JPS62159308A - Electromagnetic transducer - Google Patents

Electromagnetic transducer

Info

Publication number
JPS62159308A
JPS62159308A JP29909785A JP29909785A JPS62159308A JP S62159308 A JPS62159308 A JP S62159308A JP 29909785 A JP29909785 A JP 29909785A JP 29909785 A JP29909785 A JP 29909785A JP S62159308 A JPS62159308 A JP S62159308A
Authority
JP
Japan
Prior art keywords
coil
forming member
coil forming
winding
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29909785A
Other languages
Japanese (ja)
Inventor
Takayuki Kato
孝行 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP29909785A priority Critical patent/JPS62159308A/en
Publication of JPS62159308A publication Critical patent/JPS62159308A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/17Construction or disposition of windings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Magnetic Heads (AREA)

Abstract

PURPOSE:To sharply improve the productivity of an electromagnetic transducer, by using a coil formed by installing coil conductors to a flexible base body integrally and connecting the coil conductors with another conductors installed to another base body integrally under a wireless condition. CONSTITUTION:A coil forming member 14 formed by sticking coil conductors to a flexible film base is fitted through a hole 2 for winding and a winding coil is formed wit this film. In the source of the manufacturing, the material for making the coil conductors is made to adhere to the entire surface of a base 15 and processed to a coil conductor pattern 13 after adhering, and then, terminals 16 for connection are formed at each terminal section integrally. Then the surface is covered with an insulating layer 17. When the coil forming member 14 thus manufactured is passed through the hole 2 for wiring of a head at least one time and terminals are connected with each other by means of a printed circuit board 3 as shown in the figure under a condition where each terminal section is faced to another, and then, input and output are pulled out, the coil forming member 14 can be caused to operate as a coil.

Description

【発明の詳細な説明】 イ、産集土の利用分野 本発明は電磁変換装置に関し、例えば磁気ヘッドのよう
な小型の電磁変換装置に特に好適な電磁変換装置に関す
る。
DETAILED DESCRIPTION OF THE INVENTION A. Field of Application of Sanchido The present invention relates to an electromagnetic transducer, and more particularly, to an electromagnetic transducer particularly suitable for a small electromagnetic transducer such as a magnetic head.

口、従来技術 従来、磁気ヘッド、例えばバルクヘッドの巻線は第13
図に示すようにコア1のコイル巻線孔2に手巻き若しく
は自動巻線機でコイル3を巻付けることにより行なって
いる。しかしこれは、サイズの小さいC1=700 μ
nSm=700 μm)巻線孔2を通して行なうもので
あるから非常に面倒である。
Conventionally, the winding of a magnetic head, for example, a bulk head, has a 13th winding.
As shown in the figure, the coil 3 is wound around the coil winding hole 2 of the core 1 by hand or by an automatic winding machine. However, this is a small size C1 = 700 μ
(nSm=700 μm) This is very troublesome because it is done through the winding hole 2.

特に第14図に示すマルチヘッド(単一ヘッドが複数個
配列)では、例えば電子スチルカメラ用の場合にはトラ
ック間隔が各ヘッド間の微小ピッチに対応して0.04
mmと狭く、またPCM用ヘッドでも0.1〜0.2鶴
しかない。この場合、ヘッドのコイル巻線孔2のサイズ
はj!” = 500μm1m’  = 500μmと
更に小さく、各ヘッド間の間隙d=40μmであるから
、もはや自動巻線機では巻線が不可能であり、手巻きで
しか巻線を行なうことができない。
In particular, in the case of a multi-head (a plurality of single heads arranged) shown in FIG. 14, for example, in the case of an electronic still camera, the track interval is 0.04 mm, corresponding to the minute pitch between each head.
It is as narrow as 0.1 to 0.2 mm even for PCM heads. In this case, the size of the coil winding hole 2 of the head is j! '' = 500 μm 1 m' = 500 μm, which is even smaller, and the gap d between each head is 40 μm, so winding is no longer possible with an automatic winding machine and can only be done by hand.

即ち、コイルは0.035〜0.020龍φのホルマー
ル導線からなっていて、これを上記の微小間隙を通して
巻くのは非常に難しい。例えば、イルミネーティングル
ーぺで巻線部を拡大し、ビンセット等で巻くが、これを
隣接するヘッドコアに順次巻きつけることは非常な労力
を費やし、さらに困難をきわめる。電子スチルカメラ用
のヘッドの場合は、0.04鰭のトラック間隔であり、
ルーパ等を使用して巻くのは不可能である。
That is, the coil is made of formal conducting wire with a diameter of 0.035 to 0.020, and it is very difficult to wind it through the above-mentioned minute gap. For example, the winding portion is enlarged using an illuminating magnifying glass and wound using a bin set, etc., but it takes a lot of effort and is even more difficult to wind the wire around adjacent head cores one after another. In the case of heads for electronic still cameras, the track spacing is 0.04 fins,
It is impossible to wind it using a looper or the like.

