JPS62151774U - - Google Patents
Info
- Publication number
- JPS62151774U JPS62151774U JP1986039236U JP3923686U JPS62151774U JP S62151774 U JPS62151774 U JP S62151774U JP 1986039236 U JP1986039236 U JP 1986039236U JP 3923686 U JP3923686 U JP 3923686U JP S62151774 U JPS62151774 U JP S62151774U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light source
- substrate
- emitting diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Laser Beam Printer (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
第１図ａ，ｂは本考案実施例の線状光源の断面
図で第２図はその回路図、第３図ａ，ｂ，ｃは照
光状態を示す図である。 １……基板、２，２……発光ダイオード、３…
…反射枠、３１，３１……透孔、４……レンズ体
、５，５，５′……抵抗。
図で第２図はその回路図、第３図ａ，ｂ，ｃは照
光状態を示す図である。 １……基板、２，２……発光ダイオード、３…
…反射枠、３１，３１……透孔、４……レンズ体
、５，５，５′……抵抗。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 基板と、基板上に整列して設けられた複数
の発光ダイオードと、発光ダイオードを一体に囲
むように基板に固着された反射枠と、発光ダイオ
ードの列と略一致する方向に中心方向を有し発光
ダイオードの上方に配置された円柱状のレンズ体
と、発光ダイオードの給電路に設けられた抵抗と
を具備した線状光源において、前記発光ダイオー
ドは列の両端に位置するものが略中央に位置する
発光ダイオードに流れる電流より大きい電流が流
れるよう抵抗と直列接続されている事を特徴とす
る線状光源。 (2) 前記レンズ体はその両端が前記反射枠に設
けられた孔に嵌合されている事を特徴とする前記
実用新案登録請求の範囲第１項記載の線状光源。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039236U JPH0749818Y2 (ja) | 1986-03-18 | 1986-03-18 | 線状光源 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039236U JPH0749818Y2 (ja) | 1986-03-18 | 1986-03-18 | 線状光源 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62151774U true JPS62151774U (ja) | 1987-09-26 |
| JPH0749818Y2 JPH0749818Y2 (ja) | 1995-11-13 |
Family
ID=30852223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986039236U Expired - Lifetime JPH0749818Y2 (ja) | 1986-03-18 | 1986-03-18 | 線状光源 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749818Y2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5287747B2 (ja) * | 2010-01-29 | 2013-09-11 | 豊田合成株式会社 | 線状光源装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148982A (ja) * | 1984-08-17 | 1986-03-10 | Oki Electric Ind Co Ltd | 発光ダイオ−ドによる照明方式 |
-
1986
- 1986-03-18 JP JP1986039236U patent/JPH0749818Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6148982A (ja) * | 1984-08-17 | 1986-03-10 | Oki Electric Ind Co Ltd | 発光ダイオ−ドによる照明方式 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749818Y2 (ja) | 1995-11-13 |