JPS62158835U - - Google Patents
Info
- Publication number
- JPS62158835U JPS62158835U JP1986046740U JP4674086U JPS62158835U JP S62158835 U JPS62158835 U JP S62158835U JP 1986046740 U JP1986046740 U JP 1986046740U JP 4674086 U JP4674086 U JP 4674086U JP S62158835 U JPS62158835 U JP S62158835U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- film
- board
- wires
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986046740U JPS62158835U (pl) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986046740U JPS62158835U (pl) | 1986-03-28 | 1986-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62158835U true JPS62158835U (pl) | 1987-10-08 |
Family
ID=30866681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986046740U Pending JPS62158835U (pl) | 1986-03-28 | 1986-03-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62158835U (pl) |
-
1986
- 1986-03-28 JP JP1986046740U patent/JPS62158835U/ja active Pending