ハ0発明の目的 本発明は、上記の事情に鑑みてなされたものであって、
生産性、歩留り良くコイルを取付けることの可能な電磁
変換装置を提供することを目的としている。
Purpose of the Invention The present invention has been made in view of the above circumstances, and includes:
The object of the present invention is to provide an electromagnetic transducer capable of attaching coils with high productivity and yield.

二1発明の構成 本発明は、可撓性基体にコイル導体が一体に設けられて
なるコイル形成部材が、コア部のコイル巻線孔に挿通さ
れ、前記可撓性基体とは別の基体に一体に設けられた導
体に、前記コイル導体の端部がワイヤレスに接続されて
コイルを形成するように構成された電磁変換装置に係る
21. Structure of the Invention The present invention provides a coil forming member in which a coil conductor is integrally provided on a flexible base, which is inserted into a coil winding hole in a core portion, and is connected to a base other than the flexible base. The present invention relates to an electromagnetic transducer configured such that an end portion of the coil conductor is wirelessly connected to an integrally provided conductor to form a coil.

ホ、実施例 以下、本発明を磁気ヘッドに適用した例について説明す
る。
E. Example Hereinafter, an example in which the present invention is applied to a magnetic head will be described.

第1図は、バランス型と称される磁気ヘッドの例を示す
FIG. 1 shows an example of a magnetic head called a balanced type.

このヘッドのコア1には既述したと同様の巻線孔2が設
けられているが、本実施例によれば、この巻線孔2を通
して可撓性フィルムベースにコイル導線が付着してなる
コイル形成部材14が取付けられ、このフィルムで巻線
コイルが形成される。
The core 1 of this head is provided with a winding hole 2 similar to that described above, and according to this embodiment, a coil conductor is attached to the flexible film base through this winding hole 2. A coil forming member 14 is attached and the film forms a wound coil.

即ち、このコイル形成部材14は従来のコイルとは全く
異なり、第2図及び第3図に示すように例えば厚さ5μ
mのフィルムベース(例えばポリエチレンテレフタレー
トベース)15に、Cu %A u s F e SA
 g若しくはA1等又はこれらの合金からなるコイル導
NlA13をスパッタリング、真空蒸着法等で形成した
ものである。製造にあたっては、ベース15上にコイル
導線材料(例えばCu)を全面に付着せしめ、しかる後
に公知のフォトリソグラフィー技術により所定のコイル
46!パターン13に加工し、各端部に接続用端子16
を一体に形成しておく。そして表面を絶縁層17、例え
ばポリイミド系樹脂で被覆しておく。またはスパッタ法
によりSiO□、S i 2 N 4などの1色縫物を
被着する。この後に、第2図の如き形状にエツチング溶
断し、個々にコイル形成部材を切出すごとができる。
That is, this coil forming member 14 is completely different from conventional coils, and has a thickness of, for example, 5 μm as shown in FIGS. 2 and 3.
m film base (e.g. polyethylene terephthalate base) 15, Cu % A u s F e SA
A coil conductor NlA13 made of G, A1, or an alloy thereof is formed by sputtering, vacuum evaporation, or the like. In manufacturing, a coil conductor material (for example, Cu) is adhered to the entire surface of the base 15, and then a predetermined coil 46! is formed using known photolithography techniques. Processed into a pattern 13, with connection terminals 16 at each end.
be formed into one piece. Then, the surface is covered with an insulating layer 17, for example, a polyimide resin. Alternatively, a one-color sewing material such as SiO□ or Si 2 N 4 is applied by sputtering. After this, it is etched and melted into the shape shown in FIG. 2, and the coil forming members can be cut out individually.

こうしたコイル形成部材14は、第1図において、ヘッ
ドの巻線孔2に1回以上通され、各端部を対向させた状
態で、端子間を図示の如きプリント基板3によって接続
し、人、出力を夫々取出せば、コイルとして動作させる
ことができる(なお、巻線孔2の左側にも上記と同様に
コイル形成部材14を取付けてよいが、これは図示省略
した)。
Such a coil forming member 14 is passed through the winding hole 2 of the head at least once in FIG. If the outputs are respectively taken out, it can be operated as a coil (note that the coil forming member 14 may be attached to the left side of the winding hole 2 in the same manner as above, but this is not shown).

従って、巻線孔2が小さく、かつ第14図で述べた如き
狭い間隔又は間隙であっても、従来のようにコイル導線
を何十回も巻く必要は全くなく、コイル形成部材14を
巻線孔2に通すことで同様のコイルを作成できるから、
生産性が大きく向上すると同時に、作業性が良く、歩留
も著しく良好となる。
Therefore, even if the winding hole 2 is small and the spacing or gap is narrow as shown in FIG. A similar coil can be created by passing it through hole 2, so
Productivity is greatly improved, workability is good, and yield is also significantly improved.

