JPS62174341U - - Google Patents
Info
- Publication number
- JPS62174341U JPS62174341U JP1986062744U JP6274486U JPS62174341U JP S62174341 U JPS62174341 U JP S62174341U JP 1986062744 U JP1986062744 U JP 1986062744U JP 6274486 U JP6274486 U JP 6274486U JP S62174341 U JPS62174341 U JP S62174341U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- main surface
- substrate
- chip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986062744U JPS62174341U (US20030220297A1-20031127-C00033.png) | 1986-04-25 | 1986-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986062744U JPS62174341U (US20030220297A1-20031127-C00033.png) | 1986-04-25 | 1986-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174341U true JPS62174341U (US20030220297A1-20031127-C00033.png) | 1987-11-05 |
Family
ID=30897312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986062744U Pending JPS62174341U (US20030220297A1-20031127-C00033.png) | 1986-04-25 | 1986-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174341U (US20030220297A1-20031127-C00033.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02216853A (ja) * | 1988-11-03 | 1990-08-29 | Micro Strates Inc | 金属充填貫通孔を備えるセラミック基板及びその製造方法並びにハイブリッドマイクロ回路及び貫通孔に使用する複合金属 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106581A (US20030220297A1-20031127-C00033.png) * | 1974-01-29 | 1975-08-22 | ||
| JPS50155973A (US20030220297A1-20031127-C00033.png) * | 1974-06-07 | 1975-12-16 |
-
1986
- 1986-04-25 JP JP1986062744U patent/JPS62174341U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106581A (US20030220297A1-20031127-C00033.png) * | 1974-01-29 | 1975-08-22 | ||
| JPS50155973A (US20030220297A1-20031127-C00033.png) * | 1974-06-07 | 1975-12-16 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02216853A (ja) * | 1988-11-03 | 1990-08-29 | Micro Strates Inc | 金属充填貫通孔を備えるセラミック基板及びその製造方法並びにハイブリッドマイクロ回路及び貫通孔に使用する複合金属 |
