JPS62158837U - - Google Patents

Info

Publication number
JPS62158837U
JPS62158837U JP1986046742U JP4674286U JPS62158837U JP S62158837 U JPS62158837 U JP S62158837U JP 1986046742 U JP1986046742 U JP 1986046742U JP 4674286 U JP4674286 U JP 4674286U JP S62158837 U JPS62158837 U JP S62158837U
Authority
JP
Japan
Prior art keywords
circuit board
film
board
inner lead
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986046742U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986046742U priority Critical patent/JPS62158837U/ja
Publication of JPS62158837U publication Critical patent/JPS62158837U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986046742U 1986-03-28 1986-03-28 Pending JPS62158837U (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986046742U JPS62158837U (it) 1986-03-28 1986-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986046742U JPS62158837U (it) 1986-03-28 1986-03-28

Publications (1)

Publication Number Publication Date
JPS62158837U true JPS62158837U (it) 1987-10-08

Family

ID=30866685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986046742U Pending JPS62158837U (it) 1986-03-28 1986-03-28

Country Status (1)

Country Link
JP (1) JPS62158837U (it)

Similar Documents

Publication Publication Date Title
JPS62158837U (it)
JPS62158836U (it)
JPH0268452U (it)
JPS62134254U (it)
JPS6013737U (ja) 半導体集積回路装置
JPS60106375U (ja) 外部リ−ド端子の取付構造
JPS6076067U (ja) フレキシブル回路板の接続構造
JPS6081664U (ja) 集積回路パツケ−ジ
JPS62158835U (it)
JPS5842940U (ja) 混成集積回路装置
JPS6245837U (it)
JPS62134240U (it)
JPS6151737U (it)
JPS6284970U (it)
JPS5963916U (ja) フレキシブルケ−ブル
JPS6289157U (it)
JPH01107155U (it)
JPH0341937U (it)
JPS6166955U (it)
JPS59171350U (ja) 半導体素子の実装構造
JPS59191742U (ja) 半導体装置
JPS60113645U (ja) ミニ・フラツト・パツケ−ジ
JPS6450447U (it)
JPH03124643U (it)
JPH01175883U (it)