JPS6216515A - Monitoring device for plasma treating device - Google Patents

Monitoring device for plasma treating device

Info

Publication number
JPS6216515A
JPS6216515A JP15518885A JP15518885A JPS6216515A JP S6216515 A JPS6216515 A JP S6216515A JP 15518885 A JP15518885 A JP 15518885A JP 15518885 A JP15518885 A JP 15518885A JP S6216515 A JPS6216515 A JP S6216515A
Authority
JP
Japan
Prior art keywords
gate
laser beam
plasma
sampler
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15518885A
Other languages
Japanese (ja)
Inventor
Yutaka Matsumi
松見 豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP15518885A priority Critical patent/JPS6216515A/en
Publication of JPS6216515A publication Critical patent/JPS6216515A/en
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To enable detecting and monitoring operations with sufficient sensitivity by to be performed a method wherein the fine grains located in a plasma treating device are monitors using the monitoring device having a laser- introducing means, a detector with which a laser beam is detected and a gate sampler. CONSTITUTION:A photo detector 7 is connected to a gate sampler 8, and the signal sent from the photo detector 7 is gate-sampled by the gate sampler 8 in synchronization with a pulse-like laser beam and in line with the time duration of the laser beam. To be more precise, the pulse-like laser A, which passed through a plasma processing device 1 and advanced straight without receiving the scattering by the fine grains, is received by the light-receiving device 9 provided outside the plasma processing device 1, and the gate signal B corresponding to the time duration of the received pulse-like laser beam is fed to the gate sampler 8 by the light-receiving device 9. The signal C sent from the photo detector 7 is gate-sampled by the gate sampler 8 in accordance with said gate signal. The output signal obtained by the gate sampler 8 is normally recorded in a recording device.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体装置の成膜工程等に用いられるプラズ
マ装置内の微粒子を検出、監視するための装置に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a device for detecting and monitoring particulates in a plasma device used in the film forming process of semiconductor devices.

従  来  の  技  術 半導体装置の成膜工程等に用いられるプラズマ装置にお
いては、成膜工程中にプラズマ装置内に微粒子が発生し
、その微粒子が処理中の基板表面に付着して基板に悪影
響を及ぼす場合があるため、プラズマ装置内の微粒子を
監視する必要がある。
Conventional technology In plasma equipment used in the film forming process of semiconductor devices, fine particles are generated within the plasma equipment during the film forming process, and these fine particles adhere to the surface of the substrate being processed and have an adverse effect on the substrate. Therefore, it is necessary to monitor particulates in the plasma device.

すなわち、成膜速度を上げるために、より高いRF電力
を用いてプラズマ密度を高めると、成膜すべき基板に向
う分子同志が基板に到達する前に衝突し合って形成され
る微粒子の数が増加し、これらの微粒子が基板上に付着
することになる。形成される微粒子の数は主としてプラ
ズマ密度に依存するため、微粒子の数を測定することに
よって、プラズマ装置内のプラズマ状態を制御すること
が可能となる。
In other words, if the plasma density is increased by using higher RF power in order to increase the deposition rate, the number of particles formed by molecules heading towards the substrate to be deposited colliding with each other before reaching the substrate will be reduced. and these fine particles will adhere to the substrate. Since the number of fine particles formed depends primarily on the plasma density, by measuring the number of fine particles it is possible to control the plasma state within the plasma device.

ところで、従来、気相中の微粒子の測定には、顕微鏡法
、重力沈澱法、遠心沈降法、慣性法、電気移動度法、拡
散法、凝縮核法、光散乱法等があるが、半導体装置の成
膜工程等では、一般に、Hc−Naレーザ等の時間的に
連続して発振するレーザを光源として用いて微粒子によ
る散乱を検出する方法が用いられている。
By the way, conventional methods for measuring fine particles in the gas phase include microscopy, gravity sedimentation, centrifugal sedimentation, inertial method, electric mobility method, diffusion method, condensation nucleus method, and light scattering method. In the film forming process, etc., a method is generally used in which a laser that oscillates continuously over time, such as an Hc-Na laser, is used as a light source and scattering by fine particles is detected.

