JPS62173220A - Mold for synthetic resin having silicon compound coating - Google Patents
Mold for synthetic resin having silicon compound coatingInfo
- Publication number
- JPS62173220A JPS62173220A JP1468286A JP1468286A JPS62173220A JP S62173220 A JPS62173220 A JP S62173220A JP 1468286 A JP1468286 A JP 1468286A JP 1468286 A JP1468286 A JP 1468286A JP S62173220 A JPS62173220 A JP S62173220A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- silicon compound
- synthetic resin
- alkyl group
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000003377 silicon compounds Chemical class 0.000 title claims abstract description 15
- 239000000057 synthetic resin Substances 0.000 title claims abstract description 14
- 229920003002 synthetic resin Polymers 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 title claims abstract description 10
- 238000000576 coating method Methods 0.000 title claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 25
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000006082 mold release agent Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- QULMGWCCKILBTO-UHFFFAOYSA-N n-[dimethylamino(dimethyl)silyl]-n-methylmethanamine Chemical compound CN(C)[Si](C)(C)N(C)C QULMGWCCKILBTO-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- -1 diaryl phthalate Chemical compound 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- KZFNONVXCZVHRD-UHFFFAOYSA-N dimethylamino(dimethyl)silicon Chemical compound CN(C)[Si](C)C KZFNONVXCZVHRD-UHFFFAOYSA-N 0.000 description 2
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000003925 fat Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- ADTGAVILDBXARD-UHFFFAOYSA-N diethylamino(dimethyl)silicon Chemical compound CCN(CC)[Si](C)C ADTGAVILDBXARD-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IQSBKDJPSOMMRZ-UHFFFAOYSA-N ethenyl(methyl)silane Chemical compound C[SiH2]C=C IQSBKDJPSOMMRZ-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- BOYBHDHQCOROOJ-UHFFFAOYSA-N n-[butylamino(dimethyl)silyl]butan-1-amine Chemical compound CCCCN[Si](C)(C)NCCCC BOYBHDHQCOROOJ-UHFFFAOYSA-N 0.000 description 1
- NGAVXENYOVMGDJ-UHFFFAOYSA-N n-[ethylamino(dimethyl)silyl]ethanamine Chemical compound CCN[Si](C)(C)NCC NGAVXENYOVMGDJ-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- GIRKRMUMWJFNRI-UHFFFAOYSA-N tris(dimethylamino)silicon Chemical compound CN(C)[Si](N(C)C)N(C)C GIRKRMUMWJFNRI-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/60—Releasing, lubricating or separating agents
- B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
- B29C33/64—Silicone
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は合成樹脂成形用型、さら（′こ詳しくいえば、
離型性に優れ、かつ鏡面性の良好な樹脂成形品を与、ｔ
うる、成形面に化学結合したケイ素化合物被覆を設けて
成る合成（酊脂成形用をに関するものである。[Detailed Description of the Invention] Industrial Field of Application The present invention relates to a mold for synthetic resin molding, and more specifically,
Provides resin molded products with excellent mold releasability and good specularity.
Synthesis (for molding of rosin), which involves providing a chemically bonded silicon compound coating on the molding surface.
従来の技術
従来、合成（匍脂の成形において、成形品を型から取り
出す場合１強い接着性を有する樹脂５例えばフェノール
切脂やエボキン位１脂などは型からの離型性が悪く、そ
のため通常、成形用型にシリコン系、フッ素系、ワック
ス系離型剤を塗布する方法がとられている。Conventional technology Conventionally, in the molding of synthetic resins, when removing a molded product from a mold, resins with strong adhesive properties such as phenol resin and Evokin resin have poor releasability from the mold, so they are usually The method used is to apply a silicone-based, fluorine-based, or wax-based mold release agent to the mold.
しかしながら、このような離型剤を塗布する方法におい
ては、成形品に離型剤による曇りが発生したり、あるい
は十分な臆面が得らｎないことが多い。特に１合成樹脂
から成る光学部品を成形する場合には、一般にガラスや
金属などの鏡面を有する型を用い、この型の鏡面性を成
形品に転写させる方法が行われるが、このような成形に
おいては、前記の離型剤金塗布する方法では、成形品に
離型剤による曇りや離型剤の塗りムラが発生しやすくて
、光学部品として満足しつるものが得られないという問
題がある。However, in this method of applying a mold release agent, the molded product often becomes cloudy due to the mold release agent, or a sufficient surface is not obtained. In particular, when molding optical parts made of synthetic resin, a method is generally used in which a mold with a mirror surface, such as glass or metal, is used and the specularity of this mold is transferred to the molded product. However, in the above-mentioned method of coating the mold release agent with gold, there is a problem that cloudiness due to the mold release agent and uneven application of the mold release agent easily occur on the molded product, making it impossible to obtain a satisfactory optical component.
