JPS62156930A - Ultrasonic wave bonding device - Google Patents

Abstract

PURPOSE:To provide an ultrasonic wave bonding device which has controlled wear of both of a horn and rest, by preventing mutual contact between the horn and rest by so constituting the titled device that the rest to be provided by corresponding to the horn is reciprocated along with the horn. CONSTITUTION:When a switch is turned ON by controlling a distance between a rest 2 and horn 4 by adjusting screws 11, 12 prior to actuation, along with actuation of an ultrasonic wave oscillator 1 the same descends between a clamp plate 17 and base 15 under a state wherein a wrapping material A is put upon the same. When the wrapping material A is supplied by a predetermined length, the wrapping material A is clamped between the clamp plate 17 and base 15 by actuating a cylinder 18. A driving device 13 is actuated under this state, the ultrasonic oscillator 1 and rest 2 are moved in a body and bonding of the wrapping material A is effected by an ultrasonic wave issued from the horn 4. As the horn 4 and rest 2 are actuated in a body and it does not happen that the horn 4 and rest 2 come into contact with each other in such a bonding action, wear of both of them is prevented.

Description

Detailed Description of the Invention 11 = <Industrial Application Field> The present invention is an ultrasonic bonding method used to manufacture bags by irradiating superposed packaging materials with ultrasonic waves and bonding them together. Regarding equipment.

<Conventional technology> When forming a bag from a packaging material such as a sheet made of mesh-like synthetic resin threads or a paper sheet, ultrasonic waves are irradiated onto the overlapping packaging material to generate intramolecular An ultrasonic bonding device is used that generates vibrations and generates heat to melt and bond.

FIG. 4 is a plan view of a conventional example of such an ultrasonic bonding device. A guide rail 42 is provided in parallel to the machine frame 41, and the ultrasonic oscillator 43 moves back and forth along the guide rail 42. A horn 44 that emits ultrasonic waves is attached to the left end of the ultrasonic oscillator 43, and its tip passes through a slide hole in a substrate 46 that supports the Kuranobo board 45 and faces the packaging material A. Further to the left side tζ of the horn 44, a horizontally elongated pedestal 47 attached to a mounting seat 49 is arranged, and the position of the pedestal 47 and the horn 44 is adjusted by a plurality of adjustment bolts 48 so as to maintain a constant distance. It has become so.

In the ultrasonic bonding device B, the stacked packaging materials A are fed from above the page and bonded. As the packaging material A is supplied, the board 46 advances toward the pedestal 41, and the packaging material A is clamped between the pedestal 47 and the clamp plate 45 attached to the board 46, and then the ultrasonic oscillator 43 moves to the guide rail. 42, and an adhesive line is formed on the packaging material A by the ultrasonic waves from the horn 44.

<Problems to be Solved by the Invention> In such an ultrasonic bonding device, it is necessary to adjust the distance between the horn 44 and the pedestal 47 to 0.1 to 0.2 mw1. It is difficult to uniformly adjust the position of the pedestal 47, and the position of the pedestal 47 tends to be misaligned, which causes the pedestal 47 to tilt. As a result, when the horn 44 moves back and forth, the tip of the horn 44 slides while contacting the pedestal 47.
(2) Both the cradle 47 are worn out. Especially horn 44
In contrast, if the hardness of the pedestal 47 is small, the pedestal 47 will wear out significantly. Furthermore, even if the position of the pedestal 47 has been properly adjusted, if the surface of the pedestal 47 is uneven, the distance between the horn 44 and the pedestal 47 is small, and the distance between the horn 44 and the pedestal 47 may be affected. Contact inevitably occurs. Therefore, in the conventional device, both the horn 44 and the pedestal 47 wear out quickly.
There was a problem of poor durability.

The present invention has been made in consideration of the above circumstances, and provides an ultrasonic bonding device in which wear of both the horn and the pedestal is suppressed.

<Means for solving the problem> The ultrasonic bonding device according to the present invention is configured such that a pedestal provided corresponding to the horn is moved back and forth in synchronization with the reciprocating movement of the horn, and the pedestal is configured to move back and forth in synchronization with the reciprocating movement of the horn. The special effects feature is that the pedestal, which is prone to wear, can be displaced in a direction orthogonal to the ultrasonic irradiation line, thereby suppressing the wear.

