JPS62162839U - - Google Patents
Info
- Publication number
- JPS62162839U JPS62162839U JP1986050995U JP5099586U JPS62162839U JP S62162839 U JPS62162839 U JP S62162839U JP 1986050995 U JP1986050995 U JP 1986050995U JP 5099586 U JP5099586 U JP 5099586U JP S62162839 U JPS62162839 U JP S62162839U
- Authority
- JP
- Japan
- Prior art keywords
- tongue piece
- electrode lead
- semiconductor wafer
- gate electrode
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0198—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/40247—Connecting the strap to a bond pad of the item
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- H10W72/5449—
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- H10W72/926—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Thyristors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986050995U JPS62162839U (cg-RX-API-DMAC10.html) | 1986-04-04 | 1986-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986050995U JPS62162839U (cg-RX-API-DMAC10.html) | 1986-04-04 | 1986-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62162839U true JPS62162839U (cg-RX-API-DMAC10.html) | 1987-10-16 |
Family
ID=30874859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986050995U Pending JPS62162839U (cg-RX-API-DMAC10.html) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62162839U (cg-RX-API-DMAC10.html) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249768A (en) * | 1975-10-18 | 1977-04-21 | Fujitsu Ltd | Method of assembling semiconductor device |
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1986
- 1986-04-04 JP JP1986050995U patent/JPS62162839U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249768A (en) * | 1975-10-18 | 1977-04-21 | Fujitsu Ltd | Method of assembling semiconductor device |