プリント基板3は、絶縁性半透明基体(例えばポリイミ
ドフィルムからなる薄板)4上にCu等の配線5をフォ
トリソグラフィによって所定のパターンに形成し、配線
5の上に半田めっきを施してなっていて、端子16に配
線5を合せて加熱し、半田によって両者を接続する。絶
縁性基体4は半透明であるので位置合せが可であるが、
コイル形成部材を支持する支持体6にマーカを付してお
くと位置合せを精度良くなすことができる。
The printed circuit board 3 includes wiring 5 made of Cu or the like formed in a predetermined pattern by photolithography on an insulating translucent substrate (for example, a thin plate made of polyimide film) 4, and solder plating is applied to the wiring 5. , the wiring 5 is aligned with the terminal 16 and heated, and the two are connected by solder. Since the insulating substrate 4 is semi-transparent, alignment is possible; however,
By attaching a marker to the support 6 that supports the coil forming member, accurate alignment can be achieved.

端子間の接続及び端子と人、出力端子との間の接続は、
一般にはワイヤボンディングによってなされる。コイル
のターン数は一般に15タ一ン程度は必要であり、ワイ
ヤボンディングは上記ターン数プラス1回行う必要があ
り、その作業に甚しく時間を要する。その上、多数回の
ワイヤボンディングは、接続に1個所でも欠陥があると
、磁気へラドεま作動せず、故障率が高くなる。
Connections between terminals, terminals and people, and connections between output terminals are as follows:
This is generally done by wire bonding. Generally, the number of turns of the coil is about 15 turns, and wire bonding needs to be performed one more time than the above number of turns, which takes a considerable amount of time. Moreover, when wire bonding is performed multiple times, if there is a defect in even one connection, the magnetic held ε will not work, resulting in a high failure rate.

このような事情から、本発明にあっては、ワイヤボンデ
ィングによらず、前記のような方法で端子の接続を行う
。この方法によれば、接続作業が簡単で而も確実である
Under these circumstances, in the present invention, the terminals are connected by the method described above without wire bonding. According to this method, the connection work is simple and reliable.

コイル形成部材14を巻線孔2に挿通する際には、拡大
された端部を縮小するよう弾性変形させてから通すこと
ができるが、神道後は図示の如くに原形に復元する。
When inserting the coil forming member 14 into the winding hole 2, the enlarged end portion can be elastically deformed so as to be reduced in size, and then the coil forming member 14 can be passed through the coil forming member 14. However, after Shintoism, the coil forming member 14 is restored to its original shape as shown in the figure.

この後、コイル形成部材14をコア1の面に押付けて第
1図のように変形させるのであるが、フィルムベース1
5の厚さを充分に薄くしであるので、コア形成部材14
はコア1の面に沿って変形し、これと密着していて巻線
形状は良好である。
Thereafter, the coil forming member 14 is pressed against the surface of the core 1 to deform it as shown in FIG.
5 is made sufficiently thin, the core forming member 14
is deformed along the surface of the core 1 and is in close contact with the core 1, so that the winding shape is good.

なお、第1図において、コイル形成部材14の取付けに
際し、一対のコア1をガラス融着してから取付けるのが
良い。コイル形成部材14をガラス融着前に取付けると
、これが融着作業の邪魔になってコア同士の間で位置ず
れを生じ易い(コア同士の位置ずれは数μm以下でなけ
ればならない。)。
In addition, in FIG. 1, when attaching the coil forming member 14, it is preferable to attach the pair of cores 1 after glass fusing. If the coil forming member 14 is attached before the glass is fused, it will interfere with the fusion work and tend to cause misalignment between the cores (the misalignment between the cores must be several μm or less).

その上、巻線孔2にガラスが食み出してフィルムベース
15とコア1との間に侵入し、凝固することがある。コ
イル形成部材14の取付は位置が狂っている場合、最早
その修正は不可能であるので、ガラス融着後にコイル形
成部材を取付けるのが望ましい。
Moreover, the glass may protrude into the winding hole 2, enter between the film base 15 and the core 1, and solidify. If the coil forming member 14 is installed out of position, it is no longer possible to correct it, so it is desirable to install the coil forming member 14 after the glass is fused.

第4図は、コイル導線13を絶縁層17(例えばポリイ
ミド系樹脂)を介して積層したものである。上層のコイ
ル導線上にも絶縁層17を塗布でコーティングしておく
。このようにすれば、導線13の本数密度を増やせるか
ら、コイル形成部材14の幅W1を狭くし、磁界強度を
大として磁気特性を向上させ得るのみならず、コイル形
成部材14を幅狭として巻線孔2に通し易くなる等の作
業性の向上も可能となる。
In FIG. 4, coil conducting wires 13 are laminated with an insulating layer 17 (for example, polyimide resin) interposed therebetween. The upper coil conductor wire is also coated with an insulating layer 17. In this way, since the number density of the conducting wires 13 can be increased, it is possible to narrow the width W1 of the coil forming member 14 and increase the magnetic field strength to improve the magnetic properties. It is also possible to improve workability, such as making it easier to pass the wire through the hole 2.

