JPS62168672A - Soldering device - Google Patents

Abstract

PURPOSE:To execute soldering of a printed circuit board which has installed chip parts to both faces, by providing a carrying chain of the printed circuit board in a device, and also, providing a means for executing a liquid-cut and a discharge of a thermal transition liquid on a chain guide, etc. CONSTITUTION:A carrying chain 42 provided with a holding claw 45 for holding a printed circuit board 11 freely attachably and detachably is provided in a vapor phase soldering type soldering device. In this case, a notch part for executing a liquid-cut of a thermal transition liquid is provided on a chain guide 43 for guiding the chain 42, and also, a discharge hole 48 is formed in a guide rail 44 which has been attached to the chain guide 43. vapor sticking to the chain 42 condenses and becomes the thermal transition liquid, brought to a liquid-cut by a notch part 47 and discharged from the discharge hole 48 of the guide rail 44, and collected. In this way, since the carrying chain 42 can be used, both faces of the printed circuit board 11 can be soldered simultaneously.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a paper phase soldering type soldering device equipped with a conveyance chain that is attached to a holding claw that removably holds a printed circuit board and conveys it. It is.

[Conventional technology]

FIG. 3 is a front view showing an example of a conveyance chain and holding claws used in a conventional carrierless soldering device, in which 1 is a printed circuit board, 2 is an electronic component, and 3 is an electronic component that is pushed through the printed circuit board 1. Lead wire of part 2, 4 is conveyance chain, 5
6 is a rod attached to the conveyance chain 4, 6 is a holding claw attached to the lower end of the rod 5 and holds the side edge 1a of the printed circuit board 1, 7 is a solder bath, and 8 is a solder melt.

[Problem that the invention seeks to solve]

By the way, in the conventionally used conveyance chain 4 as shown in FIG. 3, the holding claws 6 are made longer and separated from the printed circuit board 1 in order to reduce the influence of heat on the conveyance chain 4. For this reason, I recommend that this conveyor chain 4 be attached to a paper phase soldering type soldering device! The inlet and outlet of the attaching device have been enlarged to accommodate heat transfer liquid (e.g. 70Lina-1, which is a fluorine-based inert liquid).
: Trademark name of Sumitomo 3M Limited) is discharged to the outside in a large amount, and a large amount of heat transfer liquid adheres to the conveying chain 4 and holding claws 6, which is discharged as is, which is uneconomical. Gaa tko. Also, conventional paper phase soldering type soldering using a belt conveyor
In the mounting device, in order to place the printed circuit board on the belt conveyor, the top and bottom surfaces of the printed circuit board 1 are coated with paste in advance and the chip components are attached. Gabe,
rL1□Since it comes into contact with the conveyor, the amount of contact with the steam is reduced, so the solder paste is not melted sufficiently, and the position of the chip components is shifted due to vibrations generated while the belt conveyor is running, so the lower surface There was also the problem that the printed circuit board on which the deep parts were attached could not be used on the side. Furthermore, since a belt conveyor is used, there are problems such as the printed circuit board cannot be automatically transferred to the devices before and after the soldering device.

This invention was made in order to solve the above-mentioned problems.The shape of the conveying chain is made small to minimize the amount of heat transfer liquid vapor discharged, so that the vapor can be recovered as much as possible. It is an object of the present invention to automatically transfer a printed circuit board to a device before or after the device in the running direction.

[Means for solving problems]

The soldering device according to the present invention includes a conveyance chain that moves along a conveyance path of a printed circuit board, a holding claw provided on the conveyance chain that detachably holds the printed circuit board, a chain guide that guides the conveyance chain, and a conveyance chain that moves along a conveyance path of a printed circuit board. Attached to chain (7
A notch is formed in the chain guide to drain the heat transfer liquid, and the chain guide is fixed to the guide rail.
The guide rail 1/B is equipped with a discharge hole formed in the guide rail in order to discharge the heat transfer liquid stored in the rail to the heating liquid tank.

