JPS62169859A - Electrically conductive organic polymer molding and production thereof - Google Patents
Electrically conductive organic polymer molding and production thereofInfo
- Publication number
- JPS62169859A JPS62169859A JP61011456A JP1145686A JPS62169859A JP S62169859 A JPS62169859 A JP S62169859A JP 61011456 A JP61011456 A JP 61011456A JP 1145686 A JP1145686 A JP 1145686A JP S62169859 A JPS62169859 A JP S62169859A
- Authority
- JP
- Japan
- Prior art keywords
- electrically conductive
- polymer
- electrode
- molding
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000465 moulding Methods 0.000 title abstract description 14
- 229920000620 organic polymer Polymers 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 claims abstract description 22
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 21
- 239000011231 conductive filler Substances 0.000 claims abstract description 17
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 10
- -1 polyethylene Polymers 0.000 abstract description 8
- 239000004698 Polyethylene Substances 0.000 abstract description 5
- 229920000573 polyethylene Polymers 0.000 abstract description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003792 electrolyte Substances 0.000 abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 229920000128 polypyrrole Polymers 0.000 abstract description 2
- 229920000915 polyvinyl chloride Polymers 0.000 abstract description 2
- 239000004800 polyvinyl chloride Substances 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 abstract 1
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- 239000000835 fiber Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- QKFFSWPNFCXGIQ-UHFFFAOYSA-M 4-methylbenzenesulfonate;tetraethylazanium Chemical compound CC[N+](CC)(CC)CC.CC1=CC=C(S([O-])(=O)=O)C=C1 QKFFSWPNFCXGIQ-UHFFFAOYSA-M 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- SLGBZMMZGDRARJ-UHFFFAOYSA-N Triphenylene Natural products C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 SLGBZMMZGDRARJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 125000005580 triphenylene group Chemical group 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は従来の４電性フイラ一含有導電性高分子組成物
からなる成形物全改良した新規な有機導電性高分子成形
物とその製法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a novel organic conductive polymer molded product that is a complete improvement on the conventional molded product made of a conductive polymer composition containing a tetraelectric filler, and a method for producing the same. Regarding.
従来、芳香族化合物、例えばビロール類、チオフェン類
等の複素環式化合物、アズレン、ピレン、トリフェニレ
ン等の多環芳香族化合物は、電解質を含む溶液中で電解
酸化を行うことにより、電標基板上に有機導電性高分子
フィルムを形成できることが知られている。Conventionally, aromatic compounds, such as heterocyclic compounds such as virols and thiophenes, and polycyclic aromatic compounds such as azulene, pyrene, and triphenylene, have been oxidized on electrolyte substrates by electrolytic oxidation in a solution containing an electrolyte. It is known that organic conductive polymer films can be formed in
しかし、この様にして得られた有機導電性高分子フィル
ムは、機械的強度が弱いため破損し易く、また不溶、不
融で成形が困難であり、しかも製造上、電気伝導度の巾
をもたせることも困難であるという欠点がある。However, the organic conductive polymer film obtained in this way is easily damaged due to its weak mechanical strength, and is difficult to mold as it is insoluble and infusible.Moreover, it has to be manufactured with a range of electrical conductivity. The disadvantage is that it is also difficult.
これらの欠点を改善すべく、近年、電極上に高分子フィ
ルムを作製後、電解重合により芳香族高分子化合物を該
高分子フィルムに混入させる方法（ｔ￥ｆ開昭６０−１
７７５０６号公報）が知られているが、高分子フィルム
を電極基板上に形成させる必要があるため工業的には煩
雑であるし、又製造工程上肉厚物の成形品の製造が困難
で、実用的でないという欠点がある。In order to improve these drawbacks, in recent years a method has been developed in which a polymer film is prepared on an electrode and then an aromatic polymer compound is mixed into the polymer film by electrolytic polymerization (t￥f 60-1).
No. 77506) is known, but it is industrially complicated because it requires forming a polymer film on the electrode substrate, and it is difficult to manufacture thick molded products due to the manufacturing process. The drawback is that it is not practical.