この場合は、下層側のコイル導線13の端部上で絶縁層
17にスルーホールを設け、表面に接続用端子を形成す
る際に接続用端子と下層側のコイル導線とをスルーホー
ルを通して接続する。
In this case, a through hole is provided in the insulating layer 17 on the end of the lower layer coil conducting wire 13, and when forming the connecting terminal on the surface, the connecting terminal and the lower layer coil conducting wire are connected through the through hole. .

フィルムベースとしては、ポリイミド樹脂、ポリカーボ
ネート樹脂、ポリテトラフルオロエチレン樹脂等が用い
られる。フィルムベース厚さとしては、4〜100μm
が望ましい。
As the film base, polyimide resin, polycarbonate resin, polytetrafluoroethylene resin, etc. are used. Film base thickness: 4 to 100 μm
is desirable.

これらのフィルムベースを使用して、次のような工程を
経てコイル形成部材を製作し、コアに取付けて磁気ヘッ
ドとした。
Using these film bases, a coil forming member was manufactured through the following steps, and was attached to a core to form a magnetic head.

1)フィルムベースを真空装内に置き1.OX 10−
’T orrまで真空に引く。
1) Place the film base in a vacuum chamber.1. OX 10-
'Pull the vacuum to Torr.

2)Arガスにて6.0X10−”Torrのガス圧に
する。
2) Set the gas pressure to 6.0×10-” Torr using Ar gas.

3)Cuターゲット又はAuターゲットとフィルムベー
ス間に2.0〜3.0 W/c11の電圧をかけ、グロ
ー放電をおこし、スパッタリングを行ない膜厚を2.0
X10−’mとする。
3) Apply a voltage of 2.0 to 3.0 W/c11 between the Cu target or Au target and the film base to generate glow discharge and perform sputtering to reduce the film thickness to 2.0 W/c11.
Let it be X10-'m.

4)Cu膜又はAu膜が付着したフィルムベースにレジ
スト(A Z −1350;ヘキスト社製)を塗布する
4) Apply a resist (AZ-1350; manufactured by Hoechst) to the film base to which the Cu film or Au film is attached.

5)上記のものを露光、現像、エツチング(耐酸性)を
行い、所望のパターンを得る。
5) The above material is exposed, developed, and etched (acid resistant) to obtain a desired pattern.

6)所望のパターンを得た後、レジストを剥離(耐有機
溶剤)する。
6) After obtaining the desired pattern, remove the resist (organic solvent resistant).

7)所望の形状にエツチング溶断し、 8)コアに取付け、磁気ヘッドとする。7) Etching and fusing into the desired shape, 8) Attach it to the core and use it as a magnetic head.

第5図(a)は上記5)の工程でパターニングしたコイ
ル形成部材の中間製品を示す。図中A部分を拡大図示す
れば、同図(b)のようになっている。Cu又はAuの
導体13の密に形成されている部分13aの幅は10μ
m、その両側の粗1こ形成されている部分13bの幅は
50μmとしである。
FIG. 5(a) shows an intermediate product of the coil forming member patterned in the step 5) above. If part A in the figure is shown in an enlarged view, it becomes as shown in figure (b). The width of the densely formed portion 13a of the Cu or Au conductor 13 is 10μ.
m, and the width of the roughly formed portion 13b on both sides thereof is 50 μm.

同図(b)に示すパターンが多数形成されて同図(a)
に示す中間製品を構成している。
A large number of patterns shown in FIG. 2(b) are formed and the pattern shown in FIG.
It consists of the intermediate products shown in .

この工程はフォトリソグラフィの方法によって遂行され
る。即ち、第6図に示すように、フィルムベース15上
に全面被着しているCu又はAuの導体層13−2上に
フォトレジスト13−3を所定のパターンに形成し、こ
れをマスクにして導体層13−2をパターンエツチング
してコイル導体13が形成される。
This process is performed using a photolithography method. That is, as shown in FIG. 6, a photoresist 13-3 is formed in a predetermined pattern on a conductive layer 13-2 of Cu or Au that is entirely covered on the film base 15, and this is used as a mask. The coil conductor 13 is formed by pattern etching the conductor layer 13-2.

第7図は、上記7)の工程で、第6図(a)に示す中間
製品の各A部分を所定の形状で採取する状態を示す。
FIG. 7 shows a state in which each portion A of the intermediate product shown in FIG. 6(a) is sampled in a predetermined shape in the step 7) above.