発明が解決しようとする問題点
本発明の目的は、このような問題が解決し、合成樹脂成
形品と型との離型が容易であり、かつ優汎た鏡面を該成
形品に付与しうる合成樹脂成形用型を提供することにあ
る。Problems to be Solved by the Invention The purpose of the present invention is to solve these problems, to facilitate the release of a synthetic resin molded product from a mold, and to provide an excellent mirror surface to the molded product. The purpose of the present invention is to provide a mold for molding synthetic resin.
問題点を解決するための手段
本発明者らは前記目的を達成すべく鋭意研究を重ねた結
果、合成樹脂成形用型の成形面に、特定のケイ素化合物
の被覆を化学結合によって形成させることにより、その
目的を達成しうることを見出し、この知見に基づいて本
発明を完成するに至った。Means for Solving the Problems The inventors of the present invention have conducted extensive research to achieve the above object, and have found that by forming a coating of a specific silicon compound on the molding surface of a synthetic resin mold through chemical bonding. The inventors have discovered that the object can be achieved, and have completed the present invention based on this knowledge.
すなわち、本発明は、成形面に、一般式（式中のＲ１は
水素原子、炭素数１〜３のアルキル基又はビニル基、Ｒ
２及びＲ３はそれぞれ水素原子、炭素数１〜３のアルキ
ル基、ビニル基又は炭素数１〜４のアルキル基である）
又は、構造式
％式％
で表わされるケイ素化合物を化学的に結合して形成した
被覆を有することを特徴とする合成樹脂成形型を提供す
るものである。That is, the present invention provides a molding surface with a compound having the general formula (wherein R1 is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a vinyl group, R
(2 and R3 are each a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a vinyl group, or an alkyl group having 1 to 4 carbon atoms), or by chemically bonding a silicon compound represented by the structural formula %. The present invention provides a synthetic resin mold characterized by having a formed coating.
本発明において用いられるケイ素化合物は、前記一般式
ＣＩ）又は構造式（ｎ）で表わされる化合物であって、
該一般式（＋）におけるＲ１は水素原子、メチル、エチ
ル、プロピル基などの炭素数１〜３のアルキル基及びビ
ニル基の中から選ばれ、 Ｒ２及びＲ３はる。ここでＲ
４及びＲ５は水素原子又はメチル、エチル、プロピル、
ブチル、イソブチル基などの炭素数１〜４のアルキル基
である。The silicon compound used in the present invention is a compound represented by the general formula CI) or the structural formula (n),
R1 in the general formula (+) is selected from a hydrogen atom, an alkyl group having 1 to 3 carbon atoms such as a methyl, ethyl, and propyl group, and a vinyl group, and R2 and R3 are represented. Here R
4 and R5 are hydrogen atoms or methyl, ethyl, propyl,
It is an alkyl group having 1 to 4 carbon atoms such as butyl or isobutyl group.
一般式（１）で表わされるケイ素化合物の具体例として
は、ビス（ジメチルアミノ）ジメチルシラン、ビス（ジ
メチルアミン）メチルビニルシラン、ビス（ｎ−ブチル
アミノ）ジメチルシラン、ビス（ジエチルアミノ）ジメ
チル７ラン、トリス（ジメチルアミノ）ンラン、ビス（
エチルアミノ）ジメチルシラン、ジエチルアミノジメチ
ルシラン。Specific examples of the silicon compound represented by the general formula (1) include bis(dimethylamino)dimethylsilane, bis(dimethylamine)methylvinylsilane, bis(n-butylamino)dimethylsilane, bis(diethylamino)dimethyl 7rane, Tris(dimethylamino)an, bis(
ethylamino)dimethylsilane, diethylaminodimethylsilane.
ジメチルアミノジメチルシランなどが挙げらｎる。Examples include dimethylaminodimethylsilane.
本発明において、前記式（１）又は（ＩＩ）で表わされ
るケイ素化合物を結合させる成形用型の材料としては、
例えば鋼、ニッケル、クロムなどの金属又はこれらの合
金やガラスなどが好適である。In the present invention, the material of the mold to which the silicon compound represented by formula (1) or (II) is bonded is as follows:
For example, metals such as steel, nickel, chromium, alloys thereof, glass, etc. are suitable.
