JPS62160543U - - Google Patents
Info
- Publication number
- JPS62160543U JPS62160543U JP1986048044U JP4804486U JPS62160543U JP S62160543 U JPS62160543 U JP S62160543U JP 1986048044 U JP1986048044 U JP 1986048044U JP 4804486 U JP4804486 U JP 4804486U JP S62160543 U JPS62160543 U JP S62160543U
- Authority
- JP
- Japan
- Prior art keywords
- flip chip
- circuit board
- mounting structure
- cap
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986048044U JPS62160543U (US07922777-20110412-C00004.png) | 1986-04-02 | 1986-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986048044U JPS62160543U (US07922777-20110412-C00004.png) | 1986-04-02 | 1986-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62160543U true JPS62160543U (US07922777-20110412-C00004.png) | 1987-10-13 |
Family
ID=30869211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986048044U Pending JPS62160543U (US07922777-20110412-C00004.png) | 1986-04-02 | 1986-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62160543U (US07922777-20110412-C00004.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232854A (ja) * | 1988-07-22 | 1990-02-02 | Canon Inc | 記録素子ユニット並びにそれを用いた記録素子駆動ユニット、インクジェットユニット、インクジェット駆動ユニット及びインクジェット装置 |
-
1986
- 1986-04-02 JP JP1986048044U patent/JPS62160543U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232854A (ja) * | 1988-07-22 | 1990-02-02 | Canon Inc | 記録素子ユニット並びにそれを用いた記録素子駆動ユニット、インクジェットユニット、インクジェット駆動ユニット及びインクジェット装置 |