このため工業的には、通常、導電性フィラーを高分子化
合物に練り込む等の方法で均質に混合した導電性高分子
組成物が採用され、各種の静電気対策、電磁波干渉シー
ルド対策、電極用等に活用されている。For this reason, in industry, conductive polymer compositions in which a conductive filler is homogeneously mixed by kneading a conductive filler into a polymer compound are usually adopted, and are used for various static electricity countermeasures, electromagnetic interference shielding countermeasures, electrodes, etc. It is used in
これらは実用的な方法であり、導電性フィラーを高充填
すればするほど、高導電性となるが、高充填すると機械
的物性、特に衝感強度、引張強度、伸度等が大巾に低下
するため、高導電性と優れた機械的物性の両者をあわせ
持つことが出来なかった。These are practical methods, and the higher the conductive filler filling, the higher the conductivity, but when the conductive filler is filled high, the mechanical properties, especially impact strength, tensile strength, elongation, etc., decrease significantly. Therefore, it was not possible to have both high electrical conductivity and excellent mechanical properties.
本発明者等は、この様な状況に鑑み鋭意検討した結果、
導電性フィラー含有４１！性高分子組成物を任意の形状
に成形してなる成形物を電極として用いて芳香族化合物
の電解重合を行い、該成形物に芳香系高分子化合物を混
入させると、機械的物性の低下なしに高導電性を有する
有機導電性高分子成形物が容易に得られることを見い出
し、本発明を完成するに至った。As a result of intensive study in view of this situation, the inventors of the present invention found that
Contains conductive filler 41! Electrolytic polymerization of an aromatic compound is carried out using a molded product obtained by molding a polymer composition into an arbitrary shape as an electrode, and when an aromatic polymer compound is mixed into the molded product, mechanical properties do not deteriorate. The present inventors have discovered that an organic conductive polymer molded article having high conductivity can be easily obtained, and have completed the present invention.
すなわち本発明は、
ｔ 導電性フィラー含有導電性高分子組成物からなる成
形物に電解重合により形成した高分子化合物が混入して
いることを特徴とする有機導電性高分子成形物、Ｚ 導
電性フィラー含有導電性高分子組成物からなる成形物を
電極として用いてｉｔ′ｗ４重合を行うことにより、芳
香族系高分子化合物を該成形物に混入させることを特徴
とする有機４′ｗｌ性高分子成形物の製法全提供するも
のである。That is, the present invention provides an organic conductive polymer molded article characterized in that a polymer compound formed by electrolytic polymerization is mixed into a molded article made of a conductive polymer composition containing a conductive filler; An organic 4'wl polymer characterized in that an aromatic polymer compound is mixed into the molded article by performing it'w4 polymerization using a molded article made of a filler-containing conductive polymer composition as an electrode. It provides a complete method for producing molecular moldings.
本発明で用いる導電性フィラー含有導電性高分子組成物
としでは、高分子化合物に導電性フィラーを組み合せ、
更に必要に応じて他の添加剤を加えて、該高分子化合物
の溶融、溶解等の状態で均一に混合してたものが挙げら
れる。The conductive filler-containing conductive polymer composition used in the present invention combines a conductive filler with a polymer compound,
Examples include those in which other additives are added as necessary and the polymer compound is uniformly mixed in a melted or dissolved state.
導電性フィシ−としては、例えば導電性カーボンブラッ
ク、グラファイト、金属粉末、金属繊維、導電性金属酸
化物、カーボン繊維、炭化ケイ素繊維、炭化ケイ素粉末
、金属コート繊維、金属コートビーズ、導電性ウィスカ
ー等が挙げられ、それぞれ単独あるいは２種以上組み合
せて用いることができる。Examples of the conductive fiber include conductive carbon black, graphite, metal powder, metal fiber, conductive metal oxide, carbon fiber, silicon carbide fiber, silicon carbide powder, metal coated fiber, metal coated beads, conductive whiskers, etc. These can be used alone or in combination of two or more.
また、高分子化合物としては、従来公知の熱可塑性樹脂
および熱硬化性樹脂がいずれも使用できるが、なかでも
２次成形や２次加工が容易な点で熱可塑性樹脂が好まし
く、例えばポリエチレン、ポリグロピレン、ポリ塩化ビ
ニル、スチレン−ブタジェン共重合体、人Ｓ樹脂、ＡＢ
８ｍ脂、ポリアミド、ポリアセタール、ポリカーボネー
ト、ポリエチレンテレフタレート、ポリブチレンテレフ
タレート、ポリフェニレンサルファイド、ポリフェニレ
ンエーテル、ポリサルホン、熱可塑性ポリウレタン等が
挙げられる。Furthermore, as the polymer compound, both conventionally known thermoplastic resins and thermosetting resins can be used, but thermoplastic resins are particularly preferred because they are easy to perform secondary molding and secondary processing, such as polyethylene and polyglopylene. , polyvinyl chloride, styrene-butadiene copolymer, human S resin, AB
Examples include 8m resin, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyphenylene ether, polysulfone, and thermoplastic polyurethane.
