JPS62173487A - Electrode connection structural body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to flat panel display devices such as liquid crystal display devices, plasma display devices, or EL display devices;
In a flat sensor array such as an ED array, this invention relates to an electrode connection structure for connecting an external lead-out electrode group of a flat device and an output electrode group of a circuit board on which a semiconductor device for driving the flat device is mounted. .

Conventional Technology In order to drive a flat plate device, it is necessary to connect the external lead-out electrode group of the device to the output electrode group of the circuit board on which the driving semiconductor device is mounted, and several methods are available for this purpose. It is being This method can be broadly divided into two parts. One is an adhesive method and the other is a pressure contact method, and the present invention relates to the pressure contact method.

The press-contact method can be divided into an indirect press-contact method in which an anisotropic conductive rubber in which conductive parts and non-conductive parts are arranged alternately is interposed, and a method in which the electrodes are directly press-contacted. For example, in the indirect pressure welding method, as shown in FIG. 3, a group of output electrodes is formed at the end of a circuit board 2 on which a plurality of driving semiconductor devices 1 are mounted on the same substrate, and a group of external lead-out electrodes 4 of a flat device 3 is used. In this method, the anisotropic conductive rubber 5 is sandwiched and pressed between the electrodes to connect them. In addition, in the direct pressure contact method, as shown in FIG. This is a method in which the group 4 is brought into direct contact and connected under pressure via the kusong yong material 7.

Problems to be Solved by the Invention Since the anisotropic conductive rubber used in the indirect pressure welding method is an elastic body, thermal expansion, contraction, vibration, etc. cause the external lead-out electrode group of the flat device and the electrode of the circuit board to There is no difference between groups.

However, in the case of direct pressure welding, nothing is interposed between the electrodes, so if the difference in thermal expansion coefficient between the pressure welding jig and the flat device is large, misalignment will occur due to repeated thermal expansion and contraction.

An object of the present invention is to use a direct pressure welding method, in which an insulating film having an opening is formed in a part of the conductive part on an external lead-out electrode group of a high-intensity flat-type device, and a circuit board electrode is provided with an opening. A protrusion that matches the hole is formed, and the electrode exposed in the hole comes into contact with the electrode of the circuit board, and the flat device and the circuit board are pressed together by the connection frame having the cushioning material and the support frame. Fixed.

Function: Because the protrusions of the circuit board electrode group match the openings made in the external lead-out electrode group of the flat plate device, misalignment between the two electrode groups is less likely to occur, and furthermore, it is possible to prevent the occurrence of misalignment between the two electrode groups. Since it is covered with an insulating film, it also protects the electrode.

Embodiment FIG. 1 shows a sectional view of a main part of an electrode connection structure according to an embodiment of the present invention.

External lead-out electrode group 4 formed around the flat device 3
An insulating film 8 is formed on the insulating film 8, and an opening 8a is formed in a part of the conductive part. A protrusion 10 that matches the opening 8 is formed on the electrode 9 of the flexible circuit board 6 on which the semiconductor device 1 is mounted. The electrode surface exposed in the opening 8a and the protrusion 10 are brought into direct contact with each other, and the cushioning material 11
The structure is such that the flat device 3 and the circuit board 6 are press-fixed by the connection frame 12, the support frame 12, and the support frame 13.

Next, a specific example will be explained.

A case will be explained in which the flat device 3 is an EL display having an external lead-out electrode group 4 having 256 scanning electrodes and 1024 signal electrodes at a pitch of 0.32 mm. At this time, the display substrate is made of glass and has dimensions of 250 x 80 x 2.4 marks.

The connection frame 12 and the support frame 13 were made of Al.

Silicone iron (φ2 plate) was used as the shoe material 11. Insulating film 8 on external lead-out electrode group 4 of flat plate device 3
was formed of an S 1 a N 4 film (thickness: 1 μm).

The holes were made by etching.

The flexible circuit board 6 has a copper foil pattern formed on a polyimide film, and the semiconductor component is made of Sn.
The plated electrode portion is plated with Au. Note that the protrusion 1o was formed by etching copper. Forty semiconductor devices 1 were mounted on this flexible circuit board 6.