この工程もフォトリソグラフィの方法によって遂行され
る。即ち、第8図に示すように、上記中間製品上にフォ
トレジス)13−4を所定のパターンに形成し、これを
マスクにしてフィルムベース15の不要部分をエツチン
グ除去し、第2図に示すコイル形成部材とする。
This process is also performed using a photolithography method. That is, as shown in FIG. 8, a photoresist (13-4) is formed in a predetermined pattern on the intermediate product, and using this as a mask, unnecessary portions of the film base 15 are etched away, as shown in FIG. It is used as a coil forming member.

以下に具体的な実施例について説明する。Specific examples will be described below.

第9図に示すコイル形成部材を用意した。このコイル形
成部材14の中央部14aの幅W、は0.35mm、幅
広部14bの幅W2は1.5龍である。
A coil forming member shown in FIG. 9 was prepared. The width W of the central portion 14a of this coil forming member 14 is 0.35 mm, and the width W2 of the wide portion 14b is 1.5 mm.

このコイル形成部材には15本のコイル導線13が設け
てあり、断面構造は第3図に示したと同様である。
This coil forming member is provided with 15 coil conducting wires 13, and its cross-sectional structure is the same as that shown in FIG.

なお、フィルムベース15はポリイミド樹脂又はポリカ
ーボネート樹脂からなり、その厚さは10μm、コイル
導線13はCu又はAuからなり、その厚さは2μm、
絶縁層はS i Oz又は5lsNaによって形成され
ている。
The film base 15 is made of polyimide resin or polycarbonate resin and has a thickness of 10 μm, and the coil conductor 13 is made of Cu or Au and has a thickness of 2 μm.
The insulating layer is made of SiOz or 5lsNa.

このコイル形成部材は第5図〜第8図で説明したフォト
リソグラフィの方法によって製作された。
This coil forming member was manufactured by the photolithography method explained in FIGS. 5 to 8.

第11図は第9図のコイル形成部材を取付けてなる磁気
ヘッドを示す。
FIG. 11 shows a magnetic head to which the coil forming member of FIG. 9 is attached.

この磁気ヘッドは、電子スチルカメラ用のマルチヘッド
で、コア1の厚さ14は60μm、コア間隙dは40μ
m、巻線孔2の高さ2hは0.4鶴、幅l、は0.3 
uである。
This magnetic head is a multi-head for electronic still cameras, and the thickness 14 of the core 1 is 60 μm, and the core gap d is 40 μm.
m, the height 2h of the winding hole 2 is 0.4, and the width l is 0.3.
It is u.

先ず、絶縁性基体22上に人、出力リード21を形成し
た第二のプリント基板20を、コア1表面の所定の位置
に貼付ける。次に、巻線孔2に幅広部14bを丸めて挿
通してから、図のようにコイル形成部材14をコア1に
巻付け、貼付する。
First, the second printed circuit board 20, in which the output leads 21 are formed on the insulating substrate 22, is attached to a predetermined position on the surface of the core 1. Next, the wide portion 14b is rolled up and inserted into the winding hole 2, and then the coil forming member 14 is wound around the core 1 and attached as shown in the figure.

このときコイル形成部材14がコア1に密着し、幅広部
14bがコア1表面の所定の位置に正確に位置するよう
にする。コイル形成部材14のコア1への貼付は、フィ
ルムベース裏面に予め塗布されている接着剤によってな
される。
At this time, the coil forming member 14 is brought into close contact with the core 1 so that the wide portion 14b is accurately positioned at a predetermined position on the surface of the core 1. The coil forming member 14 is attached to the core 1 using an adhesive that is previously applied to the back surface of the film base.

次に、第10図に示す第一のプリント基板4−2を配線
5を下側にして両幅広部14b上に載置し、配線5を端
子16に合せ、端子部分を加熱して前述のように半田に
よって両者を接続する。
Next, the first printed circuit board 4-2 shown in FIG. 10 is placed on both wide portions 14b with the wiring 5 facing downward, the wiring 5 is aligned with the terminal 16, and the terminal portion is heated, as described above. Connect the two using solder.

第一のプリント基板4−2は、前述したように、絶縁半
透明基体6上にフォトリソグラフィによって配線5を形
成し、配線5J:に半田めっきが施されてなっている。
As described above, the first printed circuit board 4-2 has the wiring 5 formed on the insulating semi-transparent substrate 6 by photolithography, and the wiring 5J: is plated with solder.