この方法をプラズマ装置内の微粒子の検出、監視に適用
すると、プラズマ自体からの強い発光のため微粒子によ
るレーf散乱光を感度よく検出づることは不可能である
When this method is applied to detecting and monitoring particulates in a plasma device, it is impossible to sensitively detect the laser beam scattered by the particulates due to strong light emission from the plasma itself.

発明が解決しようとする問題点 このように、He−Neレーザ等の時間的に連続して発
振するレーザ光線を用いて微粒子による散乱を検出づる
方法は、プラズマ装置内の微粒子の検出、監視に適用し
た場合には、プラズマの発光のため十分な分解能をもっ
てプラズマ装置内の微粒子を検出することができないと
いう問題がある。
Problems to be Solved by the Invention As described above, the method of detecting scattering by particles using a laser beam that oscillates continuously in time, such as a He-Ne laser, is not suitable for detecting and monitoring particles in a plasma device. When applied, there is a problem that particles within the plasma device cannot be detected with sufficient resolution due to the light emission of the plasma.

そこで、本発明の目的は、従来のレーザ光線による微粒
子の検出方法を改良してプラズマ装置内の微粒子を十分
な感度で検出、監視できるようにしたプラズマ装置用監
視装置を提供することにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a monitoring device for a plasma device that improves the conventional method of detecting particles using a laser beam and is capable of detecting and monitoring particles in the plasma device with sufficient sensitivity.

問題点を解決するだめの手段 上記の目的を達成するために、本発明によるプラズマ装
置用監視装置は、プラズマ装置内にパルス状に発振する
レーザ光線を導入するレーザ導入手段と、プラズマ装置
内の微粒子によって散乱されたシー1f光線を検出する
検出器と、上記パルス状レーザ光線に同期させて上記検
出器からの信号をリーン1リングするグー1〜サンプラ
とを有し、プラズマ装置内の微粒子を監視できるように
したことを特徴としている。
Means for Solving the Problems In order to achieve the above object, the monitoring device for a plasma device according to the present invention includes a laser introducing means for introducing a pulsed laser beam into the plasma device, and a laser beam introducing a pulsed laser beam into the plasma device. It has a detector that detects the C1f light scattered by the fine particles, and a sampler that performs lean-one ringing of the signal from the detector in synchronization with the pulsed laser beam, and detects the fine particles in the plasma device. It is characterized by being able to be monitored.

本発明において使用されるレーザとしてはY△Gレーザ
、窒素レーザ、パルス色素レーザ等が用いられ得る。
As the laser used in the present invention, a YΔG laser, a nitrogen laser, a pulsed dye laser, etc. can be used.

作          用 このように構成した本発明のプラズマ装置用監視装置に
おいては、プラズマ装置内の微粒子によって散乱された
レーザ光線は、検出器およびゲート装設を通してパルス
状レーザ光線と同期してその時間幅に合せて、プラズマ
自体内のプラズマ発光の影響を受けずに検出され得る。
Function: In the monitoring device for a plasma device of the present invention configured as described above, the laser beam scattered by the particles in the plasma device is synchronized with the pulsed laser beam through the detector and the gate device, and its time width is In addition, it can be detected without being affected by plasma emission within the plasma itself.

こうして検出された出力信号は、プラズマ装置内のプラ
ズマ状態を監視、制御するのに用いられ得る。
The output signal thus detected can be used to monitor and control plasma conditions within the plasma device.

以下、添附図面を参照して本発明の実施例について説明
する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

第1図には本発明によるプラズマ装置用監視装置の構成
を示し、1はプラズマプロセス装置であり、2はレーザ
導入手段を構成しているレーザ装置で、このレーザ装置
2は、例えば数10ナノ秒以下の時間幅をもつパルス状
レーザ光線を発生する。
FIG. 1 shows the configuration of a monitoring device for a plasma device according to the present invention, where 1 is a plasma processing device, and 2 is a laser device constituting a laser introduction means. Generates a pulsed laser beam with a duration of less than a second.