<Examples> The present invention will be specifically described below with reference to illustrative examples. FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a side view of the operating state. An ultrasonic oscillator 1 and a pedestal 2 are attached to each tip of a bifurcated connector 3. A vibrator (not shown) for performing ultrasonic vibration is mounted inside the ultrasonic oscillator 1, and a horn 4 connected to the vibrator protrudes from the tip of the ultrasonic oscillator 1.

The horn 4 is formed into a pointed shape, and the vibrations from the vibrator are magnified to emit ultrasonic waves. The pedestal 2 is attached to the connector 3 so as to be located on the opposite side of the packaging material A with respect to the horn 4. This pedestal 2 is attached to the connector 3 so as to be adjustable in the front and back and left and right directions, and is supported by support brackets 5 and 6. It consists of a rotating body 8 attached to a rotating body 7. The rotating body 8 is formed into a cylindrical shape, and receives ultrasonic waves from the horn 4 on its side surface. This rotating body 8 is rotatably attached to the axis 7, and rotates freely around the axis 7 during adhesion, so that the blood receiving the ultrasound waves changes as appropriate in the direction orthogonal to the ultrasound irradiation direction. It has become. Otsuo]
Since the entire side surface receives ultrasonic waves, wear of the rotating body 8 is suppressed. In particular, even if the horn comes into contact with the rotating body 8 due to poor adjustment of the distance between the horn and the horn 4, the contact action helps the rotating body 8 to rotate, so that wear of the rotating body 8 is suppressed. Incidentally, here, the distance between the pedestal 2 and the horn 4 is adjusted by the support brackets 1-5 and 6. oto's tv
The lower support bracket 5 attached to the lower support bracket 3 is formed with a long hole 9 extending in the direction of the horn 4, while the upper support bracket 1-6 attached to this lower support bracket 5 has a hole 9 extending in the direction perpendicular to the horn 4. A long hole 10 is formed. Adjustment screws 11.12 are attached to these elongated holes 9, 10, and each support bracket 5.6 is adjusted by moving left and right and front and back with respect to the horn 4, and the adjustment screws 11.12 are tightened. The position of the stand 2 is now adjusted.

A connector 3 for supporting the pedestal 2 and the ultrasonic oscillator 1 is connected to a port 14 of a driving means 13' consisting of a cylinder. Therefore, when the cylinder 13 is driven, the rod 14 expands and contracts, and the ultrasonic oscillator 1 and the pedestal 2 supported by the connector 3 reciprocate in synchronization and integrally. Thereby, the pedestal 2 always moves with the horn 4 while facing the horn 4, and receives the ultrasonic waves from the horn 4. With this structure, the pedestal 2 moves back and forth 17 integrally with the horn 4, and since the horn does not slide in contact with the surface of the pedestal as in conventional devices, contact between the horn and the pedestal is prevented. This prevents wear of both the horn 5 and the pedestal 2. In the figure, 1
Reference numeral 5 denotes a substrate, in which a slide hole 16 into which the horn 4 is slidably inserted is formed in the longitudinal direction. This board 15
A clamp plate 17 is provided on one side of the clamp plate 17 so as to be movable forward and backward.

That is, the clamp plate 17 is attached to the tip of the cylinder 18, and when the cylinder 18 is operated, it is pressed against the board 15 from above and below the slide hole 16 of the board 15.
The packaging material A is sandwiched between the substrate 15 and the packaging material A to prevent the packaging material A from vibrating during adhesion.

Next, the operation of the above ultrasonic bonding device will be explained with reference to FIG. Before operation, the distance between the pedestal 2 and the horn 4 is set to 0.1 to 0.2n+111 by adjusting the adjustment screws 11°12.
Adjust to the desired degree. After completing the adjustment, turn the switch ``
When set to ``ON'', the ultrasonic oscillator 1 is activated and the packaging material A is lowered between the clamp plate 17 and the substrate 15 in an overlapping state.

