JPH0548738B2 - - Google Patents

Abstract

PURPOSE:To provide an ultrasonic wave bonding device which has controlled wear of both of a horn and rest, by preventing mutual contact between the horn and rest by so constituting the titled device that the rest to be provided by corresponding to the horn is reciprocated along with the horn. CONSTITUTION:When a switch is turned ON by controlling a distance between a rest 2 and horn 4 by adjusting screws 11, 12 prior to actuation, along with actuation of an ultrasonic wave oscillator 1 the same descends between a clamp plate 17 and base 15 under a state wherein a wrapping material A is put upon the same. When the wrapping material A is supplied by a predetermined length, the wrapping material A is clamped between the clamp plate 17 and base 15 by actuating a cylinder 18. A driving device 13 is actuated under this state, the ultrasonic oscillator 1 and rest 2 are moved in a body and bonding of the wrapping material A is effected by an ultrasonic wave issued from the horn 4. As the horn 4 and rest 2 are actuated in a body and it does not happen that the horn 4 and rest 2 come into contact with each other in such a bonding action, wear of both of them is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an ultrasonic bonding device used to manufacture bags by applying ultrasonic waves to stacked packaging materials and bonding them.

<Conventional technology> When forming a bag from a packaging material such as a sheet made of synthetic resin threads knitted in a mesh pattern or a paper sheet, ultrasonic waves are irradiated to the stacked packaging materials to generate intramolecular vibrations. An ultrasonic bonding device is used that generates heat to melt and bond.

FIG. 4 is a plan view of a conventional example of such an ultrasonic bonding device. A guide rail 42 is provided in parallel to the machine frame 41, and an ultrasonic oscillator 43 is connected to the guide rail 42.
It is designed to move back and forth along the At the left end of the ultrasonic oscillator 43 is a horn 4 that emits ultrasonic waves.
4 is attached, and its tip is attached to the clamp plate 45.
It passes through the slide hole of the substrate 46 supporting the packaging material A and faces the packaging material A. Further to the left of the horn 44, a horizontally elongated pedestal 47 attached to a mounting seat 49 is arranged, and a plurality of adjustment bolts 48 are used to position the pedestal 47 and the horn 44 at a constant distance. It's starting to get adjusted.

This ultrasonic bonding device performs bonding by supplying overlapping packaging materials A from above the plane of the paper. As the packaging material A is supplied, the board 46 advances toward the pedestal 41, the packaging material A is clamped between the pedestal 47 and the clamp plate 45 attached to the board 46, and then the ultrasonic oscillator 43 The packaging material A is slid along the guide rail 42 and is
An adhesive line is formed.

<Problems to be Solved by the Invention> In such an ultrasonic bonding device, it is necessary to adjust the distance between the horn 44 and the pedestal 47 to 0.1 to 0.2 mm, but it is necessary to adjust all the adjustment bolts 48 uniformly. It is difficult to adjust the position of the pedestal 47, and the position of the pedestal 47 is easily misaligned.
A slope occurs. As a result, when the horn 44 moves back and forth, the tip of the horn 44 slides while contacting the pedestal 47, causing both the horn 44 and the pedestal 47 to wear out. In particular, since the hardness of the pedestal 47 is lower than that of the horn 44, the pedestal 47 is significantly worn. Furthermore, even if the position of the pedestal 47 has been properly adjusted, if the surface of the pedestal 47 is uneven, the distance between the horn 44 and the pedestal 47 is small, and the distance between the horn 44 and the pedestal 47 may be affected. Contact inevitably occurs.
Therefore, in the conventional device, there was a problem in that both the horn 44 and the pedestal 47 wore out early, resulting in poor durability.

The present invention has been made in consideration of the above circumstances, and provides an ultrasonic bonding device in which wear of both the horn and the pedestal is suppressed.

<Means for Solving the Problems> The ultrasonic bonding device according to the present invention is configured such that a pedestal provided corresponding to the horn moves back and forth in synchronization with the reciprocating movement of the horn, so that the horn and the pedestal can be connected to each other. The present invention is characterized in that the pedestal, which is prone to wear, is movable in a direction perpendicular to the ultrasonic irradiation line, thereby suppressing the wear.