The cushioning material 11 is interposed so that the protrusion 1Q of the circuit board 6 is aligned with the opening 8 formed in the external lead-out electrode group 4 of the flat device 3 and is in pressure contact with the connection frame 12 and the support frame. The body 13 was fixed with screws. The tightening force of the screw was 3 Ai' f cm.

When mounted in this way, the EL display drive voltage is 10
When driven at 0 V and a maximum current of 80 mA, good 1 drive was achieved. Also, -55°C/125°C
Even after 100 thermal shock tests, no pitch deviation occurred.

In addition, when microscopic irregularities were formed by etching on the surface of the insulating film other than the openings, thermal shock tests (-66°C/
No deviation occurred even after 1000 cycles (126°C).

In the embodiment, the connection frame 12 and the support frame 13 are fixed by screws, but the frames may be fitted into each other, or a fixing jig may be provided separately.

Furthermore, although the connection frame 12 and the support frame 13 are made of Al, they are not limited to this (Cu, Cu, etc.).

It can be made of SuS, Fe, ceramic, resin, etc. The cushion material 11 can be made of an elastic body having relatively heat resistance such as silicone rubber, and its shape is not limited to a round shape or a sheet shape, but may be triangular or angular.

The structure of the electrode portion of the flexible circuit board 6 is shown in FIG. The structure used in the example is (a), but (
As in the structure 'b), a structure in which the film is removed from the portion where the cushioning material 11 contacts may be used.

Effects of the Invention Since the electrodes of the flat device have concave portions and the electrodes of the circuit board have convex portions, and the convex portions are pressed against the concave portions, there is no risk of misalignment of the connection points due to thermal shock, vibration, etc. Therefore, a highly reliable connection structure can be realized.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the main parts of a flat plate device according to an embodiment of the present invention, FIG. 2 is a perspective view showing an example of the structure of an electrode part of a flexible circuit board, and FIGS. 3 and 4 are , is a perspective view showing a conventional pressure contact type device. 1... Semiconductor device, 2... Circuit board,
3... Flat plate device, 4... External lead-out electrode group, 6... Flexible circuit board, 8...
...Insulating film, 8a...Opening part, 9...
Circuit board electrode group, 10... protrusion, 11...
... Cushion material, 12 ... Connection frame, 13
・・・・・・Support frame body. Name of agent: Patent attorney Toshi Nakao Haga 1 person 1 ~
-1 Semiconductor device 3-11 flat plate next te) (chair 4-external conductor [box group Otsu-m-visible, Chise, circuit board 8--~Ochi Midori N-cho (!?, :L-open, 71. J part 9 - Pole group 10 - Turning part] / - M - Restion position Fig. 1 / Z - Part 13 - Support frame Fig. 2 Fig. 3

Claims (2)

[Claims] (1) Conductive parts and non-conductive parts are alternately formed around the periphery, and an insulating layer is formed on the conductive part and the non-conductive part so that a part of the conductive part is exposed. A flat plate device provided with a group of external lead-out electrodes, a circuit board on which a semiconductor device for driving the flat plate device is mounted and having an electrode group having a protrusion that matches the opening, and the flat plate device. A connection jig in which a cushioning material is arranged near the externally led electrode group, and a support frame for coupling and fixing the flat device and the circuit board at the part of the connection jig in which the cushioning material is arranged. , the surface of the external lead-out electrode group exposed to the opening is in contact with the protruding surface of the electrode group of the circuit board, and the surface of the flat device on which the external lead-out electrode group is not formed is in contact with the support frame. an electrode connection structure, characterized in that the surface of the circuit board on which no protruding electrodes are formed is bonded and fixed so that the cushion material is in contact with the surface of the circuit board on which no protruding electrodes are formed. (2) The electrode connection structure according to claim 1, wherein the surface of the portion other than the aperture has larger irregularities than the surface of the conductive portion exposed in the aperture.