得られた導電性フィラー含有導電性高分子組成物は、射
出成形、押出成形、プレス成形、真空成形等の公知の成
形法により所望の形状、例えばフィルム状、シート状、
箱型、筒型等に成形し、一方の電極として用いる。The obtained conductive filler-containing conductive polymer composition is molded into a desired shape, such as a film, a sheet, etc. by a known molding method such as injection molding, extrusion molding, press molding, or vacuum forming.
It is formed into a box shape, cylinder shape, etc. and used as one electrode.
成形物中の導電性フィラーの含有量は、電解重合用電極
として使用できる程度の導電性を成形物に与える量であ
ればよく、特に限定されないが、成形品の表面抵抗値が
１０２〜１０１４Ωとなる様に高分子化合物と混合する
のが通常であシ、この４電性フイラーの含有量を調整す
ることにより、最終的に得られる有機４電柱高分子成形
物の導電性を容易に調整できる。The content of the conductive filler in the molded product is not particularly limited as long as it provides the molded product with a level of conductivity that can be used as an electrode for electrolytic polymerization, but it is sufficient that the molded product has a surface resistance value of 102 to 1014 Ω. It is usually mixed with a polymer compound so that the content of the tetraelectric filler increases, and by adjusting the content of this tetraelectric filler, the conductivity of the final organic four electric pole polymer molded product can be easily adjusted. .
本発明の有機導電性高分子成形物を得るには、上記の如
くして得られた成形物を一方の電極として用い、この電
極を対向電極と共に、電解重合用上ツマ−としての芳香
族系化合物と通電のための電解質とをアセトニトリル等
の有機溶媒中に溶解させた溶液中に入れ、通電すればよ
い。In order to obtain the organic conductive polymer molded article of the present invention, the molded article obtained as described above is used as one electrode, and this electrode is used together with the counter electrode as an aromatic polymer as an upper layer for electrolytic polymerization. The compound and an electrolyte for energization may be placed in a solution in an organic solvent such as acetonitrile, and then energized.
ここで電極として用いた成形物が肉厚の場合は、主とし
て表面層に芳香族系高分子化合物が混入し、高い表面導
電性を有する均質な成形品が得られることになシ、逆に
肉薄の場合は芳香族系高分子化合物が内部まで混入した
高導電性の均質な成形品が得られることになる。尚、条
件によ）芳香族系高分子化合物の一部を成形物に混入さ
せずに、その表面上に積層させることもできる。If the molded product used as an electrode is thick, the aromatic polymer compound will be mixed mainly in the surface layer, and a homogeneous molded product with high surface conductivity will not be obtained; In this case, a highly conductive, homogeneous molded product in which the aromatic polymer compound is mixed into the interior will be obtained. Note that (depending on the conditions) a part of the aromatic polymer compound may be layered on the surface of the molded product without mixing it into the molded product.
この様にして得られた本発明の有機導電性高分子成形物
は、次いで必要に応じて２次成形、２次加工等を行うが
、ポリエチレン等の熱可塑性樹脂を用いてなる成形物は
、積層成形、プレス成形、真空成形、圧空成形等による
２次成形や切削等の２次加工が容易であり、好ましい。The organic conductive polymer molded product of the present invention thus obtained is then subjected to secondary molding, secondary processing, etc. as necessary, but molded products made of thermoplastic resin such as polyethylene are Secondary processing such as secondary forming and cutting by lamination molding, press molding, vacuum forming, pressure forming, etc. is easy, and therefore preferred.
本発明の製法によ）得られる有機導電性高分子成形物は
、導電性フィラー含有導電性高分子組成物のみからなる
従来の導電性成形物に比べて導電性フィラーの含有量が
少なくても良いため、機械的物性の低下がなく、しかも
芳香族系高分子化合物が混入しているため導電性にも優
れる。また、ポリエチレン等の熱可塑性樹脂を用いてな
る本発明の成形物は２次成形や２次加工が容易であると
いう利点を有する。The organic conductive polymer molded product obtained by the production method of the present invention has a lower content of conductive filler than conventional conductive molded products made only of conductive filler-containing conductive polymer compositions. Because of its good properties, there is no deterioration in mechanical properties, and since it contains an aromatic polymer compound, it also has excellent conductivity. Further, the molded article of the present invention made of a thermoplastic resin such as polyethylene has the advantage that secondary molding and secondary processing are easy.
以下に実施例および比較例を示して本発明を更に具体的
に説明する。The present invention will be explained in more detail by showing Examples and Comparative Examples below.
