JPS62165849U

JPS62165849U -

Info

Publication number: JPS62165849U
Application number: JP1986052529U
Authority: JP
Priority date: 1986-04-08
Filing date: 1986-04-08
Publication date: 1987-10-21

Description

[Brief explanation of the drawing]

第１図ａはターンテーブル上のプレートを押圧
する、本考案のトツプリングの一部断面図を、ｂ
はゴミをはさんだときの一部断面図を、第２図は
ウエハーを貼付したプレートの斜視図を、第３図
ａはターンテーブル上のプレートを押圧する一つ
の従来法トツプリングの一部断面図を、ｂはゴミ
をはさんだときの一部拡大断面図を、第４図はタ
ーンテーブル上のプレートを押圧する他の従来法
トツプリングの一部断面図を示す。１…ウエハー、２…プレート、３…ターンテー
ブル、４，４′，４″…トツプリング、５…管、
６…砥液または研磨液、７…クロス、８…異物、
９…注水管、１０…排水管、１１…弾性シートリ
ング、１２…一点鎖線、１３…弾性中空体。 Figure 1a is a partial sectional view of the top ring of the present invention, which presses the plate on the turntable, and b
Figure 2 is a perspective view of a plate with a wafer attached to it, and Figure 3a is a partial cross-section of a conventional top spring that presses a plate on a turntable. In the figure, b shows a partially enlarged sectional view when dust is sandwiched, and FIG. 4 shows a partially sectional view of another conventional top spring for pressing a plate on a turntable. 1... Wafer, 2... Plate, 3... Turntable, 4, 4', 4''... Top ring, 5... Tube,
6... Abrasive liquid or polishing liquid, 7... Cloth, 8... Foreign matter,
9... Water injection pipe, 10... Drain pipe, 11... Elastic seat ring, 12... Dot chain line, 13... Elastic hollow body.

Claims

[Scope of utility model registration request]

A top ring for a wafer polishing apparatus, characterized in that the pressing surface is provided with an elastic hollow body that matches the shape of the pressing surface of the top ring and can accommodate liquid or gas.