering.
(発明が解決しようとする問題点)
このような従来技術にあっては、チップ(7)と帯条鈑
(6)とを銀ろうα〔により結着している関係上、第1
に、第3図で示すごとく溶けた銀ろうQOIがチップ(
7)のMi織内に吸収されるごとく侵入し、切削中にチ
ップ(7)が目詰まりをおこして切削力を低下させると
いう問題点がある。(Problems to be Solved by the Invention) In such a conventional technique, since the chip (7) and the strip plate (6) are bonded by silver solder α, the first
Then, as shown in Figure 3, the melted silver solder QOI becomes a chip (
There is a problem in that the tip (7) penetrates as if absorbed into the Mi weave, causing clogging of the tip (7) during cutting and reducing the cutting force.
即ち、チップ(7)は、ダイヤモンド粒子叩と各種金属
粉Q31とが適度な間隙を有して結合されており、その
間隙を有するこ止によって切削屑や切削油等の排除や流
通を行い、口詰まり無く切削できるのであるが、ろう付
を行っている関係上、必ずその間隙に溶けた銀ろうα0
)が侵入して目詰まり状態となり、冷却効果を阻害する
と共に、その銀ろうθO)は延展性も大なることによっ
て切れ味を低下させ、しかも切削による発熱が増大する
という問題点があった。That is, in the tip (7), diamond particles and various metal powders Q31 are combined with appropriate gaps, and the gaps allow removal and circulation of cutting waste, cutting oil, etc. It can be cut without any clogging, but due to the brazing process, there is always melted silver solder α0 in the gap.
) enters and becomes clogged, impeding the cooling effect, and the silver solder θO) also has increased ductility, reducing sharpness and increasing heat generation during cutting.
第2に、ろう付作業を伴う関係上、そのろう付の際には
、600℃〜700℃において加熱時間がlO〜20秒
位かかり、帯条鈑(6)は熱影否部(+11のごとく大
きなりへ影響を受けることとなり、その為に、深い(大
きな)間欠切欠(8)を設けなければならず、高速回転
中等にその間欠切欠(8)の底部より亀裂が発生し易く
強度的に弱くなると共に、帯条鈑(6)に充分な緊張力
(テンション)を与えても、チップ(7)である刃先ま
でその緊張力は掛りに((、刃先がふれることにより精
密な切削ができないという問題点があった。Secondly, since brazing work is involved, the heating time for brazing at 600°C to 700°C is about 10 to 20 seconds, and the strip plate (6) is heated in the heat-affected area (+11 Therefore, deep (large) intermittent notches (8) must be provided, and cracks are likely to occur from the bottom of the intermittent notches (8) during high-speed rotation, etc. At the same time, even if sufficient tension is applied to the strip plate (6), the tension is applied to the cutting edge, which is the chip (7). The problem was that it couldn't be done.
(問題点を解決するめの手段)
このような問題点を解決するために、この発明によれば
、帯条鈑(1)の一側端部に等間隔状りこ間欠切欠(2
)を穿設し、該間欠切欠(2)と間欠切欠(2)との間
に切欠部(3)を穿設し、該切欠部’3) !こダイヤ
モンドを含む焼結合金よりなるチップ(4)を結着して
成る硬質物切削用帯のこの製造方法において、帯条鈑(
1)とチップ(4)との間に電流を流し、これらの電気
抵抗により溶接して結着することを特徴とする硬質物切
削用帯のこの製造方法が提供される。(Means for Solving the Problems) In order to solve these problems, according to the present invention, evenly spaced intermittent notches (2
), and a notch (3) is bored between the intermittent notches (2) and the notches '3)! In this method for manufacturing a strip for cutting hard materials, which is made by bonding a tip (4) made of a sintered alloy containing diamond, the strip plate (
This method of manufacturing a band for cutting a hard material is provided, which is characterized in that a current is passed between the tip (1) and the tip (4), and the two are welded and bonded by their electrical resistance.