これらの材料から成る成形用型の成形面に、前記式（１
）又は（ＩＩ）で表わさ扛るケイ素化合物と化学的に結
合させる方法としては、該化合物の蒸気を型の成形面に
接触させる方法と、該化合物を適当な浴剤に溶かした溶
液中に型を浸せきさせるか、該浴液を型の成形面に塗布
する方法などが用いられる。The above formula (1) is applied to the molding surface of a mold made of these materials.
) or (II), there are two methods for chemically bonding the compound to the molding surface of the mold: a method in which the vapor of the compound is brought into contact with the molding surface of the mold, and a method in which the compound is dissolved in a suitable bath agent to form the mold. Methods such as soaking the bath liquid or applying the bath liquid to the molding surface of the mold are used.
ケイ素化合物の蒸気を型の成形面と接触させる方法とし
ては、例えば密閉容器中に該成形用型を置き、乾燥気体
で密閉容器内を置換したのち、常圧又は減圧下に式（１
）又は（ロ）の化合物の蒸気を導入する方法、あるいは
密閉容器中に、該成形用型と式（１）又ｒ／″１（ＩＩ
）の化合物を乾燥気体雰囲気下、常圧又は減圧下に同時
に置く方法などを用いることができる。As a method of bringing the vapor of a silicon compound into contact with the molding surface of a mold, for example, place the mold in a closed container, replace the inside of the closed container with dry gas, and then apply the formula (1) under normal pressure or reduced pressure.
) or (b), or in a closed container, the mold and the formula (1) or r/″1(II
) can be simultaneously placed under dry gas atmosphere, normal pressure or reduced pressure, etc. can be used.
一万、ケイ素化合物被膜形成処理に溶剤を用いる方法と
しては、溶剤として、例えばｎ−へキサン、ベンゼン、
トルエンなどの炭化水素系溶剤、クロロホルム、四塩化
炭素、ジクロロメタンなどの塩素系溶剤、フロン１１３
などのフロン系溶剤、ジエチルエーテル、ジオキサン、
テトラヒドロフランなどのエーテル系溶剤、アセトン、
メチルエチルケトンなどのケトン系溶剤などを用い、こ
ｎらのＧ剤中に式（＋）又は（ＩＩ）で表わさｎるケイ
素化合物企Ｍ解して、該化合物０．０１−１０重量％を
含有する溶液を調製したのち、この溶液中に該成形用型
金浸せきするか、又は核型の成形面に前記溶液を塗布し
５次いで乾燥する方法が好ましい。10,000, as for the method of using a solvent in the silicon compound film forming treatment, examples of solvents such as n-hexane, benzene,
Hydrocarbon solvents such as toluene, chlorine solvents such as chloroform, carbon tetrachloride, dichloromethane, Freon 113
CFC solvents such as diethyl ether, dioxane,
Ether solvents such as tetrahydrofuran, acetone,
Using a ketone solvent such as methyl ethyl ketone, etc., a silicon compound represented by formula (+) or (II) is included in these G agents, and the compound is contained in an amount of 0.01 to 10% by weight. A preferred method is to prepare a solution and then immerse the mold into the solution, or to apply the solution to the molding surface of the core mold and then dry it.
このようにして、該成形用型の成形面に、式（１）又は
（■）で表わさｎるケイ素化合物の均質平滑な被膜が化
学結合によって形成さｒ、る。この被膜形成処理された
合成（り１脂成形用型は、圧縮成形、移送成形、射出成
形、注型など、いずれの成形方法においても使用するこ
とができる。In this way, a homogeneous and smooth coating of the silicon compound represented by formula (1) or (■) is formed on the molding surface of the mold by chemical bonding. This film-forming synthetic resin molding mold can be used in any molding method such as compression molding, transfer molding, injection molding, and casting.
発明の効果
本発明の合成樹脂成形用型は、成形面に化学結合した均
質で平滑なケイ素化合物被覆を有するため、合成樹脂成
形品の該型からの離型が極めて容易であり、かつ表面の
鏡面性が優れた成形品を与えることができる。そして、
本発明の成形用型は。Effects of the Invention Since the synthetic resin molding mold of the present invention has a uniform and smooth silicon compound coating chemically bonded to the molding surface, it is extremely easy to release the synthetic resin molded product from the mold, and the surface A molded article with excellent specularity can be obtained. and,
The mold for molding of the present invention is as follows.