実施例１
ポリエチレン７７部と導電性カーボンブラック２３部を
１５０℃の２本ロールで配合後、１５分間混練した後、
シート状に取り出し、次いで２００℃、ｓｏ１Ｋｇ／ｆ
ｆｌの条件でプレス成形して厚さ１ｆｉのプレスシート
を得た。このプレスシートの表面抵抗値はＩ Ｘ １０
’Ωであった。Example 1 After blending 77 parts of polyethylene and 23 parts of conductive carbon black with two rolls at 150°C, kneading for 15 minutes,
Take out in sheet form, then 200℃, so1Kg/f
A press sheet having a thickness of 1 fi was obtained by press forming under the conditions of fl. The surface resistance value of this press sheet is I x 10
'Ω was.
このプレスシートを電極として、アセトニトリルとメチ
ルエチルケトン１：１の混合溶媒にテトラエチルアンモ
ニウムｐ−トルエンスルホネート塩をｃＬ３モル／ｊの
割合で、またビロールを１モル／ｌの割合で溶解させた
電解液に白金製対向電極と共に入れ、１．６■の電圧で
３０分間通電して電解重合を行い、黒色のポリピロール
が均一に混入した光沢のある有機４’＊性シートを得た
。Using this press sheet as an electrode, platinum was added to an electrolytic solution prepared by dissolving tetraethylammonium p-toluenesulfonate salt at a ratio of cL3 mol/j in a mixed solvent of acetonitrile and methyl ethyl ketone 1:1, and virol at a ratio of 1 mol/l. A counter electrode made of aluminum alloy was placed therein, and electricity was applied for 30 minutes at a voltage of 1.6 .mu. to perform electrolytic polymerization, thereby obtaining a glossy organic 4'* sheet in which black polypyrrole was uniformly mixed.
このシートは、表面抵抗値がＩ Ｘ Ｉ Ｄ２Ω、引張
強さが１、ｓ′に９／ｃｄ、伸びが５１０％であり、導
電性および機械的物性に優れるものであった。This sheet had a surface resistance value of I X I D2Ω, a tensile strength of 1, s' of 9/cd, and an elongation of 510%, and was excellent in electrical conductivity and mechanical properties.
尚、表面抵抗値、引張強妊および伸びの測定は以下の如
く行った。Incidentally, the surface resistance value, tensile strength and elongation were measured as follows.
表面抵抗値：テスター〔例えば■三和計器製作所製Ｓ＃
ＡＯＸ−５０５金マルチテスター〕の電極を１ｃＷＬの
間隔で成形物の表面に接着させて抵抗値を測定した。Surface resistance value: Tester [For example, Sanwa Keiki Seisakusho S#
The resistance value was measured by adhering the electrodes of AOX-505 gold multi-tester to the surface of the molded product at intervals of 1 cWL.
引張強さおよび伸び：ＡＳＴＭ Ｄ−６３８に準拠し
て測定した。Tensile strength and elongation: Measured according to ASTM D-638.
実施例２
粉末状ナイロン−６９０部中にととり法で切削された８
μｍのステンレス繊維１０部を混合した後、２６０℃の
押出機により混練し、ペレット化した。次いで２５０℃
の射出成形機を用いて８０Ｘ１５０Ｘ２ｍｓ＋の平板を
得た。この平板の表面抵抗値はｌＸ１０’Ωであった。Example 2 Powdered nylon - 8 pieces cut by Totori method into 690 parts
After mixing 10 parts of μm stainless steel fibers, the mixture was kneaded using an extruder at 260° C. and pelletized. Then 250℃
A flat plate of 80 x 150 x 2 ms+ was obtained using an injection molding machine. The surface resistance value of this flat plate was 1×10′Ω.
この平板を電極として、テトラエチル統夕阜ニウムｐ
−トルエンスルホネート塩を（１３モル／ｌの割合で、
またピロールを１モル／ｌの割合でアセトニトリルとエ
チレングリコール９：１の混合溶媒に溶解させた電解液
に白金対向電極と共に入れ、ｔＳＶの電圧で３０分間通
電して電解重合を行い、黒色のポリピロールが表面層に
均一に混入した有機導電性平板を得た。Using this flat plate as an electrode, tetraethyl sodium p
- toluenesulfonate salt (at a rate of 13 mol/l,
In addition, pyrrole was dissolved in an electrolytic solution of 1 mol/l in a mixed solvent of acetonitrile and ethylene glycol 9:1 together with a platinum counter electrode, and electrolytic polymerization was performed by applying current at a voltage of tSV for 30 minutes. An organic conductive flat plate was obtained in which the surface layer was uniformly mixed with.