<Examples> The present invention will be specifically described below with reference to illustrative examples. FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a side view of the operating state. An ultrasonic oscillator 1 and a pedestal 2 are attached to each tip of a bifurcated connector 3. A vibrator (not shown) for performing ultrasonic vibration is mounted inside the ultrasonic oscillator 1, and a horn 4 connected to the vibrator protrudes from the tip of the ultrasonic oscillator 1. The horn 4 is formed into a pointed shape, and the vibrations from the vibrator are magnified to generate ultrasonic waves. The pedestal 2 is attached to the connector 3 so as to be located on the opposite side of the packaging material A with respect to the horn 4. This pedestal 2 is supported by support brackets 5 and 6 that are attached to the connector 3 so as to be adjustable in the front and rear and left and right directions. It consists of a rotating body 8 attached to. Rotating body 8
is formed into a cylindrical shape, and receives ultrasonic waves from the horn 4 on its side. This rotary body 8 is rotatably attached to the axis 7, and freely rotates around the axis 7 during adhesion operation, so that the surface receiving the ultrasonic waves changes as appropriate in the direction perpendicular to the ultrasonic irradiation direction. It's getting old. As a result, wear of the rotating body 8 is suppressed since the entire side surface receives ultrasonic waves. In particular, even if the horn comes into contact with the rotary body 8 due to poor adjustment of the distance between the horn and the horn 4, the rotation of the rotary body 8 is assisted by the contact action.
wear is suppressed. Incidentally, the distance between the pedestal 2 and the horn 4 is adjusted here by means of the support brackets 5 and 6. For this purpose, the lower support bracket 5 attached to the connector 3 is formed with a long hole 9 extending in the direction of the horn 4, while the upper support bracket 6 attached to the lower support bracket 5 is formed with a long hole 9 extending in the direction of the horn 4.
A long hole 10 is formed in the direction perpendicular to the horn 4. Adjustment screws 11 and 12 are attached to these elongated holes 9 and 10, and the support brackets 5 and 6 are adjusted by moving left and right and front and back with respect to the horn 4, and by tightening the adjustment screws 11 and 12, the support brackets 5 and 6 are adjusted. The position of the stand 2 is now adjusted.

The connector 3 that supports the pedestal 2 and the ultrasonic oscillator 1 is equipped with a driving means 13 consisting of a cylinder.
The rods 14 are connected. Therefore, when the cylinder 13 is driven, the rod 14 expands and contracts, and the ultrasonic oscillator 1 and the pedestal 2 supported by the connector 3 reciprocate in unison in synchronization. Thereby, the pedestal 2 always moves with the horn 4 while facing the horn 4, and receives the ultrasonic waves from the horn 4. With this structure, the pedestal 2 moves back and forth integrally with the horn 4, and the horn does not slide while in contact with the surface of the pedestal as in conventional devices, so there is no contact between the horn and the pedestal. This eliminates wear on both the horn and the pedestal 2. In the figure, 15 is a board, and a horn 4
A slide hole 16 into which is slidably inserted is formed in the longitudinal direction. A clamp plate 17 is provided on one side of the substrate 15 so as to be movable forward and backward. That is, the clamp plate 17 is attached to the tip of the rod of the cylinder 18, and
When activated, the slide hole 16 of the substrate 15 is pressed against the substrate 15 from above and below, the packaging material A is sandwiched between the substrate 15 and the packaging material A is prevented from vibrating during adhesion. There is.