上記構成において、電流は、チップ(4)を帯条鈑(1
1に押圧することにより流すことができる。In the above configuration, the current flows between the chip (4) and the strip plate (1).
It can be flushed by pressing 1.
このようにした場合は、より安定にして強固に結着する
ことができる。In this case, more stable and strong binding can be achieved.
また上記構成において、電流は、チップ(4)を帯条鈑
(1)に所望の一定寸法押圧して流すことができる。Further, in the above configuration, the current can be applied by pressing the chip (4) against the strip plate (1) by a desired constant dimension.
このようにした場合は、帯条鈑tl)に対してデツプ(
4)の結着位置(高さ)を一定にすることができる。In this case, the depth (
4) The binding position (height) can be kept constant.
(作用) 上記の技術的手段は次の様に作用する。(effect) The above technical means works as follows.
チップ(4)と帯条鈑(11との間に電流を流すことに
より、そのチップ(4)と帯条鈑(1)との接触部であ
る電気抵抗大なる部分が瞬間的に高温となり、そのそれ
ぞれの接触部が溶融して溶接されるこの瞬間的な高温は
、約1秒以内であり帯条鈑(1)に熱影古をほとんど与
えることなく結着できるので、間欠切欠(2)は、その
本来の機能である切削屑の排出や回転時等の応力の分散
の目的以上に深くする必要はなく、無くても良い程度ま
で浅く (小さく)することができる。By passing a current between the chip (4) and the strip plate (11), the contact area between the chip (4) and the strip plate (1), which has a large electrical resistance, instantaneously becomes high temperature. This instantaneous high temperature that melts and welds the respective contact parts is within about 1 second and can be bonded with almost no thermal effect on the strip plate (1), so the intermittent notch (2) There is no need to make it deeper than its original function of discharging cutting chips and dispersing stress during rotation, etc., and it can be made shallow (smaller) to the extent that it is not necessary.
また、結着はチップ(4)と帯条鈑(1)の互いの組織
の溶融により行なわれるものであり、銀ろう等の他の物
質は介在しないものであるから、チップ(4)のMi礒
内が目詰まりすることなく結着できるごとく作用する。Furthermore, since the bonding is performed by melting the mutual structures of the chip (4) and the strip plate (1), and other substances such as silver solder are not involved, the Mi of the chip (4) It works so that it can be bound without clogging the inside of the jar.
(実施例)
この発明の一実施例を図面について説明すれば、(11
は薄肉な鋼材から成る帯条鈑であり、該帯条鈑(11は
、等間隔に浅い間欠切欠(2)が穿設されると共に、そ
の間欠切欠(2)と間欠切欠(2)とのそれぞれの間に
切欠部(3)が穿設されている。(Embodiment) An embodiment of the present invention will be described with reference to the drawings (11
is a strip plate made of thin steel material, and the strip plate (11) has shallow intermittent notches (2) bored at equal intervals, and the intermittent notches (2) and the intermittent notches (2). A notch (3) is bored between each.
(4)はダイヤモンドを含む焼結合金から成るチップで
あり、該チップ(4)は、立方体に形成され、上記それ
ぞれの切欠部(3)に嵌入される。(4) is a chip made of a sintered alloy containing diamond, and this chip (4) is formed into a cube and is fitted into each of the above-mentioned notches (3).
そして、この嵌入されたチップ(4)とその下方の帯条
鈑(1)とを、上下より電極(5)により押圧し、その
電極+51 (5)間に所定の電流を流してチップ(4
)と帯条鈑(1)の切欠部(3)との接触部を結着させ
るものである。Then, the inserted chip (4) and the strip plate (1) below it are pressed by electrodes (5) from above and below, and a predetermined current is passed between the electrodes +51 (5), so that the chip (4)
) and the contact portion of the strip plate (1) with the notch (3).
本発明は上記実施例に限定されるものではなく、例えば
、電極を多数配設することにより一度に多(のチップを
結着するようにしてもよく、また、帯条鈑は有端又は無
端連続状のものでもよい。The present invention is not limited to the above-mentioned embodiments. For example, by arranging a large number of electrodes, a large number of chips may be bonded at once, and the strip plate may have an end or an endless board. It may be continuous.
