JPS62161738U - - Google Patents

Info

Publication number
JPS62161738U
JPS62161738U JP5018886U JP5018886U JPS62161738U JP S62161738 U JPS62161738 U JP S62161738U JP 5018886 U JP5018886 U JP 5018886U JP 5018886 U JP5018886 U JP 5018886U JP S62161738 U JPS62161738 U JP S62161738U
Authority
JP
Japan
Prior art keywords
lead conductor
melting point
low melting
point metal
temperature fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5018886U
Other languages
Japanese (ja)
Other versions
JPH0436025Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5018886U priority Critical patent/JPH0436025Y2/ja
Publication of JPS62161738U publication Critical patent/JPS62161738U/ja
Application granted granted Critical
Publication of JPH0436025Y2 publication Critical patent/JPH0436025Y2/ja
Expired legal-status Critical Current

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  • Fuses (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図Aは本考案に係る温度ヒユーズを示す上
面説明図、第1図Bは第1図Aにおけるb―b断
面説明図、第2図は本考案の別実施例を示す断面
説明図、第3図並びに第4図はそれぞれ本考案の
他の別実施例を示す上面説明図である。 図において、1は絶縁基板、2,2は電極、3
,3はリード導体、30,30はリード導体先端
部、4は低融点金属体である。
FIG. 1A is an explanatory top view showing a temperature fuse according to the present invention, FIG. 1B is an explanatory cross-sectional view taken along line bb in FIG. 1A, and FIG. 2 is an explanatory cross-sectional view showing another embodiment of the present invention. 3 and 4 are top explanatory views showing other embodiments of the present invention, respectively. In the figure, 1 is an insulating substrate, 2 and 2 are electrodes, and 3
, 3 are lead conductors, 30, 30 are lead conductor tips, and 4 is a low melting point metal body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に一対の層状電極を設け、これらの
電極間に低融点金属体を橋設し、各電極にリード
導体を連結した温度ヒユーズにおいて、リード導
体を延設して、リード導体先端部を低融点金属体
に接触させたことを特徴とする温度ヒユーズ。
A pair of layered electrodes are provided on an insulating substrate, a low melting point metal is bridged between these electrodes, and a lead conductor is connected to each electrode in a temperature fuse.The lead conductor is extended and the tip of the lead conductor is A temperature fuse characterized by being in contact with a low melting point metal body.
JP5018886U 1986-04-02 1986-04-02 Expired JPH0436025Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5018886U JPH0436025Y2 (en) 1986-04-02 1986-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5018886U JPH0436025Y2 (en) 1986-04-02 1986-04-02

Publications (2)

Publication Number Publication Date
JPS62161738U true JPS62161738U (en) 1987-10-14
JPH0436025Y2 JPH0436025Y2 (en) 1992-08-26

Family

ID=30873312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5018886U Expired JPH0436025Y2 (en) 1986-04-02 1986-04-02

Country Status (1)

Country Link
JP (1) JPH0436025Y2 (en)

Also Published As

Publication number Publication date
JPH0436025Y2 (en) 1992-08-26

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