JPS62151777U - - Google Patents
Info
- Publication number
- JPS62151777U JPS62151777U JP4036486U JP4036486U JPS62151777U JP S62151777 U JPS62151777 U JP S62151777U JP 4036486 U JP4036486 U JP 4036486U JP 4036486 U JP4036486 U JP 4036486U JP S62151777 U JPS62151777 U JP S62151777U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- test coupon
- cut groove
- passing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036486U JPS62151777U (xx) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036486U JPS62151777U (xx) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151777U true JPS62151777U (xx) | 1987-09-26 |
Family
ID=30854392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4036486U Pending JPS62151777U (xx) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151777U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019069709A1 (ja) * | 2017-10-05 | 2019-04-11 | ソニー株式会社 | 基板、製造方法、及び、電子機器 |
-
1986
- 1986-03-18 JP JP4036486U patent/JPS62151777U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019069709A1 (ja) * | 2017-10-05 | 2019-04-11 | ソニー株式会社 | 基板、製造方法、及び、電子機器 |
| US11757053B2 (en) | 2017-10-05 | 2023-09-12 | Sony Corporation | Package substrate having a sacrificial region for heat sink attachment |