このパルス状レーザ光線は図面に矢印3で示すようにプ
ラズマプロセス装置1の図示してない光導入窓を通って
プラズマプロセス装@1内に入り、。
This pulsed laser beam enters the plasma processing apparatus @ 1 through a light introduction window (not shown) of the plasma processing apparatus 1 as indicated by an arrow 3 in the drawing.

そして同様に図示してない光導出窓から出て行く。Similarly, the light exits through a light exit window (not shown).

符号4はプラズマプロセス装置1内に存在する微粒子に
よって散乱された光線を表わし、この散乱光線4は集光
レンズ5にJ:って集光され、分光器またはフィルタ6
を介して光検出器7に入いる。
Reference numeral 4 represents a light beam scattered by fine particles existing in the plasma processing apparatus 1, and this scattered light beam 4 is focused by a condensing lens 5, and then passed through a spectroscope or filter 6.
The light enters the photodetector 7 via.

集光レンズ5、分光器またはフィルタ6および光検出器
7は所望の散乱光線を受光できるように導入されたレー
ザ光線3の軸線に対して予定の角度を成して配置されて
いる。光検出器7はゲート勺ンブラ8に接続され、この
ゲートサンプラ8はパルス状し−11光線に同期してそ
れの時間幅に合せて光検出i1!87からの信号をゲー
トサンプリングする。すなわち、プラズマプロセス装@
1内を通って微粒子によって散乱を受けずに直進してき
たパルス状し−ず光線(第2図の(イ))をプラズマプ
ロセス装置1の外側に設けた受光装置9によって受光し
、この受光装置9は受光したパルス状レーザ光線の時間
幅に相応したゲート信号(第2図(ロ))をゲートサン
プラ8に供給する。これにより、ゲートサンプラ8はこ
のゲート信号に応じて光検出器7からの信号(第2図の
(ハ))をゲートサンプリングする。ゲートサンプラ8
によって得られた出力信号は通常、記録装置(図示して
ない)に記録さ゛れ得る。なお10はプラズマプロセス
装置1の電源装置12である。
The condenser lens 5, the spectrometer or filter 6 and the photodetector 7 are arranged at a predetermined angle to the axis of the introduced laser beam 3 so as to receive the desired scattered beam. The photodetector 7 is connected to a gate sampler 8, which gate-samples the signal from the photodetector i1!87 in synchronization with the pulsed -11 light beam in accordance with its time width. In other words, plasma process equipment @
The pulsed laser beam ((a) in FIG. 2) that has passed straight through the interior of the plasma processing apparatus 1 without being scattered by particles is received by the light receiving device 9 provided outside the plasma processing apparatus 1. 9 supplies the gate sampler 8 with a gate signal (FIG. 2 (b)) corresponding to the time width of the received pulsed laser beam. Thereby, the gate sampler 8 gate-samples the signal from the photodetector 7 ((c) in FIG. 2) according to this gate signal. Gate sampler 8
The output signal obtained by can typically be recorded on a recording device (not shown). Note that 10 is a power supply device 12 of the plasma processing apparatus 1.

発  明  の  効  果 以上説明してきたように、本発明によるプラズマ装置用
監視装置においては、プラズマ装置内にパルス状に発振
するレーザ光線を導入するレーザ導入手段と、プラズマ
装置内の微粒子によって散乱されたレーザ光線を検出す
る検出器と、上記パルス状レーザ光線に同期させて上記
検出器からの信号をサンプリングするグー1−1ノンブ
ラとを設()でいるので、サンプリング時間が非常に短
く、定常的に連続して放出されているプラズマ発光の影
響を受けず高感度に微粒子を検出することができ、それ
により、プラズマ電力、試料気体圧力や流量等を調節し
て微粒子の発生しないプラズマ条件に容易に設定するこ
とができ、その結果、高品質の成膜を行なうことができ
る。
Effects of the Invention As explained above, the monitoring device for a plasma device according to the present invention includes a laser introducing means for introducing a laser beam that oscillates in a pulsed manner into the plasma device, and a laser beam that is scattered by fine particles in the plasma device. Since the device is equipped with a detector that detects the pulsed laser beam and a non-branch that samples the signal from the detector in synchronization with the pulsed laser beam, the sampling time is very short and the steady It is possible to detect fine particles with high sensitivity without being affected by the plasma emission that is continuously emitted.This allows the plasma power, sample gas pressure, flow rate, etc. to be adjusted to create plasma conditions that do not generate fine particles. It can be easily set, and as a result, high quality film formation can be performed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明によるプラズマ装置用監視装置の一実施
例を示すブロック線図、第2図はレーザ光線、光検出器
の出力信号およびゲート信号を示す波形図である。 図中、1:プラズマプロセス装置、2:レーザ導入手段
、4:散乱光線、7:光検出器、8ニゲ−1−奢ナンプ
ラ、9:受光装置。 第1図 第2図 (ロ)
FIG. 1 is a block diagram showing an embodiment of a monitoring device for plasma equipment according to the present invention, and FIG. 2 is a waveform diagram showing a laser beam, an output signal of a photodetector, and a gate signal. In the figure, 1: plasma process device, 2: laser introduction means, 4: scattered light, 7: photodetector, 8: Nige-1-Dokunanpura, 9: light receiving device. Figure 1 Figure 2 (b)

