JPS62151729U - - Google Patents
Info
- Publication number
- JPS62151729U JPS62151729U JP3997586U JP3997586U JPS62151729U JP S62151729 U JPS62151729 U JP S62151729U JP 3997586 U JP3997586 U JP 3997586U JP 3997586 U JP3997586 U JP 3997586U JP S62151729 U JPS62151729 U JP S62151729U
- Authority
- JP
- Japan
- Prior art keywords
- sided adhesive
- wafer support
- frame
- transport frame
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3997586U JPS62151729U (US07655688-20100202-C00109.png) | 1986-03-17 | 1986-03-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3997586U JPS62151729U (US07655688-20100202-C00109.png) | 1986-03-17 | 1986-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62151729U true JPS62151729U (US07655688-20100202-C00109.png) | 1987-09-26 |
Family
ID=30853644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3997586U Pending JPS62151729U (US07655688-20100202-C00109.png) | 1986-03-17 | 1986-03-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62151729U (US07655688-20100202-C00109.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230246A (ja) * | 1987-11-06 | 1989-09-13 | Tel Sagami Ltd | 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート |
JP2018114575A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ドレッシングボード、切削ブレードのドレッシング方法及び切削装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194351A (ja) * | 1982-02-19 | 1983-11-12 | プレシジョン・モノリシックス・インコ−ポレ−テッド | 集積回路デバイスを探知する装置並びに方法 |
-
1986
- 1986-03-17 JP JP3997586U patent/JPS62151729U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58194351A (ja) * | 1982-02-19 | 1983-11-12 | プレシジョン・モノリシックス・インコ−ポレ−テッド | 集積回路デバイスを探知する装置並びに方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01230246A (ja) * | 1987-11-06 | 1989-09-13 | Tel Sagami Ltd | 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート |
JP2018114575A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ドレッシングボード、切削ブレードのドレッシング方法及び切削装置 |