配線上の半田めっきは、溶融半田浴中へ第一のプ・リン
ト基板を短時間浸漬することによってなされる。配線は
Cu等の熱伝導が良好で半田の濡れ性の良い金属からな
っているので瞬時にして半田の溶融点以上に加熱され、
基体は熱伝導率が低いので余り加熱されず、配線上にの
み半田めっき層が形成される。
Solder plating on the wiring is accomplished by briefly dipping the first printed circuit board into a molten solder bath. The wiring is made of a metal such as Cu that has good thermal conductivity and good solder wettability, so it is instantly heated to above the melting point of the solder.
Since the base body has low thermal conductivity, it is not heated much, and a solder plating layer is formed only on the wiring.

幅広部14b及び第一のプリント基板4−2の位置合せ
は、第12図に拡大して示すように、予めコア1表面に
付されているマーカ7及び8によって夫々正確になされ
る。
The wide portion 14b and the first printed circuit board 4-2 are accurately aligned using the markers 7 and 8 previously attached to the surface of the core 1, respectively, as shown in an enlarged view in FIG.

第一のプリント基板4−2の配線50両側先端のバッド
5aと、第二のプリント基板20のリード21の端部の
パッド21aとの間の接続も、前記と同様に半田付けに
よってなされる。
Connections between the pads 5a at both ends of the wiring 50 on the first printed circuit board 4-2 and the pads 21a at the ends of the leads 21 on the second printed circuit board 20 are also made by soldering in the same manner as described above.

また、第二のプリント基板20の基体22には、マーカ
7及び8が見えるように、窓22aが設けである。
Further, the base 22 of the second printed circuit board 20 is provided with a window 22a so that the markers 7 and 8 can be seen.

以上のようにして組立てられた磁気ヘッド200個につ
いてコイルの導通検査を行った結果は、下記表に示す通
りである。同表には、比較のためにワイヤボンディング
によって端子間の配線及び人、出力ワイヤタ接続を行い
、其他は上記実施例と同様にして製作された磁気ヘッド
についての同様の検査結果が併記しである。
The results of conducting a coil continuity test on 200 magnetic heads assembled as described above are shown in the table below. For comparison, the same table also lists the same test results for a magnetic head manufactured in the same manner as in the above example, except that the wiring between the terminals and the connections between the terminals and the output wires were made using wire bonding. .

このように、本発明に基く磁気ヘッドは歩留が高(、ま
た製造も容易である。
As described above, the magnetic head based on the present invention has a high yield (and is easy to manufacture).

上記の例では、既にガラス融着されているコアの巻線孔
にコイル形成部材を挿通して磁気ヘッドとしているが、
コイル形成部材を一方のコア部に巻付けてからコアをガ
ラス融着することも可能である。
In the above example, a magnetic head is created by inserting a coil forming member into the winding hole of a core that has already been fused with glass.
It is also possible to wrap the coil-forming member around one core portion and then glass-fuse the core.

即ち、一方のコア部にコイル形成部材14を巻付けてお
いて、2つのコアを突合せ、第11図に一点鎖線で示す
ガラス棒10を巻線孔2の突合せ部に置き、ガラス棒1
0を加熱して熔融させ、コア1を融着する。このように
すると、磁気ヘッド組立て作業が一層容易になる。フィ
ルムベースには耐熱性のあるポリイミド樹脂又はポリカ
ーボネート樹脂を使用しているので、ガラス融着の温度
に充分に耐えられる。また、既にコイル形成部材14が
コア1に密着して正確な位置で巻付いているので、融着
作業の邪魔にならず、前述したようなコイル形成部材の
位置ずれやコア融着部のずれが起る虞れはない。
That is, the coil forming member 14 is wound around one core part, the two cores are butted together, the glass rod 10 shown by the dashed line in FIG. 11 is placed in the butt part of the winding hole 2, and the glass rod
0 is heated and melted, and core 1 is fused. In this way, the work of assembling the magnetic head becomes easier. Since a heat-resistant polyimide resin or polycarbonate resin is used for the film base, it can sufficiently withstand the temperature of glass fusing. In addition, since the coil forming member 14 is already tightly wound around the core 1 at an accurate position, it does not interfere with the fusion work, and prevents the positional deviation of the coil forming member and the deviation of the core fused portion as described above. There is no risk of this happening.

以上、本発明を例示したが、上述の例は本発明の技術的
思想に基いて更に変形が可能である。
Although the present invention has been illustrated above, the above-mentioned example can be further modified based on the technical idea of the present invention.

例えば、上述のフィルム状コイルの導線のパターンやコ
イル自体の形状等は種々変更してよい。
For example, the pattern of the conducting wire of the above-mentioned film-like coil, the shape of the coil itself, etc. may be changed in various ways.