この平板は、表面抵抗値が５Ｘ１０．”Ω、アイゾツト
衝翳強度が５．０ゆ・偶４− 曲げ弾性率が２α０００
ｋｇ／ｃｄであシ、導電性および機械的物性に優れる
ものであった。This flat plate has a surface resistance value of 5X10. ”Ω, Izot impact strength is 5.0 Y・Even 4- Bending elastic modulus is 2α000
kg/cd, excellent conductivity and mechanical properties.
尚、アイゾツト衝撃強度はＡＳ’ｒＭ Ｄ−２５６に
、また曲げ弾性率はＡＳＴＭ Ｄ−７９０にそれぞれ
準拠して測定し九代理人 弁理士 高 橋 勝 利
手続補正４！：（自発）
昭和６２年１月−２日The Izot impact strength was measured in accordance with AS'rM D-256, and the flexural modulus was measured in accordance with ASTM D-790. : (Voluntary) January-2, 1985
Claims (1)
形物に電解重合により形成した芳香族系高分子化合物が
混入していることを特徴とする有機導電性高分子成形物
。 ２ 導電性フィラー含有導電性高分子組成物からなる成
形物を電極として用いて電解重合を行うことにより、芳
香族系高分子化合物を該成形物に混入させることを特徴
とする有機導電性高分子成形物の製法。[Scope of Claims] 1. An organic conductive polymer molded article characterized in that an aromatic polymer compound formed by electrolytic polymerization is mixed into a molded article made of a conductive polymer composition containing a conductive filler. . 2. An organic conductive polymer characterized in that an aromatic polymer compound is mixed into a molded product by performing electrolytic polymerization using a molded product made of a conductive polymer composition containing a conductive filler as an electrode. Manufacturing method for molded products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61011456A JPS62169859A (en) | 1986-01-22 | 1986-01-22 | Electrically conductive organic polymer molding and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61011456A JPS62169859A (en) | 1986-01-22 | 1986-01-22 | Electrically conductive organic polymer molding and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62169859A true JPS62169859A (en) | 1987-07-27 |
Family
ID=11778594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61011456A Pending JPS62169859A (en) | 1986-01-22 | 1986-01-22 | Electrically conductive organic polymer molding and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62169859A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093035A (en) * | 1988-02-13 | 1992-03-03 | Bayer Aktiengesellschaft | Conductive polyarylenesulphide mixtures containing carbon |
| WO1997013257A1 (en) * | 1995-10-04 | 1997-04-10 | A. Schulman Gmbh | Polymer-based composition and process for its preparation |
| CN103467937A (en) * | 2013-09-22 | 2013-12-25 | 江苏启弘新材料科技有限公司 | Wave-absorbing radiation-resistant functional master batches and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177506A (en) * | 1984-02-24 | 1985-09-11 | 日本電信電話株式会社 | Conductive polymer film and method of producing same |
| JPS60257235A (en) * | 1984-06-04 | 1985-12-19 | 日本電信電話株式会社 | Conductive high-molecular film and manufacture thereof |
| JPS613742A (en) * | 1984-06-18 | 1986-01-09 | 日本電信電話株式会社 | Conductive high-molecular sheet and manufacture thereof |
-
1986
- 1986-01-22 JP JP61011456A patent/JPS62169859A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60177506A (en) * | 1984-02-24 | 1985-09-11 | 日本電信電話株式会社 | Conductive polymer film and method of producing same |
| JPS60257235A (en) * | 1984-06-04 | 1985-12-19 | 日本電信電話株式会社 | Conductive high-molecular film and manufacture thereof |
| JPS613742A (en) * | 1984-06-18 | 1986-01-09 | 日本電信電話株式会社 | Conductive high-molecular sheet and manufacture thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093035A (en) * | 1988-02-13 | 1992-03-03 | Bayer Aktiengesellschaft | Conductive polyarylenesulphide mixtures containing carbon |
| WO1997013257A1 (en) * | 1995-10-04 | 1997-04-10 | A. Schulman Gmbh | Polymer-based composition and process for its preparation |
| CN103467937A (en) * | 2013-09-22 | 2013-12-25 | 江苏启弘新材料科技有限公司 | Wave-absorbing radiation-resistant functional master batches and preparation method thereof |
| CN103467937B (en) * | 2013-09-22 | 2015-12-23 | 江苏启弘新材料科技有限公司 | Inhale ripple radiation proof function master batch and preparation method thereof |
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