JPS62174790U - - Google Patents
Info
- Publication number
- JPS62174790U JPS62174790U JP1986061747U JP6174786U JPS62174790U JP S62174790 U JPS62174790 U JP S62174790U JP 1986061747 U JP1986061747 U JP 1986061747U JP 6174786 U JP6174786 U JP 6174786U JP S62174790 U JPS62174790 U JP S62174790U
- Authority
- JP
- Japan
- Prior art keywords
- main
- laser beam
- sub
- objective lens
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims 1
Description
第1図は本考案のレーザ加工装置の一実施例を
示す正面図、第2図は本考案の別の実施例を示す
レーザ加工装置の正面図、第3図は従来のレーザ
加工装置の一例を示す正面図、第4図は従来のレ
ーザ加工装置の別の例を示す正面図である。
21……レーザ発振器、22,26……レーザ
光、27……半透過鏡、28,36……主レーザ
光、29,37……副レーザ光、31……主対物
レンズ、32……被加工物、34……副対物レン
ズ、39,42……光フアイバ。
Fig. 1 is a front view showing one embodiment of a laser processing device of the present invention, Fig. 2 is a front view of a laser processing device showing another embodiment of the invention, and Fig. 3 is an example of a conventional laser processing device. FIG. 4 is a front view showing another example of a conventional laser processing device. 21... Laser oscillator, 22, 26... Laser light, 27... Semi-transmissive mirror, 28, 36... Main laser beam, 29, 37... Sub laser beam, 31... Main objective lens, 32... Subject Workpiece, 34... Sub-objective lens, 39, 42... Optical fiber.
Claims (1)
ザ光と、主加工時の前または後に被加工物の副加
工を行う副レーザ光とに分割するように、レーザ
光の光路に配置された半透過鏡と、この半透過鏡
より導かれる上記主レーザ光を、被加工物に照射
する主対物レンズと、主対物レンズと集光条件を
異にして、主対物レンズの集光位置の近傍におけ
る被加工物に、半透過より導かれる副レーザ光を
照射する副対物レンズとを備えることを特徴とす
るレーザ加工装置。 2 主レーザ光を対物レンズに導く第1光フアイ
バおよび第1光フアイバとコア径を異にし、副レ
ーザ光を副対物レンズに導く第2光フアイバとを
備えることを特徴とする実用新案登録請求の範囲
第1項記載のレーザ加工装置。[Claims for Utility Model Registration] 1. A laser beam that is divided into a main laser beam that performs main processing of the workpiece and a sub-laser beam that performs sub-processing of the workpiece before or after the main processing. , a semi-transmissive mirror disposed in the optical path of the laser beam, a main objective lens that irradiates the workpiece with the main laser beam guided by the semi-transmissive mirror, and a main objective lens with different focusing conditions, A laser processing apparatus comprising: a sub-objective lens that irradiates a workpiece in the vicinity of a condensing position of the main objective lens with sub-laser light guided semi-transmissively. 2. Request for registration of a utility model characterized by comprising a first optical fiber that guides a main laser beam to an objective lens, and a second optical fiber that has a core diameter different from the first optical fiber and that guides a sub-laser beam to a sub-objective lens. The laser processing device according to the range 1 above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986061747U JPS62174790U (en) | 1986-04-25 | 1986-04-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986061747U JPS62174790U (en) | 1986-04-25 | 1986-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62174790U true JPS62174790U (en) | 1987-11-06 |
Family
ID=30895363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986061747U Pending JPS62174790U (en) | 1986-04-25 | 1986-04-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62174790U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002001564A (en) * | 2000-06-23 | 2002-01-08 | Amada Eng Center Co Ltd | Laser beam machining device and machining method using the same |
JP2016087616A (en) * | 2014-10-30 | 2016-05-23 | 株式会社豊田自動織機 | Laser welding method and laser welding device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57106489A (en) * | 1980-12-25 | 1982-07-02 | Seiko Instr & Electronics Ltd | Laser joining method |
JPS60234768A (en) * | 1984-05-08 | 1985-11-21 | Matsushita Electric Ind Co Ltd | Laser soldering device |
JPS6146386A (en) * | 1984-08-09 | 1986-03-06 | Mitsubishi Electric Corp | Welding device |
-
1986
- 1986-04-25 JP JP1986061747U patent/JPS62174790U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57106489A (en) * | 1980-12-25 | 1982-07-02 | Seiko Instr & Electronics Ltd | Laser joining method |
JPS60234768A (en) * | 1984-05-08 | 1985-11-21 | Matsushita Electric Ind Co Ltd | Laser soldering device |
JPS6146386A (en) * | 1984-08-09 | 1986-03-06 | Mitsubishi Electric Corp | Welding device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002001564A (en) * | 2000-06-23 | 2002-01-08 | Amada Eng Center Co Ltd | Laser beam machining device and machining method using the same |
JP2016087616A (en) * | 2014-10-30 | 2016-05-23 | 株式会社豊田自動織機 | Laser welding method and laser welding device |