JPS62174790U - - Google Patents

Info

Publication number
JPS62174790U
JPS62174790U JP1986061747U JP6174786U JPS62174790U JP S62174790 U JPS62174790 U JP S62174790U JP 1986061747 U JP1986061747 U JP 1986061747U JP 6174786 U JP6174786 U JP 6174786U JP S62174790 U JPS62174790 U JP S62174790U
Authority
JP
Japan
Prior art keywords
main
laser beam
sub
objective lens
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986061747U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986061747U priority Critical patent/JPS62174790U/ja
Publication of JPS62174790U publication Critical patent/JPS62174790U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のレーザ加工装置の一実施例を
示す正面図、第2図は本考案の別の実施例を示す
レーザ加工装置の正面図、第3図は従来のレーザ
加工装置の一例を示す正面図、第4図は従来のレ
ーザ加工装置の別の例を示す正面図である。 21……レーザ発振器、22,26……レーザ
光、27……半透過鏡、28,36……主レーザ
光、29,37……副レーザ光、31……主対物
レンズ、32……被加工物、34……副対物レン
ズ、39,42……光フアイバ。
Fig. 1 is a front view showing one embodiment of a laser processing device of the present invention, Fig. 2 is a front view of a laser processing device showing another embodiment of the invention, and Fig. 3 is an example of a conventional laser processing device. FIG. 4 is a front view showing another example of a conventional laser processing device. 21... Laser oscillator, 22, 26... Laser light, 27... Semi-transmissive mirror, 28, 36... Main laser beam, 29, 37... Sub laser beam, 31... Main objective lens, 32... Subject Workpiece, 34... Sub-objective lens, 39, 42... Optical fiber.

Claims (1)

【実用新案登録請求の範囲】 1 レーザ光を、被加工物の主加工を行う主レー
ザ光と、主加工時の前または後に被加工物の副加
工を行う副レーザ光とに分割するように、レーザ
光の光路に配置された半透過鏡と、この半透過鏡
より導かれる上記主レーザ光を、被加工物に照射
する主対物レンズと、主対物レンズと集光条件を
異にして、主対物レンズの集光位置の近傍におけ
る被加工物に、半透過より導かれる副レーザ光を
照射する副対物レンズとを備えることを特徴とす
るレーザ加工装置。 2 主レーザ光を対物レンズに導く第1光フアイ
バおよび第1光フアイバとコア径を異にし、副レ
ーザ光を副対物レンズに導く第2光フアイバとを
備えることを特徴とする実用新案登録請求の範囲
第1項記載のレーザ加工装置。
[Claims for Utility Model Registration] 1. A laser beam that is divided into a main laser beam that performs main processing of the workpiece and a sub-laser beam that performs sub-processing of the workpiece before or after the main processing. , a semi-transmissive mirror disposed in the optical path of the laser beam, a main objective lens that irradiates the workpiece with the main laser beam guided by the semi-transmissive mirror, and a main objective lens with different focusing conditions, A laser processing apparatus comprising: a sub-objective lens that irradiates a workpiece in the vicinity of a condensing position of the main objective lens with sub-laser light guided semi-transmissively. 2. Request for registration of a utility model characterized by comprising a first optical fiber that guides a main laser beam to an objective lens, and a second optical fiber that has a core diameter different from the first optical fiber and that guides a sub-laser beam to a sub-objective lens. The laser processing device according to the range 1 above.
JP1986061747U 1986-04-25 1986-04-25 Pending JPS62174790U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986061747U JPS62174790U (en) 1986-04-25 1986-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986061747U JPS62174790U (en) 1986-04-25 1986-04-25

Publications (1)

Publication Number Publication Date
JPS62174790U true JPS62174790U (en) 1987-11-06

Family

ID=30895363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986061747U Pending JPS62174790U (en) 1986-04-25 1986-04-25

Country Status (1)

Country Link
JP (1) JPS62174790U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001564A (en) * 2000-06-23 2002-01-08 Amada Eng Center Co Ltd Laser beam machining device and machining method using the same
JP2016087616A (en) * 2014-10-30 2016-05-23 株式会社豊田自動織機 Laser welding method and laser welding device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106489A (en) * 1980-12-25 1982-07-02 Seiko Instr & Electronics Ltd Laser joining method
JPS60234768A (en) * 1984-05-08 1985-11-21 Matsushita Electric Ind Co Ltd Laser soldering device
JPS6146386A (en) * 1984-08-09 1986-03-06 Mitsubishi Electric Corp Welding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106489A (en) * 1980-12-25 1982-07-02 Seiko Instr & Electronics Ltd Laser joining method
JPS60234768A (en) * 1984-05-08 1985-11-21 Matsushita Electric Ind Co Ltd Laser soldering device
JPS6146386A (en) * 1984-08-09 1986-03-06 Mitsubishi Electric Corp Welding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001564A (en) * 2000-06-23 2002-01-08 Amada Eng Center Co Ltd Laser beam machining device and machining method using the same
JP2016087616A (en) * 2014-10-30 2016-05-23 株式会社豊田自動織機 Laser welding method and laser welding device

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