Claims (1)

【特許請求の範囲】[Claims]  プラズマ装置内にパルス状に発振するレーザ光線を導
入するレーザ導入手段と、プラズマ装置内の微粒子によ
つて散乱されたレーザ光線を検出する検出器と、上記パ
ルス状レーザ光線に同期させて上記検出器からの信号を
サンプリングするゲートサンプラとを有し、このゲート
サンプラの出力信号によつてプラズマ装置内の微粒子を
監視できるようにしたことを特徴とするプラズマ装置用
監視装置。
a laser introducing means for introducing a pulsed laser beam into the plasma device; a detector for detecting the laser beam scattered by particles in the plasma device; and a detector for detecting the laser beam in synchronization with the pulsed laser beam. 1. A monitoring device for a plasma device, comprising a gate sampler for sampling a signal from the plasma device, and is capable of monitoring particulates in the plasma device based on an output signal of the gate sampler.
JP15518885A 1985-07-16 1985-07-16 Monitoring device for plasma treating device Pending JPS6216515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15518885A JPS6216515A (en) 1985-07-16 1985-07-16 Monitoring device for plasma treating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15518885A JPS6216515A (en) 1985-07-16 1985-07-16 Monitoring device for plasma treating device

Publications (1)

Publication Number Publication Date
JPS6216515A true JPS6216515A (en) 1987-01-24

Family

ID=15600409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15518885A Pending JPS6216515A (en) 1985-07-16 1985-07-16 Monitoring device for plasma treating device

Country Status (1)

Country Link
JP (1) JPS6216515A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136772A (en) * 1988-11-16 1990-05-25 Tokyo Electron Ltd Optical probing method
JPH02128396U (en) * 1989-03-30 1990-10-23
US5130679A (en) * 1987-11-26 1992-07-14 Asahi Glass Company Ltd. Ultrasonic delay line mounted in a frame-like body having a wiring pattern thereon
JPH0758081A (en) * 1993-08-10 1995-03-03 Nec Corp Method and apparatus for measuring dry etching depth

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51143583A (en) * 1975-06-06 1976-12-09 Hitachi Ltd Method for regulating gas-phase chemical reaction
JPS57118630A (en) * 1981-01-16 1982-07-23 Matsushita Electric Ind Co Ltd Evaporating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51143583A (en) * 1975-06-06 1976-12-09 Hitachi Ltd Method for regulating gas-phase chemical reaction
JPS57118630A (en) * 1981-01-16 1982-07-23 Matsushita Electric Ind Co Ltd Evaporating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130679A (en) * 1987-11-26 1992-07-14 Asahi Glass Company Ltd. Ultrasonic delay line mounted in a frame-like body having a wiring pattern thereon
JPH02136772A (en) * 1988-11-16 1990-05-25 Tokyo Electron Ltd Optical probing method
JPH02128396U (en) * 1989-03-30 1990-10-23
JPH0758081A (en) * 1993-08-10 1995-03-03 Nec Corp Method and apparatus for measuring dry etching depth

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