[Effect]

In the invention of B, a bullet board to which solder paste has been applied in advance and chip components are mounted is mounted on a holding claw, and the solder paste is melted by sufficiently applying steam to both the upper and lower surfaces of the printed board. In addition, the heat transfer liquid produced by condensation of steam adhering to the conveyor chain is drained at the notch of the chain guide and falls into the guide rail, and the heat transfer liquid accumulated in the guide rail is removed from the discharge hole. It is discharged into each passage and returned to the heated liquid tank for recovery.

〔Example〕

FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 (
, ) is a sectional view taken along line I-I in Figure 1, and Figure 2 (b
) is a sectional view taken along the line ■-■ in Figure 2(a), and Figure 2(e
) is a sectional view taken along line I-1 in FIG. 2(a).

In these figures, 11 is a printed circuit board, 12 is a chip component, 13 is a solder base l-121 which is applied to the printed circuit board 11 in advance, 121 is a soldering device, 22 is a heating liquid tank, 231 is a heat transfer liquid, and 23a is the aforementioned solder base l-121 is a soldering device; Heat transfer liquid 2
3 is steam, 24 is a heater, and 25 is an inner tank provided inside the heated liquid tank 22, with bent portions 25a and 25b formed above. Note that the bent portion 25a is bent so as to protrude in a direction perpendicular to the direction of travel of the printed circuit board 11 (in the direction of the arrow). Further, a through hole 25C is formed below the inner tank 25, through which the heat transfer liquid 23 in the heating liquid tank 22 flows. 26 is a loading port for the printed circuit board 11; 27
28 is the carry-in side passage, 28 is the carry-out side passage, 29 is the carry-out side passage, and the lower surface of each passage #527. Numerals 30 to 36 are coolers for condensing the steam 23a, and 37 and 38 are branched diagonally downward from respective predetermined positions of the passages 27 and 29 and are connected to the heating liquid tank 22 downward. It is an inclined passage. 39.40 is a steam guide plate for the steam 23a provided at the carry-in port 26 and the carry-in port 28. This is provided to recover the steam 231 discharged from the carry-out [128] without discharging it to the outside. Reference numeral 41 denotes a cover provided on a part of the soldering device 21, and is for collecting the steam 23a from the steam guide plates 39, 40.

42 (i) a conveyance chain that moves along the conveyance path of the Golino 1-board 11; 43 (Yo-chain guide; 44 a guide rail to which the chain guide 43 is fixed; 45 a removable carriage on which the Blit board 11 is placed); A 5-shaped holding claw 46 is held by the holding claw 45 and is a stopper for positioning the plate 1 and the substrate 11. 47 is a notch formed in the chain guide 43, and a stopper 47 is a notch formed in the chain guide 43 to prevent the transfer element 42 from steaming. 2
Thermal transition where 3n adheres and liquefies? r! i, 23 lfk
It is for cutting. 48 is the guide 1.・
- The heat transfer liquid 23 accumulated in the channel 44 is transferred to the carry-in side channel 27. This is a discharge hole for discharging to the discharge side passage 29.

In addition, the cooler 3o is located on the inner periphery of the heating liquid tank 22, and the conveyor chain 4
It is located above 2. Cooler 31 is heated liquid tank 22
It is provided on the inner periphery of the conveyor chain 42 and below the conveying chain 42 at approximately the same level as the bent portion 25b of the inner tank 25 or the inclined passage 37°38. The cooler 32 is installed obliquely along the inclined passages 37 and 38. Cooler 33, 34, 35,
36 is provided on the outer periphery of each passage 27, 29.

In the soldering apparatus configured as described above, the printed circuit board 11 is held by the holding claws 45 and transported by the transport chain 42, and the solder paste 13 is melted by the vapor 238 of the heat transfer liquid 23 heated by the heater 24. After that, the chip component 12 is carried out and then cooled to solidify and the chip component 12 is fixed to the printed circuit board 11, thereby completing the mounting.