特に密着性の大きいエポキシ四指、フェノール明哲、ウ
レタン！脂、ボ１ノエステル樹脂、ジアリールフタレー
トＩ’ｉ７４脂などの成形に好適である。Epoxy 4 fingers, phenol Meitetsu, and urethane with especially strong adhesion! It is suitable for molding fats, boroester resins, diaryl phthalate I'i74 fats, etc.
実施例
次に実施例Ｏてより本発明金さらに詳細に説明するが５
本発明は、こ扛らの例によってなんら限定さ扛るもので
はない。EXAMPLE Next, the present invention will be explained in more detail in Example O.
The present invention is not limited to these examples in any way.
実施例１
中性洗剤により十分洗浄し、乾燥した強化ガラス板（４
００Ｘ４００Ｘ１０ ｘｍ）を容積５ｏｔのポリエチ
レ／製の密閉容器に入れ、次いで、ビス（ジメチルアミ
ノ）ジメチルシラン約０．５２を入れたガラス製バブル
カウンター中に空気を通して、ビス（ジメチルアミン）
ジメチルシランを飽和させた空気を、前記密閉容器中に
導入した。約１時間抜ガラス板を取り出し、熱風炉中で
１００℃１時間加熱処理した。Example 1 A reinforced glass plate (4
00 x 400
Air saturated with dimethylsilane was introduced into the closed vessel. After about 1 hour, the glass plate was removed and heat-treated at 100° C. for 1 hour in a hot air oven.
このようにして処理されたガラス板２枚の間に、ポリ塩
化ビニル製のバッキングを挾んで注型用の型とし、この
中へＡＥＲ３３１（旭チバ肚裂、エポキ７１（１Ｋ”Ａ
Ｗ ）１００重量部、ヘキサヒドロフタル酸ｐ ｙｋ物
８０重量部、ベンジルメチルアミン０．５重量部・う・
ら成るエポキシ樹脂組成物を注入し、９０℃で２時間、
１４０℃で２時間硬ｆヒさせた。A polyvinyl chloride backing was sandwiched between the two glass plates treated in this way to form a casting mold, and AER331 (Asahi Ciba Guraku, Epoki 71 (1K”A
W) 100 parts by weight, 80 parts by weight of hexahydrophthalic acid pyk, 0.5 parts by weight of benzylmethylamine.
Inject an epoxy resin composition consisting of
Incubation was performed at 140° C. for 2 hours.
徐冷したのち、注型品を取り出したところ、注を品はガ
ラスを破損することなく、容易に離型し、その表面はガ
ラスの鏡面が正確に転写さｆ″Ｌ、曇りなどの欠陥は全
く認められなかった。When the cast product was taken out after slow cooling, it was found that the cast product was easily released from the mold without damaging the glass, and the mirror surface of the glass was accurately transferred to the surface, and there were no defects such as clouding. It was not recognized at all.
比）咬例
良く洗浄さｎた強化ガラスを用いて作成した注型用型を
用いる以外は、実施例１と同様にしてエポキシ樹脂組成
物を硬化させた。Comparison) The epoxy resin composition was cured in the same manner as in Example 1, except that a casting mold made of well-cleaned tempered glass was used.
注型品は離型が困難で、無理に離型しようとしたためガ
ラスは破損した。It was difficult to release the cast product from the mold, and an attempt to forcefully release the mold caused the glass to break.
実施例２〜５
実施例１におけるビス（ジメチルアミノ）ジメチルシラ
ンの代りに、ビス（ジメチルアミン）メチルビニルンラ
ン、ビス（ジエチルアミノ）ジメチルンラ／、トリス（
ジメチルアミノ）シラン、ジメチルアミノジメチルシラ
ンをそ１．ぞ汎用いる以外は、実施例１と全く同様にし
てテストしたところ、実施例１と同様に良好な結果が得
らｎた。Examples 2 to 5 Instead of bis(dimethylamino)dimethylsilane in Example 1, bis(dimethylamine)methylvinylene, bis(diethylamino)dimethyl/, tris(
dimethylamino)silane, dimethylaminodimethylsilane.1. A test was conducted in exactly the same manner as in Example 1, except for the general use, and good results were obtained as in Example 1.