Next, the operation of the above ultrasonic bonding device will be explained with reference to FIG. Before operation, adjust screw 1
1 and 12, the distance between the pedestal 2 and the horn 4 is
Adjust so that it is about 0.1 to 0.2 mm. After completing the adjustment, turn on the switch to turn on the ultrasonic oscillator 1.
is activated, and the packaging material A is lowered between the clamp plate 17 and the substrate 15 in an overlapping state.
In this case, the packaging material A is passed through another similarly configured ultrasonic bonding device to be supplied with both side edge portions bonded in advance. When the packaging material A is supplied for a predetermined length, the cylinder 18 is activated to clamp the packaging material A between the clamp plate 17 and the substrate 15. In this state, the driving means 13 is activated, the ultrasonic oscillator 1 and the pedestal 2 move together, and the packaging material A is bonded by the ultrasonic waves from the horn 4. In such an adhesion operation, the horn 4 and the pedestal 2 operate integrally, and since the horn 4 and the pedestal 2 do not come into contact with each other, abrasion of both is prevented. Also, in this bonding operation, the rotating body 8 of the pedestal 2
rotates freely, and the surface receiving the ultrasonic waves changes as it is perpendicular to the ultrasonic irradiation direction, so wear of the pedestal 2 is suppressed. In addition, during the bonding operation, an adhesive seal line and a cutting line are simultaneously formed by ultrasonic irradiation.
The stacked packaging materials A are adhered to each other to form a bag, and are separated into individual bags along the cutting line. When the ultrasonic oscillator 1 and the pedestal 2 reach the end of their movement, the cylinder 18 is actuated to release the packaging material A.
clamp is released. As a result, the bag falls downward, and then the next packaging material A is supplied to a predetermined length and is clamped by the clamp plate 17 and the substrate 15, and the ultrasonic oscillator 9 and the pedestal 2 are move in opposite directions as one. Then, during this reverse movement, adhesion and cutting are performed at the same time, and thereafter, the same repeated operations are performed to continuously manufacture bags.

FIG. 3 is a perspective view of another embodiment of the cradle 2 applied to the present invention. This pedestal 2 has a horizontally long shaft body 20
is fixed to the upper end of the upper support bracket 6 to receive ultrasonic waves from the horn 4. The shaft 20 can be slid laterally with respect to the horn 4, and the shaft 20 can be used for a long time by appropriately changing the part that receives the ultrasonic waves in a direction perpendicular to the direction of ultrasonic irradiation. It's becoming possible. This is made possible by sliding the upper support bracket 6 arbitrarily left and right through the elongated hole 10 formed in the upper support bracket 6, and tightening the adjustment screw 12.

Note that various modifications can be made to the present invention. The ultrasonic oscillator and the pedestal may be attached to separate drive means and moved synchronously by controlling the drive means. Alternatively, a motor may be used as the driving means. Furthermore, this ultrasonic bonding device can be applied not only to the production of bags but also to the production of other molded bodies.

<Effects of the Invention> As described above, according to the present invention, the pedestal provided corresponding to the horn is moved back and forth together with the horn to prevent mutual contact between the horn and the pedestal. Wear is suppressed. or,
Since the pedestal can be arbitrarily displaced during ultrasonic irradiation, wear of the pedestal can be effectively prevented. Therefore, the durability is improved and it can be used for a long period of time without requiring replacement.

[Brief explanation of drawings]

Fig. 1 is a perspective view of one embodiment of the ultrasonic bonding device according to the present invention, Fig. 2 is a side view thereof, Fig. 3 is a perspective view of another embodiment, and Fig. 4 is a plan view of a conventional device. be. 1... Ultrasonic oscillator, 4... Horn, 2... cradle.

Claims (1)

[Claims] 1. Attached to an ultrasonic oscillator that moves back and forth,
A horn that irradiates ultrasonic waves to the stacked packaging materials; and a horn that is provided on the opposite side of the packaging material to receive the ultrasound waves from the horn, and that moves back and forth in synchronization with the reciprocation of the ultrasonic oscillator. An ultrasonic bonding device comprising: a pedestal, the pedestal being configured to be movable in a direction orthogonal to an irradiation direction of ultrasonic waves. 2. The ultrasonic bonding device according to claim 1, wherein the pedestal is a rotating body rotatably attached to an axis. 3. The ultrasonic bonding device according to claim 1, wherein the pedestal is a shaft body that can be slid in a direction perpendicular to the irradiation direction of the ultrasonic waves.