また、上述のフィルム状コイルは場合によっては、巻線
孔に複数回通して巻回すこともできるが、この場合でも
各フィルムでは多数本の導線を保持したまま作業を行な
え、その上、導線の接続が簡単であるから作業性が良く
、ミスも減少する。また、適用可能なヘッドはバランス
型に限らず、セミバランス型(コア部のバックギャップ
位置にコイルを取付けるタイプ)や、スタガ型(一方の
コア部のみにコイルを取付けるタイプ)であってもよく
、磁気ヘッド以外にも、コイルを使用する種々の電磁変
換装置に適用可能である。
In some cases, the above-mentioned film-like coil can be wound by passing it through the winding hole multiple times, but even in this case, each film can be used while holding a large number of conductors. The ease of connection improves work efficiency and reduces mistakes. In addition, the applicable head is not limited to the balanced type, but may also be a semi-balanced type (a type in which the coil is installed at the back gap position of the core part) or a staggered type (a type in which the coil is installed only in one core part). In addition to magnetic heads, the present invention can be applied to various electromagnetic transducers using coils.

へ0発明の作用効果 本発明は上述の如く、可撓性基体にコイル導体を一体に
設けたコイルを用いているので、巻線孔が小さく、かつ
コイル挿通部分が狭い間隔又は間隙であっても、従来の
ようにコイル導線を何回も巻く必要は全くなく、4体付
き可撓性基体を巻線孔等に通すのみで同様のコイルを作
成できる。その上、前記可撓性基体とは別の基体に一体
に設けられた導体に前記コイル導体がワイヤレスに接続
するようにしているので、この接続がワイヤボンディン
グのような面倒さがなく、確実、かつ容易である。従っ
て、生産性が大幅に向上し、歩留も良好となる。
As described above, the present invention uses a coil in which a coil conductor is integrally provided on a flexible base, so the winding hole is small and the coil insertion portion has narrow intervals or gaps. However, there is no need to wind the coil wire many times as in the conventional method, and a similar coil can be created by simply passing the flexible base with four members through the winding holes. Furthermore, since the coil conductor is wirelessly connected to a conductor that is integrally provided on a base other than the flexible base, this connection is not troublesome like wire bonding, and is reliable. And easy. Therefore, productivity is greatly improved and yield is also improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第12図は本発明の実施例を示すものであって
、 第1図は磁気へ・ラドの概略斜視図、 第2図はコイル形成部材の斜視図、 第3図は第2図のm−m線断面図、 第4図は他の例によるコイル形成部材の第3図と同様の
断面図、 第5図はコイル形成部材の中間製品を示し、同図(a)
は斜視図、同図(b)は同図(a)の拡大平面図、 第6図はコイル導体パターンの形成方法を示す断面図、 第7図はコイル形成部材の中間製品からコイル形成部材
を採取する状態を示す斜視図、第8図はコイル形成部材
の中間製品からコイル形成部材を採取する方法を示す断
面図、第9図は更に他の例によるコイル形成部材の平面
図、 第10図は第一のプリント基板の斜視図、第11図は第
9図のコイル形成部材を使用してなる磁気ヘッドの斜視
図、 第12図は第11図の部分拡大図 である。 第13図及び第14図は従来例を示すものであって・ 第13図は磁気ヘッドの概略斜視図、 第14図はマルチヘッドの概略斜視図 である。 なお、図面に示す符号において、 1  ・・・コア部 2  ・・・巻線孔 3  ・・・プリント基板 4−2・・・第一のプリント基板 4.6・・・半透明基体 5  ・・・配線 13 ・・・コイル導線 14 ・・・コイル形成部材 14a・・・中央部 14b・・・幅広部 15 ・・・フィルムベース 17 ・・・′4f!A縁層 20 ・・・第二のプリント基板 21 ・・・刃−ド 22 ・・・基体 である。 代理人 弁理士  逢 坂   宏 第3図 第5図 第6図 第7図 cy t:y cy j’−AcI 第8図 第9図 凪 第10図 第11図 第12図 第13図 第14図 7−″ 特許庁長官 黒 1)明 雄  殿 1、事件の表示 昭和60年 特許願第299097号 2、発明の名称 電磁変換装置 3、補正をする者 事件との関係 特許出願人 住 所 東京都新宿区西新宿1丁目26番2号名 称 
(127)小西六写真工業株式会社4、代理人 住 所 東京都立川市柴崎町2−4−11FINEビル
置0425−24−5411(や (1)0図面の第11図を別紙の通りに訂正します。
1 to 12 show embodiments of the present invention, in which FIG. 1 is a schematic perspective view of a magnetoresistive device, FIG. 2 is a perspective view of a coil forming member, and FIG. 3 is a perspective view of a coil forming member. Fig. 4 is a sectional view similar to Fig. 3 of a coil forming member according to another example; Fig. 5 shows an intermediate product of the coil forming member;
is a perspective view, FIG. 6 is an enlarged plan view of FIG. FIG. 8 is a sectional view showing a method of collecting a coil forming member from an intermediate product of coil forming members; FIG. 9 is a plan view of a coil forming member according to another example; FIG. 10 11 is a perspective view of a magnetic head using the coil forming member of FIG. 9, and FIG. 12 is a partially enlarged view of FIG. 11. 13 and 14 show conventional examples. FIG. 13 is a schematic perspective view of a magnetic head, and FIG. 14 is a schematic perspective view of a multi-head. In addition, in the reference numerals shown in the drawings, 1...Core portion 2...Winding hole 3...Printed circuit board 4-2...First printed circuit board 4.6...Semi-transparent base 5... -Wiring 13...Coil conductor 14...Coil forming member 14a...Central part 14b...Wide part 15...Film base 17...'4f! A edge layer 20...Second printed circuit board 21...Blade 22...Substrate. Agent Patent Attorney Hiroshi Aisaka Figure 3 Figure 5 Figure 6 Figure 7 cy t:y cy j'-AcI Figure 8 Figure 9 Nagi Figure 10 Figure 11 Figure 12 Figure 13 Figure 14 7-'' Commissioner of the Japan Patent Office Kuro 1) Mr. Akio 1, Indication of the case 1985 Patent Application No. 299097 2, Name of the invention Electromagnetic conversion device 3, Relationship with the person making the amendment Patent applicant address Tokyo 1-26-2 Nishi-Shinjuku, Shinjuku-ku Name
(127) Konishiroku Photo Industry Co., Ltd. 4, Agent address: 0425-24-5411, FINE Building, 2-4-11 Shibasaki-cho, Tachikawa-shi, Tokyo (Ya (1) 0 Figure 11 of the drawing has been corrected as shown in the attached sheet) To do.