実施例６
８０ｔのポリエチレン製密閉容器全乾燥空気で置換１〜
たのち、こｎにトルエン５０１とビス（ジメチルアミン
）ジメチルシランｏ、ｓｙ２入れ、この溶液中によく洗
浄した円盤庄駿用金型（ステンレス製表面ニッケルメッ
キ）を浸せきした。約５分後に金型を引き上げ、約１時
間ｊ虱乾したのち、約１５０℃で加熱処理した。この金
型を用いて実施例１と同様にしてエポキシ樹脂組成物を
硬化させたところ、金型の表面が良好に転写された注型
品が離型性よく得ら几た。Example 6 80t polyethylene sealed container Replaced with completely dry air 1~
Thereafter, toluene 501 and bis(dimethylamine)dimethylsilane O, SY2 were added to the solution, and a well-cleaned disc mold for Shoshun (stainless steel surface nickel plated) was immersed in this solution. After about 5 minutes, the mold was pulled out, dried for about 1 hour, and then heated at about 150°C. When the epoxy resin composition was cured using this mold in the same manner as in Example 1, a cast product with good transfer of the surface of the mold was obtained with good mold releasability.
実施例７
ビス（ジメチルアミノ）ジメチルシランの代りに１．１
，３，３，５．５−へキサメチルシクロトリンラザノを
用い、他は全〈実施例１と同様にして２枚のガラス板を
処理し、このガラス板を用いて合成樹脂成形用型を作製
した。Example 7 1.1 instead of bis(dimethylamino)dimethylsilane
, 3,3,5,5-hexamethylcyclothrine lazano, except for the following two glass plates were treated in the same manner as in Example 1, and the glass plates were used to form a mold for synthetic resin molding. was created.
この型を用いて、実施例１と同じ組成のエポキシ１１１
＠組成物を成形したところ、良好な離型性を示し、成形
品を表面には全く欠陥は認めら牡なかった。Using this mold, epoxy 111 having the same composition as in Example 1 was prepared.
When the composition was molded, it showed good mold releasability, and no defects were observed on the surface of the molded product.
Claims (1)
又はビニル基、Ｒ＿２及びＲ＿３はそれぞれ水素原子、
炭素数１〜３のアルキル基、ビニル基又は▲数式、化学
式、表等があります▼基、Ｒ＿４及びＲ＿５はそれぞれ
水素原子又は炭素数１〜４のアルキル基である） 又は、構造式 ▲数式、化学式、表等があります▼ で表わされるケイ素化合物を化学的に結合して形成した
被覆を有することを特徴とする合成樹脂成形用型。[Claims] 1. On the molding surface, there is a general formula ▲ mathematical formula, chemical formula, table, etc. atom,
Alkyl group having 1 to 3 carbon atoms, vinyl group, or ▲ numerical formula, chemical formula, table, etc. ▼ group, R_4 and R_5 each being a hydrogen atom or an alkyl group having 1 to 4 carbon atoms), or structural formula ▲ mathematical formula, There are chemical formulas, tables, etc. ▼ A mold for synthetic resin molding characterized by having a coating formed by chemically bonding silicon compounds represented by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1468286A JPS62173220A (en) | 1986-01-28 | 1986-01-28 | Mold for synthetic resin having silicon compound coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1468286A JPS62173220A (en) | 1986-01-28 | 1986-01-28 | Mold for synthetic resin having silicon compound coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62173220A true JPS62173220A (en) | 1987-07-30 |
Family
ID=11867980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1468286A Pending JPS62173220A (en) | 1986-01-28 | 1986-01-28 | Mold for synthetic resin having silicon compound coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62173220A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0284719U (en) * | 1988-12-20 | 1990-07-02 | ||
| EP0514817A2 (en) * | 1991-05-20 | 1992-11-25 | Nhk Spring Co., Ltd. | Manufacturing method of urethane foam molded products |
| EP1393874A1 (en) * | 2002-08-26 | 2004-03-03 | Shin-Etsu Chemical Co., Ltd. | Release agent for silicone rubber molding molds and molding method using said release agent |
| JP2009280158A (en) * | 2008-05-26 | 2009-12-03 | Kanto Auto Works Ltd | Sunroof device |
-
1986
- 1986-01-28 JP JP1468286A patent/JPS62173220A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0284719U (en) * | 1988-12-20 | 1990-07-02 | ||
| EP0514817A2 (en) * | 1991-05-20 | 1992-11-25 | Nhk Spring Co., Ltd. | Manufacturing method of urethane foam molded products |
| EP1393874A1 (en) * | 2002-08-26 | 2004-03-03 | Shin-Etsu Chemical Co., Ltd. | Release agent for silicone rubber molding molds and molding method using said release agent |
| US6841596B2 (en) | 2002-08-26 | 2005-01-11 | Shin-Etsu Chemical Co., Ltd. | Release agent for silicone rubber molding molds and molding method |
| JP2009280158A (en) * | 2008-05-26 | 2009-12-03 | Kanto Auto Works Ltd | Sunroof device |
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