On the other hand, the heated steam 238 rises inside the inner tank 25, melts the solder paste 13, and is then cooled and condensed in the cooler 32, forming droplets from between the cooler 30 and the outside of the inner tank 25. It drips. In addition, the conveyor chain 4 is in the heating liquid tank 22.
The steam 23a accumulated below 1126. Flow rf in the direction of the outlet 28
TJJI, Ta Steam 23a 1. be cooled down with a cooler.

In addition, the steam 23a that adheres to the conveyance chain 42 condenses and becomes the heat transfer liquid 23 and is conveyed by the conveyance chain 42, but the liquid is drained at the notch 47 of the chain guide 43, flows into the guide rail 44, and is discharged. The heat transfer liquid 23 is discharged from the hole 47 to the inclined surfaces 27a and 29a of the passages 27 and 29, and the heat transfer liquid 23 accumulated on the inclined surfaces 27a and 29a flows further downward and passes through the inclined passages 37 and 38 to the heating liquid tank 22. Return.Furthermore, the steam 2 remaining near the loading port 26 and the discharge port 28
3a enters the cover 41 through the steam guide plates 39 and 40, and is recovered by a recovery means (not shown).

〔Effect of the invention〕

As explained above, the invention of B includes a conveyance chain that moves along the conveyance path of a printed circuit board, a holding claw provided on the conveyance chain that removably holds the printed circuit board, and a chain guide that guides the conveyance chain. , a notch formed in the chain guide to drain the heat transfer liquid adhering to the conveyance chain, a guide rail to which the chain guide is fixed, and a heat transfer liquid stored in the guide 1/-rail to be heated. Equipped with a discharge hole formed in the guide rail for discharging into the tank,
A conventionally commonly used conveyor chain can be used in a paper phase soldering type soldering device. Therefore, the lower surface of the printed circuit board can receive sufficient steam, and therefore it is possible to solder the printed circuit board with chip components mounted on the upper and lower surfaces of the printed circuit board.

Furthermore, by using a conveyor chain, it has become possible to automatically transfer printed circuit boards back and forth in the running direction of the soldering device. Furthermore, since most of the used steam can be recovered, there is almost no need to replenish expensive heat transfer liquid, which is economical, and has the advantage of reducing product costs by one level.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 (
a) is a sectional view taken along line T-I in Figure 1, Figure 2(b) is a sectional view taken along line II-II in Figure 2(,), and Figure 2(c) is a sectional view taken along line II-II in Figure 2(a).
1 is a sectional view taken along the line II in FIG. 2(a), and FIG. 3 is a front view showing an example of a conventional conveyance chain and holding claw. In the figure, 11 is a printed circuit board, 12 is a chip component, 13 is a solder paste, 21 is a soldering device, 22 is a heating liquid tank, 23 is a heat transfer liquid, 23a is steam, 24 is a peak, 2
5 is an inner tank, 26 is a carry-in 1], 27 is a carry-in side passage, 27a
, 29a is an inclined surface, 28 is an IR outlet, 29 is a discharge side passage, 30 to 36 are coolers, 37 and 38 are inclined passages, 42 is a conveying die, 43 is a chain guide, and 44 is a guide 1.・
45 is a holding claw, 46 is a collar, 47 is a notch, and 48 is a discharge hole.

Claims (1)

[Claims] a heating liquid tank that stores a heat transfer liquid having a boiling point higher than the melting point of the solder paste applied to the printed circuit board in advance, and melts the solder paste of the printed circuit board with the steam generated by heating the heat transfer liquid; A paper-phase soldering type solder consisting of an input side passage and an output side passage connected to the heating liquid tank and serving as a conveyance path for the printed circuit board, and a cooler provided above the heating liquid tank to cool the vapor. The attaching device includes a conveyance chain that moves along the conveyance path of the printed circuit board, a holding claw provided on the conveyance chain that detachably holds the printed circuit board, a chain guide that guides the conveyance chain, and a chain guide that guides the conveyance chain. A notch formed in the chain guide to drain the heat transfer liquid adhering to the chain, a guide rail attached to the chain guide, and a heat transfer liquid generated by cooling the steam in the guide rail. and a discharge hole formed in the guide rail for discharging the heated liquid into the heated liquid tank.