Claims (1)

【特許請求の範囲】[Claims] 1、可撓性基体にコイル導体が一体に設けられてなるコ
イル形成部材が、コア部のコイル巻線孔に挿通され、前
記可撓性基体とは別の基体に一体に設けられた導体に、
前記コイル導体の端部がワイヤレスに接続されてコイル
を形成するように構成された電磁変換装置。
1. A coil forming member in which a coil conductor is integrally provided on a flexible base is inserted into a coil winding hole in a core part, and the coil forming member is formed by a coil conductor integrally provided on a base other than the flexible base. ,
An electromagnetic transducer configured such that ends of the coil conductor are wirelessly connected to form a coil.
JP29909785A 1985-12-31 1985-12-31 Electromagnetic transducer Pending JPS62159308A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29909785A JPS62159308A (en) 1985-12-31 1985-12-31 Electromagnetic transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29909785A JPS62159308A (en) 1985-12-31 1985-12-31 Electromagnetic transducer

Publications (1)

Publication Number Publication Date
JPS62159308A true JPS62159308A (en) 1987-07-15

Family

ID=17868114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29909785A Pending JPS62159308A (en) 1985-12-31 1985-12-31 Electromagnetic transducer

Country Status (1)

Country Link
JP (1) JPS62159308A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100425469B1 (en) * 2000-11-15 2004-03-30 삼성전자주식회사 Electrical substrate and hard disk drive adopting the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100425469B1 (en) * 2000-11-15 2004-03-30 삼성전자주식회사 Electrical substrate and hard disk drive adopting the same

Similar Documents

Publication Publication Date Title
JP3536728B2 (en) Semiconductor device, tape carrier, manufacturing method thereof, circuit board, electronic device, and tape carrier manufacturing apparatus
JP2001111227A (en) Flexible wiring board and method of manufacturing the same
JP3848368B2 (en) Formation of semiconductor connection element leads
US6809267B1 (en) Flexible printed wiring board and its production method
KR100211814B1 (en) A pliability coil winding structure of fbt and manufacture method therefore
EP0257738A2 (en) Electrical component with added connecting conducting paths
JPS62159308A (en) Electromagnetic transducer
EP1173051B1 (en) Flexible printed wiring board and its production method
JPS62159307A (en) Electromagnetic transducer
US5877668A (en) Flyback transformer having a flexible coil winding structure and manufacturing process thereof
JPS62157309A (en) Electromagnetic transducer
JP3195060B2 (en) Method for manufacturing TAB tape
EP0516456A2 (en) Transformer with laminated printed winding coil
JP2003197430A (en) Laminated type sheet coil and transformer
JP2004259944A (en) Method for manufacturing inductance element
KR100207437B1 (en) A pliability coil winding structure of fbt and manufacture method therefore
KR950003861B1 (en) Making method for flat coils
JPS62159309A (en) Electromagnetic transducer
KR100207438B1 (en) A pliability coil winding structure of fbt and manufacture method therefore
JP2661280B2 (en) Tape carrier structure
JPH10178141A (en) Composite lead frame and its manufacturing method
JPH0567856A (en) Printed-wiring board and manufacture thereof
JP2000058599A (en) Manufacture of tab tape
JPH11149622A (en) Thin film magnetic head and manufacturing method thereof
JPH01128493A (en) Manufacture of multilayer interconnection substrate