In this case, the packaging material A passes through another similarly configured ultrasonic bonding device and the edges on both sides are preliminarily bonded.
Supplied glued. When the packaging material A is supplied for a predetermined length, the cylinder 18 is activated to clamp the packaging material A between the clamp plate 17 and the substrate 15. In this state, the driving means 13 is activated j7, the ultrasonic oscillator 1 and the pedestal 2 are integrally moved 17, and the packaging material A is bonded by the ultrasonic waves from the horn 4. In such an adhesion operation, the horn 4 and the pedestal 2 operate integrally, and the horn 4 and the pedestal 2 do not come into contact with each other, so that wear of both is prevented.

Also, in this bonding operation, the rotating body 8 of the pedestal 2 rotates freely,
Wear of the pedestal 2 can be suppressed because the surface receiving the ultrasonic waves changes as it is orthogonal to the ultrasonic irradiation direction. In addition, in the bonding operation, an adhesive seal line and a cutting line are simultaneously formed by ultrasonic irradiation, and the stacked packaging materials A are bonded to each other to form a bag, and the cutting line is used as a boundary to form individual bags. separated into When the ultrasonic oscillator 1 and the pedestal 2 reach the end of their movement, the cylinder 18 is activated and the clamp on the packaging material A is released. This causes the bag to fall downward, and then
A predetermined length of the next packaging material A is supplied and clamped by the clamp plate 17 and the substrate 15, and the ultrasonic oscillator 9 and the pedestal 2 move in the opposite direction as one. Then, when Party B moves in the opposite direction, gluing and cutting are performed at the same time, and from then on,
Bags are manufactured continuously by performing a similar turning operation.

FIG. 3 is a perspective view of another embodiment of the cradle 2 applied to the present invention. The pedestal 2 has a horizontally long shaft 20 fixed to the upper end of the upper support bracket 6 to receive ultrasonic waves from the horn 4. The shaft body 20 can be slid laterally with respect to the horn 4, so that the part receiving the ultrasonic waves can be moved in a direction orthogonal to the ultrasonic irradiation direction as appropriate.
By making this change, the shaft body 20 can be used for a long period of time. This is made possible by sliding the upper support bracket 1-6 arbitrarily left and right into the elongated hole 10 formed in the upper support bracket 6, and tightening the adjustment screw 12.

Note that various modifications can be made to the present invention.

The ultrasonic oscillator and the pedestal may be attached to separate driving means, and the ultrasonic oscillator and the pedestal may be moved synchronously with a second actuator controlling the driving means. Alternatively, a motor may be used as the driving means. Furthermore, this ultrasonic bonding device can be used to manufacture bags! It can also be applied to the production of other molded bodies.

<Effects of the Invention> As described above, according to the present invention, the pedestal provided corresponding to the horn is moved back and forth together with the horn to prevent mutual contact between the horn and the pedestal. Reduce wear. Further, since the pedestal can be arbitrarily displaced during ultrasonic irradiation, wear of the pedestal can be effectively prevented.

Therefore, the durability is improved and it can be used for a long period of time without having to be replaced.

[Brief explanation of drawings]

Fig. 1 is a perspective view of one embodiment of the ultrasonic bonding device according to the present invention, Fig. 2 is a side view thereof, Fig. 3 is a perspective view of another embodiment, and Fig. 4 is a plan view of a conventional device. be.

Claims (3)

[Claims] (1) A horn that is attached to an ultrasonic oscillator that moves back and forth and irradiates ultrasonic waves to the stacked packaging materials; A horn that is installed on the opposite side of the packaging material to receive the ultrasonic waves from the horn; Ultrasonic bonding comprising a pedestal that moves back and forth in synchronization with the reciprocating movement of an ultrasonic oscillator, and the pedestal is configured to be displaceable in a direction perpendicular to the direction of ultrasonic irradiation. Device. (2) The ultrasonic bonding device according to claim (1), wherein the pedestal is a rotating body rotatably attached to an axis. (3) The ultrasonic bonding device according to claim (1), wherein the pedestal is a shaft body that can be slid in a direction perpendicular to the irradiation direction of the ultrasonic waves.