(発明の効果)
以上に説明したように、本発明は、ろう付作業という特
殊な技術を必要とせず容易にチップと帯条鈑を結着する
ことができ、しかも恨ろう等を介在させろことなく極め
て熱影響が少ない状態で結着できるものである。(Effects of the Invention) As explained above, the present invention allows chips and strip sheets to be easily bonded together without the need for special techniques such as brazing work, and moreover, without intervening brazing or the like. It can be bonded with extremely little heat influence.
よって、刃先となるチップのm 織に悪影グを与えるこ
とがj、Q (、切れ味の良い口詰まりしにくい帯のこ
を提供でき、しかも、間欠切欠を浅(できるのでその間
欠切欠部分より亀裂が生じることがないと共に、帯条鈑
に与えた緊張力がそのまま刃先までかかり、これによっ
て刃先が切削時における抵抗に充分に耐えて、精度良く
切削できる帯のこを提供できる等の効果を有するもので
ある。Therefore, it is possible to provide a band saw with good sharpness and less clogging by giving a bad shadow to the weave of the tip which becomes the cutting edge. In addition to not causing cracks, the tension applied to the strip plate is directly applied to the cutting edge, which allows the cutting edge to sufficiently withstand the resistance during cutting, making it possible to provide a band saw that can cut with high precision. It is something that you have.
第1図は本発明の一実施例を示す要部正面図、第2図は
従来の硬質物切削用帯のこを示す要部正面図、第3図は
第2図のチップを示す拡大説明図である。
図面において、(1)は帯条鈑、(2)は間欠切欠、(
3)は切欠部、(4)はチップ、(5)は電極を示すも
のである。Fig. 1 is a front view of main parts showing an embodiment of the present invention, Fig. 2 is a front view of main parts showing a conventional band saw for cutting hard materials, and Fig. 3 is an enlarged explanation showing the tip of Fig. 2. It is a diagram. In the drawing, (1) is the strip plate, (2) is the intermittent notch, (
3) shows a notch, (4) a chip, and (5) an electrode.
Claims (1)
)を穿設し、該間欠切欠(2)と間欠切欠(2)との間
に切欠部(3)を穿設し、該切欠部(3)にダイヤモン
ドを含む焼結合金よりなるチップ(4)を結着して成る
硬質物切削用帯のこの製造方法において、帯条鈑(1)
とチップ(4)との間に電流を流し、これらの電気抵抗
により溶接して結着することを特徴とする硬質物切削用
帯のこの製造方法。1 Intermittent notches (2
), a notch (3) is bored between the intermittent notches (2), and a chip (4) made of a sintered alloy containing diamond is provided in the notch (3). ) in this method of manufacturing a band for cutting hard materials, the band strip plate (1)
This method of manufacturing a band for cutting a hard material is characterized in that a current is passed between the tip (4) and the tip (4), and the two are welded and bonded by their electric resistance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1758686A JPS62176712A (en) | 1986-01-28 | 1986-01-28 | Method of producing band saw for cutting hard substance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1758686A JPS62176712A (en) | 1986-01-28 | 1986-01-28 | Method of producing band saw for cutting hard substance |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62176712A true JPS62176712A (en) | 1987-08-03 |
Family
ID=11948006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1758686A Pending JPS62176712A (en) | 1986-01-28 | 1986-01-28 | Method of producing band saw for cutting hard substance |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62176712A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6067022A (en) * | 1983-09-22 | 1985-04-17 | Sanwa Daiyamondo Kogyo Kk | Band saw for cutting hard material or metal |
-
1986
- 1986-01-28 JP JP1758686A patent/JPS62176712A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6067022A (en) * | 1983-09-22 | 1985-04-17 | Sanwa Daiyamondo Kogyo Kk | Band saw for cutting hard material or metal |
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